Value or security document from a fibre composite material and method for producing the value or security document

Patent metadata

Field	Value
Publication number	US-2018330221-A1
Application number	US-201615775833-A
Country	US
Kind code	A1
Filing date	Nov 11, 2016
Priority date	Nov 12, 2015
Publication date	Nov 15, 2018
Grant date	—

Abstract

The mechanically stable value or security document 2000 according to the invention comprising an electric circuit 1270 is characterised by the following features: the document is formed of at least three document layers which are arranged in a stack 1700 and which are connected together face-to-face by a joining method, wherein a first document layer is formed by a circuit carrier layer 1200 which supports the electric circuit 1270, at least one second document layer is formed in each case by a compensation layer 1100 which has at least one opening 1120 and/or recess, and at least one third document layer is formed in each case by an outer cover layer 1300. The first 1200, the at least one second 1100, and the at least one third document layer 1300 are formed from a fibre composite material.

First claim

1 . A value or security document ( 2000 ) comprising an electric circuit ( 1270 ), wherein the value or security document ( 2000 ) is formed of at least three document layers which are arranged in a document layer stack ( 1700 ) and which are connected together face-to-face by a joining method, wherein a first document layer is formed by a circuit carrier layer ( 1200 ) which supports the electric circuit ( 1270 ), at least one second document layer is formed in each case by a compensation layer ( 1100 ) which has at least one opening ( 1120 ) and/or recess, and at least one third document layer is formed in each case by a cover layer ( 1300 ), characterised in that the first ( 1200 ) and the at least one second ( 1100 ) and the at least one third document layer ( 1300 ) are formed from a fibre composite material which is formed by a thermoset based on epoxy resin and reinforced with glass fibre fabric.

2 . The value or security document ( 2000 ) according to claim 1 , characterised in that the fibre composite material does not melt.

3 . The value or security document ( 2000 ) according to claim 1 , characterised in that no boundaries are visible between the respective document layers ( 1100 , 1200 , 1300 ) in the value or security document ( 2000 ).

4 . The value or security document ( 2000 ) according to claim 1 , characterised in that the at least one cover layer ( 1300 ) and the circuit carrier layer ( 1200 ) are transparent or translucent.

5 . The value or security document ( 2000 ) according to claim 1 , characterised in that cavities ( 1130 ) that are formed by the at least one opening ( 1120 ) and/or recess in the at least one compensation layer ( 1100 ) and by electronic components ( 1210 ) mounted on the circuit carrier layer ( 1200 ), which electronic components protrude into the at least one opening ( 1120 ) or recess, are filled with a polymer material.

6 . The value or security document ( 2000 ) according to claim 1 , characterised in that the at least one cover layer ( 1300 ) has an opening ( 1320 ), and therefore a sensor device ( 1220 ) disposed therein is exposed outwardly.

7 . The value or security document ( 2000 ) according to claim 1 , characterised in that the electric circuit ( 1270 ) comprises an RFID circuit, a biometric sensor device ( 1220 ) and/or an electronic display device ( 1230 ).

8 . The value or security document ( 2000 ) according to claim 1 , characterised in that the value or security document ( 2000 ) comprises a display device ( 1230 ) with an electrophoretic, ferroelectric or cholesteric display element ( 1231 ), which permanently displays the individualising data.

9 . A method for producing a value or security document ( 2000 ) containing an electric circuit ( 1270 ), said method comprising the following method steps:
(a) providing a first document layer in the form of a circuit carrier layer ( 1200 ) which supports the electric circuit ( 1270 ), at least one second document layer in each case in the form of a compensation layer ( 1100 ), which has at least one opening ( 1120 ) and/or recess, and at least one third document layer in each case in the form of a cover layer ( 1300 ); (b) stacking the first ( 1200 ) and the at least one second ( 1100 ) and the at least one third document layer ( 1300 ) to form a document layer stack ( 1700 ); (c) joining the first ( 1200 ) and the at least one second ( 1100 ) and the at least one third document layer ( 1300 ) non-detachably, in particular by means of a lamination method, wherein a document blank ( 1000 ) is produced; and (d) individualising the document blank ( 1000 ), wherein the value or security document ( 2000 ) is created, wherein the first ( 1200 ) and the at least one second ( 1100 ) and the at least one third document layer ( 1300 ) are formed from a fibre composite material which is formed by a thermoset based on epoxy resin and reinforced with glass fibre fabric.

10 . The value or security document ( 2000 ) according to claim 2 , characterised in that no boundaries are visible between the respective document layers ( 1100 , 1200 , 1300 ) in the value or security document ( 2000 ).

11 . The value or security document ( 2000 ) according to claim 2 , characterised in that the at least one cover layer ( 1300 ) and the circuit carrier layer ( 1200 ) are transparent or translucent.

12 . The value or security document ( 2000 ) according to claim 3 , characterised in that the at least one cover layer ( 1300 ) and the circuit carrier layer ( 1200 ) are transparent or translucent.

13 . The value or security document ( 2000 ) according to claim 3 , characterised in that cavities ( 1130 ) that are formed by the at least one opening ( 1120 ) and/or recess in the at least one compensation layer ( 1100 ) and by electronic components ( 1210 ) mounted on the circuit carrier layer ( 1200 ), which electronic components protrude into the at least one opening ( 1120 ) or recess, are filled with a polymer material.

14 . The value or security document ( 2000 ) according to claim 4 , characterised in that cavities ( 1130 ) that are formed by the at least one opening ( 1120 ) and/or recess in the at least one compensation layer ( 1100 ) and by electronic components ( 1210 ) mounted on the circuit carrier layer ( 1200 ), which electronic components protrude into the at least one opening ( 1120 ) or recess, are filled with a polymer material.

15 . The value or security document ( 2000 ) according to claim 4 , characterised in that the at least one cover layer ( 1300 ) has an opening ( 1320 ), and therefore a sensor device ( 1220 ) disposed therein is exposed outwardly.

16 . The value or security document ( 2000 ) according to claim 3 , characterised in that the electric circuit ( 1270 ) comprises an RFID circuit, a biometric sensor device ( 1220 ) and/or an electronic display device ( 1230 ).

17 . The value or security document ( 2000 ) according to claim 5 , characterised in that the electric circuit ( 1270 ) comprises an RFID circuit, a biometric sensor device ( 1220 ) and/or an electronic display device ( 1230 ).

18 . The value or security document ( 2000 ) according to claim 2 , characterised in that the value or security document ( 2000 ) comprises a display device ( 1230 ) with an electrophoretic, ferroelectric or cholesteric display element ( 1231 ), which permanently displays the individualising data.

19 . The value or security document ( 2000 ) according to claim 3 , characterised in that the value or security document ( 2000 ) comprises a display device ( 1230 ) with an electrophoretic, ferroelectric or cholesteric display element ( 1231 ), which permanently displays the individualising data.

20 . The value or security document ( 2000 ) according to claim 5 , characterised in that the value or security document ( 2000 ) comprises a display device ( 1230 ) with an electrophoretic, ferroelectric or cholesteric display element ( 1231 ), which permanently displays the individualising data.

Assignees

• Bundesdruckerei Gmbh

Inventors

• Fischer Jörg
• Trölenberg Stefan
• Tietke Markus
• Fritze Frank
• Hille Jakob
• Kraus Micha

Classifications

• B32B2250/03

  3 layers · CPC title

• B32B2519/02

  RFID tags · CPC title

• B42D25/475

  Cutting cards · CPC title

• G07F7/0813

  Specific details related to card security · CPC title

• G06K19/077

  Constructional details, e.g. mounting of circuits in the carrier · CPC title