Manufacturing method of three-dimensional heat conducting structure

Patent metadata

Field	Value
Publication number	US-2018356162-A1
Application number	US-201816107877-A
Country	US
Kind code	A1
Filing date	Aug 21, 2018
Priority date	May 25, 2015
Publication date	Dec 13, 2018
Grant date	—

Abstract

A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.

First claim

What is claimed is:

1 . A manufacturing method of a three-dimensional heat conducting structure, comprising:
Step (a) providing a vapor chamber having at least one insert hole; Step (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; Step (c) providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and Step (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.

2 . The manufacturing method of a three-dimensional heat conducting structure as claimed in claim 1 , wherein in Step (a), the vapor chamber has a rim formed around the periphery of the insert hole and protruded from the outer surface of the vapor chamber.

3 . The manufacturing method of a three-dimensional heat conducting structure as claimed in claim 2 , wherein in Step (c), the support ring is sheathed on the rim of the vapor chamber, and an inner wall surface of the support ring is in contact with an outer wall surface of the rim.

4 . The manufacturing method of a three-dimensional heat conducting structure as claimed in claim 1 , wherein in Step (c), the support ring has a chamfer disposed on a side adjacent to the heat pipe.

5 . The manufacturing method of a three-dimensional heat conducting structure as claimed in claim 4 , wherein in Step (d), the soldering means includes a solder, and the solder stays between the chamfer and an outer surface of the heat pipe without overflowing to a surface of the vapor chamber.

Assignees

• Cooler Master Co Ltd

Inventors

• Sun Chien-Hung
• Liu lei-lei

Classifications

• F28D15/0275 Primary

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• B23K37/06

  for positioning the molten material, e.g. confining it to a desired area · CPC title

• B23K1/18

  circumferential seams, e.g. of shells · CPC title

• F28F2275/06

  by welding · CPC title