Methods of Polishing

Patent metadata

Field	Value
Publication number	US-2018297173-A1
Application number	US-201515519700-A
Country	US
Kind code	A1
Filing date	Apr 7, 2015
Priority date	Apr 7, 2015
Publication date	Oct 18, 2018
Grant date	—

Abstract

One example provides a method. The method includes forming a substrate comprising a metal alloy comprising at least one of aluminium, magnesium, lithium, zinc, titanium, niobium, and copper. The method includes polishing a surface of the substrate using particles comprising chromium metal. The polished surface is electrically conductive.

First claim

What is claimed:

1 . A method comprising:
forming a substrate comprising a metal alloy comprising at least one of aluminium, magnesium, lithium, zinc, titanium, niobium, and copper; and polishing a surface of the substrate using particles comprising chromium metal, wherein the polished surface is electrically conductive.

2 . The method of claim 1 ,wherein the substrate comprises a magnesium alloy.

3 . The method of claim 1 , wherein the forming comprises at least one of forging and computer numerical control machining.

4 . The method of claim 1 , wherein the polishing comprises at least one of mechanically polishing and blasting the surface with the particles.

5 . The method of claim 1 , further comprising:
treating the polished surface with an agent; and disposing a coating over the treated surface.

6 . The method claim 1 , wherein the particles are at least substantially free of at least one of silica, silicon carbide, and alumina.

7 . A method comprising:
forming a substrate comprising a magnesium alloy; polishing a surface of the substrate using particles comprising chromium metal, wherein the polished surface is electrically conductive; and disposing a coating over the polished surface using at least an electrical current.

8 . The method of claim 7 , further comprising treating the polished by at least one of:
cleaning the surface; and activating the surface for the disposing.

9 . The method of claim 7 , wherein the disposing comprises electroplating a transition metal over the polished surface.

10 . The method of claim 7 , wherein the disposing comprises electroplating a transition metal over the polished surface, the transition metal comprising at least one of aluminium zinc, copper, chromium, and nickel.

11 . The method of claim 7 , wherein the disposing comprises electrophoretic deposition.

12 . The method of claim 7 , wherein the disposing comprises electrophoretic deposition using a east one of a polyacrylic polymer and an epoxy-based polymer.

13 . The method of claim 7 , wherein the coating is a functional coating comprising at least one polymer selected from the group consisting of polystyrene, polyimide, polyarelene ether, polyurethane, methylsilsesquioxane, polyethylene, polystyrene silicone, butyl rubber, polyamide, polycarbonate, styrene-butadiene rubber, polyacrylate, epoxy, and fluoropolymer.

14 . A method comprising:
forming a substrate comprising a magnesium alloy; polishing a surface of the substrate using particles comprising chromium metal, wherein the polished surface is electrically conductive; treating the polished surface by one of cleaning and surface activation; disposing a first layer comprising a transition metal over the treated surface using electrodeposition; treating the first layer with surface activation; is disposing a second layer over the treated first layer using electrophoretic deposition; and creating a functional coating over the second layer.

15 . The method, of claim 14 , wherein the polishing comprises a least one of mechanically polishing and blasting the surface with the particles.

Assignees

• Hewlett Packard Development Co

Inventors

• Wu Kuan-Ting
• Chang Chi Hao
• Kang Yu-Chuan

Classifications

• B24D3/34 Primary

  characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties · CPC title

• C25D13/04

  with organic material · CPC title

• C09D5/4473

  Mixture of polymers · CPC title

• B24D3/346 Primary

  utilised during polishing, or grinding operation · CPC title

• B24C11/00

  Selection of abrasive materials {or additives} for abrasive blasts (polishing compositions C09G) · CPC title