Conductive member, and production method therefor

Patent metadata

Field	Value
Publication number	US-2018298510-A1
Application number	US-201615763684-A
Country	US
Kind code	A1
Filing date	Aug 5, 2016
Priority date	Sep 28, 2015
Publication date	Oct 18, 2018
Grant date	—

Abstract

To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1, an arithmetic average roughness Sa of the surface of the Ni plating layer 3 being 20 nm or more. In the Ni plating layer 3, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness HIT of the Ni plating layer 3 is preferably 5000 n/mm2 or less.

First claim

1 . A conductive member having a Ni plating layer on the surface of contact parts provided on a substrate of the conductive member, an arithmetic average roughness Sa of the surface of the Ni plating layer being 20 nm or more.

2 . The conductive member according to claim 1 , wherein in the Ni plating layer, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is 0.6° or less.

3 . The conductive member according to claim 1 , wherein an indentation hardness H IT of the Ni plating layer is 5000 N/mm 2 or less.

4 . The conductive member according to claim 1 , wherein the content of sulfur in the Ni plating layer is under 0.1 mass %.

5 . The conductive member according to claim 1 , wherein a resin layer is formed on surfaces other than the contact parts.

6 . The conductive member according to claim 1 , wherein the substrate comprises aluminum or an aluminum alloy.

7 . A production method for the conductive member according to claim 1 , comprising:
a step for preparing the substrate, and a plating step for bringing the contact parts provided on the substrate into contact with a Ni plating solution, wherein the Ni plating solution does not contain a brightener that includes sulfur.

8 . The production method according to claim 7 , wherein electroplating is performed using a sulfamic acid bath with a pH of 3.5-4.8 in the plating step.

9 . The production method according to claim 7 , wherein the step for preparing the substrate is a step for drawing out a substrate wound in a coil shape, and
the production method further comprises, following the plating step, a step for winding the plated substrate in a coil shape, and a step for cutting and shaping the substrate.

10 . The production method according to claim 7 , wherein the production method comprises, following the plating step, a step for providing a resin layer on portions other than the contact parts.

Assignees

• Nippon Light Metal Co

Inventors

• Nishikawa Yosuke
• Shimizu Sayuri
• Sumi Shinichiro

Classifications

• C23C18/1646

  Characteristics of the product obtained · CPC title

• H01R2201/26

  for vehicles · CPC title

• C25D7/0607

  Wires · CPC title

• C23C18/32

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title

• H01R13/03

  characterised by the material, e.g. plating, or coating materials · CPC title