Wafer processing apparatus
US-2017323774-A1 · Nov 9, 2017 · US
Workpiece dividing method
US2018301378A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018301378-A1 |
| Application number | US-201815946293-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 5, 2018 |
| Priority date | Apr 13, 2017 |
| Publication date | Oct 18, 2018 |
| Grant date | — |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
There is provided a dividing method for dividing a plate-shaped workpiece. The dividing method includes: a starting point region forming step of forming a starting point region serving as a starting point of division along a planned dividing line set on the workpiece; a heating step of heating the workpiece after performing the starting point region forming step; a cooling step of cooling the workpiece after performing the heating step; a dividing step of dividing the workpiece along the starting point region by applying a force to the workpiece after performing the cooling step; and a sheet affixing step of affixing an expanding sheet to the workpiece before performing the dividing step; the dividing step applying the force to the workpiece by expanding the expanding sheet.
First claim
Opening claim text (preview).
What is claimed is: 1 . A dividing method for dividing a plate-shaped workpiece, the dividing method comprising: a starting point region forming step of forming a starting point region serving as a starting point of division along a planned dividing line set on the workpiece; a heating step of heating the workpiece after performing said starting point region forming step; a cooling step of cooling the workpiece after performing said heating step; a dividing step of dividing the workpiece along the starting point region by applying a force to the workpiece after performing said cooling step; and a sheet affixing step of affixing an expanding sheet to the workpiece before performing said dividing step; said dividing step applying the force to the workpiece by expanding the expanding sheet. 2 . The dividing method according to claim 1 , wherein said starting point region forming step forms a plurality of fine holes reaching one surface from an inside of the workpiece along the planned dividing line by irradiating the workpiece with a laser beam.
Assignees
Inventors
Classifications
involving stretching of the auxiliary support post dicing · CPC title
- H10P72/0432Primary
mainly by conduction · CPC title
using vacuum or suction, e.g. Bernoulli chucks · CPC title
Thermal treatments, e.g. annealing or sintering · CPC title
Wafer tapes, e.g. grinding or dicing support tapes · CPC title
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Frequently asked questions
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- What does patent US2018301378A1 cover?
- There is provided a dividing method for dividing a plate-shaped workpiece. The dividing method includes: a starting point region forming step of forming a starting point region serving as a starting point of division along a planned dividing line set on the workpiece; a heating step of heating the workpiece after performing the starting point region forming step; a cooling step of cooling the w…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0432. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Oct 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).