Cooling system employable in data center

Patent metadata

Field	Value
Publication number	US-2018295752-A1
Application number	US-201815889914-A
Country	US
Kind code	A1
Filing date	Feb 6, 2018
Priority date	Apr 6, 2017
Publication date	Oct 11, 2018
Grant date	—

Abstract

The present disclosure discloses a cooling system employable in data centers. An specific embodiment of the cooling system comprises: a first refrigeration medium, a first evaporator, a first condenser, and an all-condition cooling tower, wherein: the first evaporator is installed in a to-be-cooled space, the first evaporator is connected to the first condenser, an installation position of the first condenser is higher than an installation position of the first evaporator; the first condenser is connected to the all-condition cooling tower, and the all-condition cooling tower is disposed outside the to-be-cooled space, the all-condition cooling tower is used for providing the first condenser with a cold source for cooling the first refrigeration medium in a gaseous state. The cooling system provided by the embodiment has the advantages of simple structure, convenient installation and maintenance and low cost.

First claim

What is claimed is:

1 . A cooling system employable in a data center, the cooling system comprising:
a first refrigeration medium; a first evaporator; a first condenser; and an all-condition cooling tower, wherein: the first evaporator is installed in a to-be-cooled space, the first evaporator is connected to the first condenser, an installation position of the first condenser is higher than an installation position of the first evaporator, the first refrigeration medium in the first evaporator absorbs heat from the to-be-cooled space and is vaporized into the first refrigeration medium in a gaseous state, the first refrigeration medium in the gaseous state rises to the first condenser and is cooled by the first condenser to be liquefied into the first refrigeration medium in a liquid state, the first refrigeration medium in the liquid state returns to the first evaporator; and the first condenser is connected to the all-condition cooling tower, the all-condition cooling tower is disposed outside the to-be-cooled space, and the all-condition cooling tower is used for providing the first condenser with a cold source cooling the first refrigeration medium in the gaseous state.

2 . The cooling system according to claim 1 , wherein the first condenser comprises a main first condenser and a standby first condenser, the main first condenser and the standby first condenser are both connected to the first evaporator, and the main first condenser or the standby first condenser cools the gaseous first refrigeration medium.

3 . The cooling system according to claim 2 , wherein the first evaporator and the first condenser are connected through a flexible hose, and the flexible hose is provided with a quick coupling.

4 . The cooling system according to claim 3 , wherein the cooling system further comprises a control apparatus, and a temperature sensor, a barometric sensor and a valve in communication with the control apparatus, wherein:
the temperature sensor and the barometric sensor are both disposed in the to-be-cooled space; the valve is disposed in a connecting pipe transporting the cold source from the all-condition cooling tower to the first condenser; and the control apparatus is used for defining an opening of the valve according to a temperature value and a pressure value respectively collected by the temperature sensor and the barometric sensor.

5 . The cooling system according to claim 4 , wherein the first refrigeration medium is an organic refrigeration medium.

6 . The cooling system according to claim 5 , wherein a to-be-cooled device is provided by the to-be-cooled space, the first evaporator is an aluminum micro-channel heat exchanger, and the micro-channel heat exchanger is installed on the to-be-cooled device as a backplane.

7 . The cooling system according to claim 6 , wherein the cooling system further comprises a water pump installed on a connecting pipe between the all-condition cooling tower and the first condenser.

8 . The cooling system according to claim 1 , wherein the all-condition cooling tower comprises a second refrigeration medium, a second condenser, a second compressor, and a closed cooling tower comprising a heat radiating coil and a second evaporator, wherein:
the heat radiating coil is connected to the first condenser, the second refrigeration medium absorbs heat of the first refrigeration medium in the first condenser, the second refrigeration medium after absorbing heat cools in the heat radiating coil, the cooled second refrigeration medium returns to the first condenser; and the second compressor is connected to the second evaporator and the second condenser, the second compressor and the second condenser provide the cold source for the second refrigeration medium in the heat radiating coil through the second evaporator.

9 . The cooling system according to claim 8 , wherein the second refrigeration medium is a non-aqueous refrigeration medium, and an installation position of the heat radiating coil is higher than the installation position of the first condenser, the second refrigeration medium absorbs heat of the first refrigeration medium, and is vaporized into the second refrigeration medium in a gaseous state, the second refrigeration medium in the gaseous state rises to the heat radiating coil, and the second refrigeration medium in the gaseous state releases heat in the heat radiating coil and is liquefied into the second refrigeration medium in a liquid state, the second refrigeration medium in the liquid state returns to the first condenser.

10 . The cooling system according to claim 1 , wherein the all condition cooling tower comprises a third refrigeration medium, a third compressor, a third condenser, a third evaporator, and an open cooling tower comprising a spraying component and a water collector locating below the spraying component, wherein:
the spraying component is connected to a water outlet of the first condenser, the spraying component is used for spraying the third refrigeration medium received from the water outlet of the first condenser, wherein the sprayed third refrigeration medium exchanges heat with the air for releasing heat, and the third refrigeration medium falls into the water collector after releasing the heat; the third evaporator is disposed in the water collector, and the third evaporator is used for cooling the third refrigeration medium after releasing the heat; the water collector is connected to a water inlet of the first condenser, the water collector is used for: receiving an third refrigeration medium after releasing the heat, and transporting the third refrigeration medium cooled through the third evaporator to the first condenser; and the third compressor is connected to the third condenser and the third evaporator, the third condenser and the third compressor are used for providing the third evaporator with the cold source.

Assignees

• Beijing Baidu Netcom Sci & Tec

Inventors

• Tang Hu
• Zhang Binghua
• Zhou Tianyu

Classifications

• H05K7/20354

  Refrigerating circuit comprising a compressor · CPC title

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F25B5/02 Primary

  arranged in parallel · CPC title

• H05K7/20318

  Condensers · CPC title