DMD Assembly And DLP Projection Device

Patent metadata

Field	Value
Publication number	US-2018356628-A1
Application number	US-201816107614-A
Country	US
Kind code	A1
Filing date	Aug 21, 2018
Priority date	Oct 31, 2016
Publication date	Dec 13, 2018
Grant date	—

Abstract

The DMD assembly in present disclosure includes a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side; a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.

First claim

1 . A DMD assembly comprising:
a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side, wherein: a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.

2 . The DMD assembly according to claim 1 , wherein the fixing portion comprises a turning portion and a supporting portion, one end of the supporting portion is connected with the fixing frame and another end of the supporting portion is connected with the turning portion, wherein the turning portion extends to from the another end of the supporting portion to an axis of the insertion hole, and the pressing portion is positioned on a side of the turning portion facing the driver board.

3 . The DMD assembly according to claim 1 , wherein the elastic protrusion is integrally molded with the fixing frame.

4 . The DMD assembly according to claim 1 , wherein an interference contact is positioned between a surface of the pressing portion facing the chip substrate and a surface of the chip substrate.

5 . The DMD assembly according to claim 4 , wherein:
the surface of the chip substrate facing the pressing portion is an upper surface of the chip substrate where the DMD chip is mounted.

6 . The DMD assembly according to claim 1 , wherein:
the driver board is on a third side of the base opposite to the second side, the fixing frame includes a first through hole and the driver board includes a second through hole whose position corresponds to the position of the first through hole; and a first fastener fixes the driver board and the fixing frame through the first through hole and the second through hole.

7 . The DMD assembly according to claim 6 , wherein:
a first locating column is positioned on a side of the driver board where the driver board is attached to the fixing frame; and the fixing frame includes a first locating hole, and the first locating hole matches the first locating column.

8 . The DMD assembly according to claim 1 , wherein: the driver board is on a third side of the base opposite to the second side, the fixing frame includes a first through and the driver board includes a second through hole; and
the DMD assembly further comprises a mounting plate on a fourth side of the driver board opposite to the first side, and the mounting plate is provided with a third through hole, whose position corresponds to the position of the first through hole and the second through hole; and a second fastener fixes the mounting plate, the driver board and the fixing frame together through the first through hole, the second through hole and the third through hole.

9 . The DMD assembly according to claim 8 , wherein a second locating column is provided on a side of the mounting plate where the mounting plate is attached to the driver board; the driver board is provided a second locating hole, the fixing frame includes a third locating hole, and the second locating hole and the third locating hole match the second locating column together.

10 . The DMD assembly according to claim 9 , wherein the third side of the base includes a third locating column, the driver board includes a fourth locating hole, and the fourth locating hole matches the third locating column.

11 . The DMD assembly according to claim 1 , wherein a side wall of the mounting groove includes an elastic stopper, and the elastic stopper abuts an edge of the chip substrate to confine a position of the chip substrate.

12 . A DLP projection device, comprising:
a DMD assembly, wherein the DMD assembly comprises: a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with the driver board on the first side, wherein: a second side of the base away from the driver board includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the insertion hole and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.

Assignees

• Hisense Co Ltd
• Hisense Usa Cororation
• Hisense Int Co Ltd

Inventors

• Hou Naiwen
• Tian Xintuan
• Yang Changming

Classifications

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/237

  attached to additional arrangements for cooling · CPC title

• H10W40/235

  attached to package parts · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/611

  Bolts or screws · CPC title