Deposition mask, method of manufacturing deposition mask and metal plate

Patent metadata

Field	Value
Publication number	US-2018277799-A1
Application number	US-201815987152-A
Country	US
Kind code	A1
Filing date	May 23, 2018
Priority date	Sep 30, 2015
Publication date	Sep 27, 2018
Grant date	—

Abstract

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

First claim

1 . A deposition mask for depositing a deposition material on a deposition target substrate, the deposition mask comprising:
a mask body; and a through-hole provided in the mask body and through which the deposition material passes when the deposition material is deposited on the deposition target substrate, wherein the mask body satisfies
y≥ 950 and y≥ 23 x− 1280
when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

2 . A deposition mask for depositing a deposition material on a deposition target substrate, the deposition mask comprising:
a mask body; and a through-hole provided in the mask body and through which the deposition material passes when the deposition material is deposited on the deposition target substrate, wherein the mask body satisfies
z≥ 3 . 7 and z≥ 0.1 x− 6.0
when an indentation elastic modulus is x (GPa) and an indentation hardness is z (GPa).

3 . The deposition mask according to claim 1 , wherein
a thickness of the mask body is 15 μm or less.

4 . The deposition mask according to claim 1 , wherein
the deposition mask is produced by a plating process.

5 . The deposition mask according to claim 1 , wherein
the mask body has a first metal layer and a second metal layer provided on the first metal layer.

6 . A method of manufacturing a deposition mask for depositing a deposition material on a deposition target substrate, the method comprising:
a step of forming a mask body, provided with a through-hole through which the deposition material passes when the deposition material is deposited on the deposition target substrate, on a base material by a plating process; and a step of separating the mask body from the base material, wherein the mask body satisfies
y≥ 950 and y≥ 23 x− 1280
when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

7 . A method of manufacturing a deposition mask for depositing a deposition material on a deposition target substrate, the method comprising:
a step of forming a mask body, provided with a through-hole through which the deposition material passes when the deposition material is deposited on the deposition target substrate, on a base material by a plating process; and a step of separating the mask body from the base material, wherein the mask body satisfies
z≥ 3.7 and z≥ 0.1 x− 6.0
when an indentation elastic modulus is x (GPa) and an indentation hardness is z (GPa).

8 . The method of manufacturing a deposition mask according to claim 6 , wherein
the step of forming the mask body includes: a first film formation step of forming a first metal layer provided with a first opening forming the through-hole; and a second film formation step of forming a second metal layer provided with a second opening communicating with the first opening on the first metal layer, the second film formation step to obtain the mask body having the first metal layer and the second metal layer.

9 . The method of manufacturing a deposition mask according to claim 8 , wherein
the second film formation step includes: a resist formation step of forming a resist pattern on the base material and on the first metal layer with a predetermined gap therebetween; and a plating process step of precipitating the second metal layer on the first metal layer in the gap of the resist pattern, and the resist formation step is performed such that the first opening of the first metal layer is covered with the resist pattern and the gap of the resist pattern is positioned on the first metal layer.

10 . The method of manufacturing a deposition mask according to claim 9 , wherein
the plating process step of the second film formation step includes an electrolytic plating process step of causing an electric current to flow through the first metal layer to precipitate the second metal layer on the first metal layer.

11 . The method of manufacturing a deposition mask according to claim 8 , wherein
the base material has an insulating property, a conductive pattern having a pattern corresponding to the first metal layer is formed on the base material, and the first film formation step includes a plating process step of precipitating the first metal layer on the conductive pattern.

12 . The method of manufacturing a deposition mask according to claim 11 , wherein
the plating process step of the first film formation step includes an electrolytic plating process step of causing an electric current to flow through the conductive pattern to precipitate the first metal layer on the conductive pattern.

13 . The method of manufacturing a deposition mask according to claim 8 , wherein
the first film formation step includes a resist formation step of forming a resist pattern on the base material with a predetermined gap therebetween and a plating process step of precipitating the first metal layer on the base material in the gap of the resist pattern, and a portion of a front surface of the base material on which the first metal layer is precipitated is formed of a conductive layer having conductivity.

14 . The method of manufacturing a deposition mask according to claim 13 , wherein
the plating process step of the first film formation step includes an electrolytic plating process step of causing an electric current to flow through the base material to precipitate the first metal layer on the base material.

15 . The deposition mask according to claim 2 , wherein
a thickness of the mask body is 15 μm or less.

16 . The deposition mask according to claim 2 , wherein
the deposition mask is produced by a plating process.

17 . The deposition mask according to claim 2 , wherein
the mask body has a first metal layer and a second metal layer provided on the first metal layer.

18 . The method of manufacturing a deposition mask according to claim 7 , wherein
the step of forming the mask body includes: a first film formation step of forming a first metal layer provided with a first opening forming the through-hole; and a second film formation step of forming a second metal layer provided with a second opening communicating with the first opening on the first metal layer, the second film formation step to obtain the mask body having the first metal layer and the second metal layer.

19 . The method of manufacturing a deposition mask according to claim 18 , wherein
the second film formation step includes: a resist formation step of forming a resist pattern on the base material and on the first metal layer with a predetermined gap therebetween; and a plating process step of precipitating the second metal layer on the first metal layer in the gap of the resist pattern, and the resist formation step is performed such that the first opening of the first metal layer is covered with the resist pattern and the gap of the resist pattern is positioned on the first metal layer.

20 . The method of manufacturing a deposition mask according to claim 19 , wherein
the plating process step of the second film formation step includes an electrolytic plating process step of causing an electric current to flow through the first metal layer to precipitate the second metal layer on the first metal layer.

21 . The method of manufacturing a deposition mask according to claim 18 , wherein
the base material has an insulating property, a conductive pattern having a pattern corresponding to the first metal layer is formed on the base material, and the first film formatio

Assignees

• Dainippon Printing Co Ltd

Inventors

• Ikenaga Chikao
• Shimazaki Yo
• Seki Kentarou
• Furushou Hiroki
• Hatsuta Chiaki

Classifications

• C25D1/10

  Moulds; Masks; Masterforms · CPC title

• C23C16/042

  using masks · CPC title

• C23F1/02

  Local etching · CPC title

• C25D1/08

  Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence) · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title