Packaging material for power storage device and method for manufacturing packaging material for power storage device

US2018301671A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018301671-A1
Application numberUS-201816014379-A
CountryUS
Kind codeA1
Filing dateJun 21, 2018
Priority dateFeb 3, 2016
Publication dateOct 18, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a packaging material for a power storage device, the packaging material having a structure in which at least a substrate protective layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer are laminated in this order, wherein the substrate protective layer is a cured product of a raw material containing a polyester resin and a polyisocyanate, a ratio [NCO]/[OH] is 5 to 60, where [OH] is the number of moles of hydroxyl groups in the polyester resin, and [NCO] is the number of moles of isocyanate groups in the polyisocyanate, and the polyester resin has a hydroxyl value of 10 to 70 KOHmg/g.

First claim

Opening claim text (preview).

What is claimed is: 1 . A packaging material for a power storage device, comprising: a structure in which at least a substrate protective layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer are laminated in this order, wherein the substrate protective layer is a cured product of a raw material containing a polyester resin and a polyisocyanate, wherein a ratio [NCO]/[OH] is 5 to 60, where [OH] is the number of moles of hydroxyl groups in the polyester resin, and [NCO] is the number of moles of isocyanate groups in the polyisocyanate, and the polyester resin has a hydroxyl value of 10 to 70 KOHmg/g. 2 . A packaging material for a power storage device, comprising: structure in which at least a substrate protective layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer are laminated in this order, wherein the substrate protective layer is a cured product of a raw material containing an aromatic polyester urethane resin and a polyisocyanate, and wherein a ratio [NCO]/[OH] is 5 to 20, where [OH] is the number of moles of hydroxyl groups in the aromatic polyester urethane resin, and [NCO] is the number of moles of isocyanate groups in the polyisocyanate. 3 . The packaging material for a power storage device of claim 1 , wherein when a constant voltage of 100 V is applied for 3 minutes between the substrate protective layer and the metal foil layer in a state in which water is attached to the substrate protective layer, the insulation resistance between the layers is 2000 MS2 or more. 4 . The packaging material for a power storage device of claim 1 , wherein the polyisocyanate contains 50 mass % or more of polyisocyanate that does not have an alicyclic structure. 5 . The packaging material for a power storage device of claim 4 , wherein the polyisocyanate that does not have an alicyclic structure is an aliphatic polyisocyanate. 6 . The packaging material for a power storage device of claim 4 , wherein the polyisocyanate that does not have an alicyclic structure is an adduct or biuret form of an aliphatic polyisocyanate. 7 . The packaging material for a power storage device of claim 2 , wherein the aromatic polyester urethane resin is a blend of two or more aromatic polyester urethane resins having different glass transition temperatures (Tg). 8 . The packaging material for a power storage device of claim 1 , wherein the raw material further contains a filler. 9 . A method for manufacturing a packaging material for a power storage device, the method comprising the steps of: bonding a substrate layer to one surface of a metal foil layer with an adhesive layer interposed therebetween; forming a substrate protective layer on a surface of the substrate layer which faces away from the adhesive layer; and forming a sealant layer on a surface of the metal foil layer which faces away from the adhesive layer with a sealant adhesive layer interposed therebetween, wherein the substrate protective layer is a cured product of a raw material containing a polyester resin and a polyisocyanate, a ratio [NCO]/[OH] is 5 to 60, where [OH] is the number of moles of hydroxyl groups in the polyester resin, and [NCO] is the number of moles of isocyanate groups in the polyisocyanate, and the polyester resin has a hydroxyl value of 10 to 70 KOHmg/g. 10 . A method for manufacturing a packaging material for a power storage device, the method comprising the steps of: bonding a substrate layer to one surface of a metal foil layer with an adhesive layer interposed therebetween; forming a substrate protective layer on a surface of the substrate layer which faces away from the adhesive layer; and forming a sealant layer on a surface of the metal foil layer which faces away from the adhesive layer with a sealant adhesive layer interposed therebetween, wherein the substrate protective layer is a cured product of a raw material containing an aromatic polyester urethane resin and a polyisocyanate, and a ratio [NCO]/[OH] is 5 to 20, where [OH] is the number of moles of hydroxyl groups in the aromatic polyester urethane resin, and [NCO] is the number of moles of isocyanate groups in the polyisocyanate.

Assignees

Inventors

Classifications

  • Energy storage using capacitors · CPC title

  • H01G11/78Primary

    Cases; Housings; Encapsulations; Mountings · CPC title

  • Processes for the manufacture of hybrid or EDL capacitors, or components thereof · CPC title

  • Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations · CPC title

  • Construction or manufacture · CPC title

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What does patent US2018301671A1 cover?
The present invention relates to a packaging material for a power storage device, the packaging material having a structure in which at least a substrate protective layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer are laminated in this order, wherein the substrate protective layer is a cured product of a raw material containing a pol…
Who is the assignee on this patent?
Toppan Printing Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01G11/78. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Oct 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).