Integrated fan-out package having multi-band antenna and method of forming the same

Patent metadata

Field	Value
Publication number	US-2018366347-A1
Application number	US-201715627457-A
Country	US
Kind code	A1
Filing date	Jun 20, 2017
Priority date	Jun 20, 2017
Publication date	Dec 20, 2018
Grant date	—

Abstract

An integrated fan-out package having a multi-band antenna and a method of forming the same are disclosed. An integrated fan-out package includes a semiconductor die, a molding layer and a plurality of through integrated fan-out vias. The molding layer is aside the semiconductor die. The through integrated fan-out vias are through the molding layer and arranged to form a plurality of dipole antennas. At least one of the plurality of dipole antennas includes two dipole arms each having a transmitting strip and a radiating strip connected to the transmitting part, and the radiating strip has a first part, a second part and a filter part between and in contact with the first part and the second part. The cross-sectional area of the filter part is less than the cross-sectional area of the first part or the second part of the radiating strip.

First claim

What is claimed is:

1 . An integrated fan-out package having a multi-band antenna, comprising:
a semiconductor die; a molding layer aside the semiconductor die; and a plurality of through integrated fan-out vias through the molding layer and arranged to form a plurality of dipole antennas, wherein at least one of the plurality of dipole antennas comprises two dipole arms each having a transmitting strip and a radiating strip connected to the transmitting strip, and the radiating strip has a first part, a second part and a filter part between and in contact with the first part and the second part, wherein a cross-sectional area of the filter part is less than a cross-sectional area of the first part or the second part of the radiating strip.

2 . The integrated fan-out package of claim 1 , wherein the filter part of the radiating strip has at least one void therein.

3 . The integrated fan-out package of claim 2 , wherein the at least one void penetrates through the filter part of the radiating strip.

4 . The integrated fan-out package of claim 2 , wherein the molding layer fills in the at least one void in the filter part of the radiating strip.

5 . The integrated fan-out package of claim 1 , wherein the filter part of the radiating strip has at least one recess on a sidewall thereof.

6 . The integrated fan-out package of claim 1 , wherein the radiating strip further has another filter part and a third part, and the another filter part is between and in contact with the second part and the third part.

7 . The integrated fan-out package of claim 1 , further comprising a first redistribution layer structure at a first side of the semiconductor die and arranged to form a patch antenna ground.

8 . The integrated fan-out package of claim 7 , further comprising at least one patch antenna at the first side of the semiconductor die and over the patch antenna ground.

9 . The integrated fan-out package of claim 8 , wherein the patch antenna has a first region, a second region and a filter region between and in contact with the first region and the second region, and wherein the filter region of the patch antenna has at least one void therein.

10 . The integrated fan-out package of claim 9 , wherein the second region surrounds the filter region of the patch antenna.

11 . The integrated fan-out package of claim 9 , wherein the at least one void penetrates through the filter region of the patch antenna.

12 . An integrated fan-out package having a multi-band antenna, comprising:
a semiconductor die; a molding layer aside the semiconductor die; and a plurality of first through integrated fan-out vias through the molding layer and arranged to form a plurality of first dipole antennas; and a plurality of second through integrated fan-out vias through the molding layer and arranged to form a plurality of second dipole antennas, wherein an operating frequency band of the first dipole antennas is different from an operating frequency band of the second dipole antennas, and the first dipole antennas and the second dipole antennas are in a staggered arrangement.

13 . The integrated fan-out package of claim 12 , wherein the first dipole antennas surround the second dipole antennas, and the operating frequency band of the first dipole antennas is greater than the operating frequency band of the second dipole antennas.

14 . The integrated fan-out package of claim 12 , wherein at least one of the first and second dipole antennas comprises two dipole arms each having a transmitting strip and a radiating strip connected to the transmitting strip, and the radiating strip has a first part, a second part and a filter part between and in contact with the first part and the second part, and wherein a cross-sectional area of the filter part is less than a cross-sectional area of the first part or the second part of the radiating strip.

15 . The integrated fan-out package of claim 14 , wherein the filter part of the radiating strip has at least one void therein.

16 . The integrated fan-out package of claim 12 , further comprising a first redistribution layer structure at a first side of the semiconductor die and arranged to form a patch antenna ground.

17 . The integrated fan-out package of claim 16 , further comprising at least one patch antenna at the first side of the semiconductor die and over the patch antenna ground.

18 . The integrated fan-out package of claim 17 , wherein the patch antenna has a first region, a second region and a filter region between and in contact with the first region and the second region, and wherein the filter region of the patch antenna has at least one void therein.

19 . The integrated fan-out package of claim 18 , wherein the second region surrounds the filter region of the patch antenna.

20 . A method of forming an integrated fan-out package having a multi-band antenna, comprising:
providing a semiconductor die; forming a plurality of through integrated fan-out vias aside the semiconductor die, wherein forming the through integrated fan-out vias comprises forming a plurality of dipole antennas; and forming a molding layer surrounding the through integrated fan-out vias.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chuang Nan-Chin
• Yang Ching-Feng
• Wu Kai-Chiang

Classifications

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W44/248

  for antennas · CPC title

• H10W72/07307

  the auxiliary member being a temporary substrate, e.g. a removable substrate · CPC title