Film mold and imprinting method

Patent metadata

Field	Value
Publication number	US-2018307136-A1
Application number	US-201615771332-A
Country	US
Kind code	A1
Filing date	Oct 14, 2016
Priority date	Oct 26, 2015
Publication date	Oct 25, 2018
Grant date	—

Abstract

A film mold according to the present embodiment includes a first resin layer having a pattern region including a concavo-convex pattern and constituted by a resin composition, and a first glass substrate layer constituted by thin film glass and laminated on a surface on an opposite side to a surface on which the pattern region is formed in the first resin layer.

First claim

1 . A film mold comprising:
a first resin layer having a pattern region including a concavo-convex pattern and constituted by a resin composition; and a first glass substrate layer constituted by thin film glass and laminated on a surface on an opposite side to a surface on which the pattern region is formed in the first resin layer.

2 . The film mold according to claim 1 , further comprising
a second resin layer constituted by a resin composition and laminated on a surface on an opposite side to a surface on the first resin layer side of the first glass substrate layer.

3 . The film mold according to claim 2 , wherein
a contraction rate of the resin composition constituting the first resin layer and a contraction rate of the resin composition constituting the second resin layer are the same.

4 . The film mold according to claim 2 , wherein
one of the resin composition constituting the first resin layer and the resin composition constituting the second resin layer is a radically polymerizable curable resin composition and the other is a cationically polymerizable curable resin composition.

5 . The film mold according to claim 1 , wherein
the first glass substrate layer is formed of a material having a tensile stress of 50 MPa or lower when bent into a state of a curvature radius of 150 mm or smaller.

6 . The film mold according to claim 1 , further comprising
a second glass substrate layer laminated on a surface on an opposite side to a surface on the first resin layer side of the first glass substrate layer via an intermediate layer, the second glass substrate layer being constituted by thin film glass.

7 . The film mold according to claim 6 , wherein
the first glass substrate layer and the second glass substrate layer are formed of a material having a tensile stress of 50 MPa or lower when bent into a state of a curvature radius of 150 mm or smaller.

8 . The film mold according to claim 1 , wherein
the first resin layer has a non-pattern region in a region different from the pattern region, and an alignment mark is provided in the non-pattern region.

9 . The film mold according to claim 1 , wherein
a Young's modulus of a layer formed of glass included in the film mold is 75 GPa or lower.

10 . An imprinting method comprising:
a preparation step of preparing the film mold according to claim 1 and a transfer substrate that holds a molding target material on one surface thereof; a positioning step of positioning the film mold and the transfer substrate in a predetermined state; a contact step of bringing the pattern region of the film mold into contact with the molding target material held on the transfer substrate; a curing step of curing the molding target material brought into contact with the film mold to form a transfer layer onto which a pattern corresponding to the pattern region has been transferred; and a release step of separating the transfer layer and the film mold from each other such that a pattern structure that is the transfer layer is positioned on the transfer substrate.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Okawa Yasuhiro
• Yoshioka Hidenori

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• B29K2709/08

  Glass · CPC title

• B32B17/10064

  comprising at least two glass sheets, only one of which being an outer layer · CPC title

• B29C59/02

  by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title