Heat-resistant insulated wire and electrodeposition liquid used to form insulating layer therefor

Patent metadata

Field	Value
Publication number	US-2018366241-A1
Application number	US-201516060715-A
Country	US
Kind code	A1
Filing date	Dec 16, 2015
Priority date	Dec 16, 2015
Publication date	Dec 20, 2018
Grant date	—

Abstract

The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 μm from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.

First claim

1 . A heat-resistant insulated wire comprising:
a heat-resistant insulating layer containing heat-resistant particles, wherein the heat-resistant particles are densely dispersed in a surface region of the insulating layer.

2 . The heat-resistant insulated wire according to claim 1 ,
wherein the heat-resistant particles are densely dispersed in a region having a thickness of 0.5 μm from the surface of the insulating layer.

3 . The heat-resistant insulated wire according to claim 1 ,
wherein a concentration of the heat-resistant particles included in the region having a thickness of 0.5 μm from the surface of the insulating layer is two times or more a concentration of heat-resistant particles included in a central portion of the insulating layer in a thickness direction.

4 . An electrodeposition liquid for forming an insulating layer, used for forming the insulating layer of the insulated wire according to claim 1 ,
wherein the heat-resistant particles are dispersed in a suspension in which resin particles are dispersed, with a viscosity of 100 cP or less and a turbidity of 1 mg/L or more.

5 . The electrodeposition liquid for forming an insulating layer according to claim 4 , an amount of the resin particles is 1 to 30% by mass and an amount of the heat-resistant particles is 1 to 100 parts by mass with respect to 100 parts by mass of the resin particles.

6 . The electrodeposition liquid for forming an insulating layer according to claim 4 ,
wherein an average particle diameter of the resin particles is 1 μm or less and an average particle diameter of the heat-resistant particles is 500 nm or less.

7 . The electrodeposition liquid for forming an insulating layer according to claim 4 , which forms an insulating layer in which a cut through temperature increasing rate of the insulating layer is 1.2 or more.

8 . The electrodeposition liquid for forming an insulating layer according to claim 5 ,
wherein the resin particles are an acrylic resin, a polyesterimide resin, a polyimide resin, or a polyamideimide resin.

9 . The electrodeposition liquid for forming an insulating layer according to claim 5 ,
wherein the heat-resistant particles are at least one kind of metal oxide fine particles or silica fine particles.

Assignees

• Mitsubishi Materials Corp

Inventors

• Iida Shintaro
• Izumi Reiko
• Sakurai Hideaki
• HAYASHII Ken
• Ashida Keiko

Classifications

• C09D7/61

  inorganic · CPC title

• C09D7/68

  Particle size between 100-1000 nm · CPC title

• C09D7/67

  Particle size smaller than 100 nm · CPC title

• C08K3/36

  Silica · CPC title

• C08K2003/2244

  of zirconium · CPC title