Dynamic Quantity Measuring Apparatus

Patent metadata

Field	Value
Publication number	US-2018356302-A1
Application number	US-201615761732-A
Country	US
Kind code	A1
Filing date	Jul 29, 2016
Priority date	Sep 30, 2015
Publication date	Dec 13, 2018
Grant date	—

Abstract

The purpose of the present invention is to provide a strain sensor module structure having exceptional strain measurement accuracy and suppressing sensor output variation caused by moisture absorbed by a plastic member used as an electrical wiring member, etc., in a strain sensor module. The dynamic quantity measuring apparatus is characterized in having a strain sensor formed by a plurality of piezoelectric resistance elements and electrode pads on the surface of a semiconductor substrate, an electrical wiring plastic member provided with a plurality of wires that electrically connect to the plurality of electrode pads, a strain body joined to the rear surface of the strain sensor, and a bonding part via which the electrical wiring plastic member and strain body are affixed together; a groove being provided in an area of the electrical wiring plastic body that is near the strain sensor.

First claim

1 . A dynamic quantity measuring apparatus comprising:
a strain sensor having a plurality of piezoresistance elements and a plurality of electrode pads formed on a surface of a semiconductor substrate, a resin member for electrical wiring, provided with a plurality of wires electrically connected to the plurality of electrode pads; a strain body joined to a back surface of the strain sensor; and a bonding portion configured to bond the resin member for electrical wiring to the strain body, wherein a groove is provided in a region of the resin member for electrical wiring located in a vicinity of the strain sensor.

2 . The dynamic quantity measuring apparatus according to claim 1 , wherein
a longitudinal direction of a groove provided in the resin member for electrical wiring is formed in a direction perpendicular to the strain sensor.

3 . The dynamic quantity measuring apparatus according to claim 1 , wherein
a groove is also provided in a region of the bonding portion located in the vicinity of the strain sensor.

4 . The dynamic quantity measuring apparatus according to claim 3 , wherein
a longitudinal direction of the groove provided in the bonding portion is formed in a direction perpendicular to the strain sensor.

5 . The dynamic quantity measuring apparatus according to claim 1 , wherein
the groove provided in the resin member for electrical wiring has a slit shape completely penetrating the resin member, or the groove provided in the bonding portion has a slit shape completely penetrating the bonding portion.

6 . The dynamic quantity measuring apparatus according to claim 1 , wherein
the groove provided in the resin member for electrical wiring reaches an end portion of the resin member for electrical wiring located in the vicinity of the strain sensor, and an end portion of the resin member for electrical wiring has a shape like a comb tooth.

7 . The dynamic quantity measuring apparatus according to claim 1 , wherein
the resin member for electrical wiring is formed in a region in the vicinity of each of four sides of the strain sensor, and a groove is provided in a region in the vicinity of each of four sides.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Ashida Kisho
• Soma Atsuo

Classifications

• G01B7/18

  using change in resistance · CPC title

• G01L9/0055

  bonded on a diaphragm · CPC title

• G01L1/18 Primary

  using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title