Removable build modules for additive fabrication

US2018319081A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018319081-A1
Application numberUS-201815970283-A
CountryUS
Kind codeA1
Filing dateMay 3, 2018
Priority dateMay 5, 2017
Publication dateNov 8, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Techniques for producing removable build modules for additive fabrication devices are described. According to some aspects, a removable build module may comprise an enclosure having an open top, a fabrication platform arranged in an interior of the enclosure, and at least one actuator incorporated into the enclosure and configured to move the fabrication platform towards and away from the open top of the enclosure.

First claim

Opening claim text (preview).

What is claimed is: 1 . A removable build module for an additive fabrication device configured to fabricate objects by forming layers of solid material from a source material, the removable build module comprising: an enclosure having an open top; a fabrication platform arranged in an interior of the enclosure; and at least one actuator incorporated into the enclosure and configured to move the fabrication platform towards and away from the open top of the enclosure. 2 . The removable build module of claim 1 , further comprising a leadscrew and wherein the at least one actuator includes a source of rotational motion coupled to the leadscrew. 3 . The removable build module of claim 1 , further comprising at least one heater. 4 . The removable build module of claim 1 , further comprising at least one temperature sensor. 5 . The removable build module of claim 4 , further comprising: at least one heater; and at least one controller configured to adjust an amount of heat produced by the at least one heater based at least in part on an indication of temperature produced by the at least one temperature sensor. 6 . The removable build module of claim 1 , further comprising one or more sensors configured to generate an indication of the fabrication platform's position. 7 . The removable build module of claim 1 , further comprising one or more rails attached to an exterior of the enclosure. 8 . The removable build module of claim 1 , further comprising one or more connection points that include an opening through the enclosure. 9 . The removable build module of claim 8 , wherein at least a first connection point of the one or more connection points includes an electrical connector coupled to at least one electrical component of the removable build module. 10 . The removable build module of claim 1 , wherein the fabrication platform includes a planar upper surface extending across the interior of the enclosure. 11 . The removable build module of claim 1 , further comprising one or more guide rails arranged to guide the fabrication platform as the fabrication platform moves towards and away from the open top of the enclosure.

Assignees

Inventors

Classifications

  • B29C64/259Primary

    Interchangeable · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Rollers · CPC title

  • B29C64/153Primary

    using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

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Frequently asked questions

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What does patent US2018319081A1 cover?
Techniques for producing removable build modules for additive fabrication devices are described. According to some aspects, a removable build module may comprise an enclosure having an open top, a fabrication platform arranged in an interior of the enclosure, and at least one actuator incorporated into the enclosure and configured to move the fabrication platform towards and away from the open …
Who is the assignee on this patent?
Formlabs Inc, Formlabs Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/259. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Nov 08 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).