Double-sided adhesive tape, electronic instrument provided with double-sided adhesive tape, disassembly structure provided with double-sided adhesive tape, and adhered structure

Patent metadata

Field	Value
Publication number	US-2018291237-A1
Application number	US-201615554165-A
Country	US
Kind code	A1
Filing date	Apr 20, 2016
Priority date	Jul 21, 2015
Publication date	Oct 11, 2018
Grant date	—

Abstract

Provided is an adhesion technology that can separate adherends with their recycling as a premise while meeting their reliability guarantee temperature conditions. A double-sided, pressure-sensitive adhesive tape includes a pair of pressure-sensitive adhesive layers and an electrically-conductive heat generating layer disposed between the paired pressure-sensitive adhesive layers. At least one of the paired pressure-sensitive adhesive layers contains a heat-foaming agent, and at least one of opposite end faces of the electrically-conductive heat generating layer extends out beyond a corresponding end face of the at least one pressure-sensitive adhesive layer.

First claim

1 . A double-sided, pressure-sensitive adhesive tape comprising:
a pair of pressure-sensitive adhesive layers; and an electrically-conductive heat generating layer disposed between the paired pressure-sensitive adhesive layers; at least one of the paired pressure-sensitive adhesive layers containing a heat-foaming agent; at least one of opposite end faces of the electrically-conductive heat generating layer extending out beyond a corresponding end face of the at least one pressure-sensitive adhesive layer.

2 . The double-sided, pressure-sensitive adhesive tape according to claim 1 , wherein
the heat-foaming agent has a foaming starting temperature set higher than a guarantee temperature of an adherend to be bonded to the at least one pressure-sensitive adhesive layer, and the electrically-conductive heat generating layer has a heat generating temperature set equal to or higher than the foaming starting temperature.

3 . The double-sided, pressure-sensitive adhesive tape according to claim 2 , wherein
the opposite end faces of the electrically-conductive heat generating layer extend out beyond corresponding end faces of the at least one pressure-sensitive adhesive layer, and are disposed in the same planes as corresponding end faces of the other pressure-sensitive adhesive layer.

4 . The double-sided, pressure-sensitive adhesive tape according to claim 3 , wherein
each pressure-sensitive adhesive layer contains the heat-foaming agent.

5 . An electronic device at least comprising:
an internal power supply that drives the electronic device; an adherend bonded with the internal power supply; and a double-sided, pressure-sensitive adhesive tape bonding the internal power supply and the adherend with each other; the double-sided, pressure-sensitive adhesive tape including a first pressure-sensitive adhesive layer bonded with the internal power supply, a second pressure-sensitive adhesive layer bonded with the adherend, and an electrically-conductive heat generating layer disposed between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer; at least one of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer containing a heat-foaming agent; at least one of opposite end faces of the electrically-conductive heat generating layer extending out beyond a corresponding end face of one of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.

6 . The electronic device according to claim 5 , wherein the heat-foaming agent contained in the double-sided, pressure-sensitive adhesive tape has a foaming starting temperature set higher than a guarantee temperature of the internal power supply, and
the electrically-conductive heat generating layer has a heat generating temperature set equal to or higher than the foaming starting temperature.

7 . The electronic device according to claim 6 , wherein
the opposite end faces of the electrically-conductive heat generating layer extend out beyond corresponding end faces of the second pressure-sensitive adhesive layer, and are disposed in the same planes as corresponding end faces of the first pressure-sensitive adhesive layer.

8 . The electronic device according to claim 7 , wherein
the first pressure-sensitive adhesive layer contains the heat foaming agent.

9 . The electronic device according to claim 8 , wherein
the first pressure-sensitive adhesive layer is bonded with an inner wall of the internal power supply, the inner wall facing the adherend, and also with an outer wall of the internal power supply, the outer wall facing a cover that lies over the internal power supply.

10 . The electronic device according to claim 9 , further comprising:
a switching element that supplies, to the electrically-conductive heat generating layer, electric energy which would otherwise be supplied from the internal power supply to the electronic device.

11 . A dismantlable structure comprising:
a double-sided, pressure-sensitive adhesive tape; and a combination of adherends bonded with each other via the double-sided, pressure-sensitive adhesive tape; the double-sided, pressure-sensitive adhesive tape including a pair of pressure-sensitive adhesive layers and an electrically-conductive heat generating layer disposed between the paired pressure-sensitive adhesive layers; at least one of the paired pressure-sensitive adhesive layers containing a heat-foaming agent; at least one of opposite end faces of the electrically-conductive heat generating layer extending out beyond a corresponding end face of the at least one pressure-sensitive adhesive layer; the combination of the adherends is dismantled by heating the at least one end face of the electrically-conductive heat generating layer and allowing the at least one pressure-sensitive adhesive layer, which contains the heat-foaming agent, to foam and expand.

12 . An adhesion structure comprising:
a first adherend; a second adherend; and an adhesion layer bonding the first adherend and the second adherend with each other; the adhesion layer having a self-dismantlable adhesion layer that is in contact with at least one of the first adherend and the second adherend.

13 . The adhesion structure according to claim 12 , wherein
at least one of the first adherend and the second adherend is provided with a heating tool insertion hole that extends to the self-dismantlable adhesion layer.

Assignees

• Sony Corp

Inventors

• Mitsuboshi Masahiko

Classifications

• H01M2/10

  Electricity · mapped topic

• C09J7/38 Primary

  Pressure-sensitive adhesives [PSA] · CPC title

• C09J9/02

  Electrically-conducting adhesives · CPC title

• C09J2301/408

  additives as essential feature of the adhesive layer · CPC title

• C09J2301/302

  the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C · CPC title