Heat transfer assembly for a heat emitting device

Patent metadata

Field	Value
Publication number	US-2018366391-A1
Application number	US-201715627477-A
Country	US
Kind code	A1
Filing date	Jun 20, 2017
Priority date	Jun 20, 2017
Publication date	Dec 20, 2018
Grant date	—

Abstract

A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.

First claim

1 . A heat transfer assembly coupled to a heat emitting device for dissipating heat from the heat emitting device, the heat transfer assembly comprising:
a module inlet for receiving a coolant; at least one module comprising a first part having a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion; a sealing component disposed between the heat emitting device and the at least one module; a module outlet for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, wherein the at least one module is connected to the module inlet and the module outlet,
wherein the second part allows a uniform compression of the seal component, and wherein the first part and the second part are mechanically connected to each other.

2 . The heat transfer assembly of claim 1 wherein the coolant is at least one of a single phase coolant or a phase change coolant.

3 . The heat transfer assembly of claim 1 wherein the shaped cutout portion and the solid portion in the second part enable a four-point bending for uniform compression of the sealing component.

4 . The heat transfer assembly of claim 1 comprising a plurality of modules arranged in a symmetrical layout to allow a symmetrical flow of the coolant in the heat transfer assembly.

5 . The heat transfer assembly of claim 3 further comprising an assembly inlet for receiving the coolant, wherein the symmetrical layout provides flow direction for the coolant to enter each of the plurality of modules; and an assembly outlet for discharging the heat absorbed coolant received from the plurality of modules, wherein the assembly inlet and the assembly outlet are connected to the module inlet and the module outlet of each module of the plurality of the modules through a distributed tubing.

6 . The heat transfer assembly of claim 1 wherein the first part and the second part are integrated as a single unit.

7 . The heat transfer assembly of claim 1 , wherein the first part and the second part use a snap fit configuration to mechanically connect with each other.

8 . The heat transfer assembly of claim 1 wherein the at least one module is made from at least one of a polymer material or a composite material.

9 . The heat transfer assembly of claim 1 wherein the portion of the heat emitting device is bolted to the at least one module using a plurality of bolts, wherein each bolt passes through the first part and the second part.

10 . The heat transfer assembly of claim 1 wherein the at least one module is flexible to achieve a convex curvature for load balance for leak-proof sealing.

11 . The heat transfer assembly of claim 1 wherein the second part is flexible to achieve a concave curvature for load balance for leak-proof sealing.

12 . The heat transfer assembly of claim 1 further comprising a third part, wherein the second part is disposed between the first part and the third part, and wherein the third part is a mirror of the first part.

13 . The heat transfer assembly of claim 12 wherein the portion of the heat emitting device is bolted to the at least one module, wherein each bolt passes through the first part, the second part, and the third part.

14 . The heat transfer assembly of claim 1 wherein the heat emitting device is a power converter.

15 . The heat transfer assembly of claim 14 wherein the power converter comprises silicon carbide switches.

Assignees

• Gen Electric

Inventors

• Waddell Alistair Martin
• Chan Mark Aaron Chan
• Schroeder Stefan

Classifications

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• G06F1/20

  Cooling means · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H01L23/473 Primary

  Electricity · mapped topic