Method of producing clad layer and device for producing the same

US2018272471A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018272471-A1
Application numberUS-201815924453-A
CountryUS
Kind codeA1
Filing dateMar 19, 2018
Priority dateMar 22, 2017
Publication dateSep 27, 2018
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A first metal powder is supplied to a substrate to form a beginning part of a clad layer. After the beginning part is formed, the second metal powder is supplied to the substrate. A concentration of at least one of Si, Ni, Mo, and Al in the first metal powder is lower than a concentration thereof in the second metal powder.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method of producing a clad layer comprising: supplying metal powder that is copper-based metal powder to a surface of a substrate made of aluminum or aluminum alloy, emitting a laser beam to the metal powder, and melting the metal powder, the metal powder including a first metal powder and a second metal powder; and moving a supply position of the metal powder and an emission position of the laser beam in a predetermined direction along the surface of the substrate and forming the clad layer on the surface of the substrate in the predetermined direction, wherein the first metal powder is supplied to the substrate to form a beginning part of the clad layer, and after the beginning part is formed, and the second metal powder is supplied to the substrate, and a concentration of at least one of Si, Ni, Mo, and Al in the first metal powder is lower than a concentration of the at least one of Si, Ni, Mo, and Al in the second metal powder. 2 . The method according to claim 1 , wherein concentrations of Si, Ni, Mo, and Al in the first metal powder are lower than concentrations of Si, Ni, Mo, and Al in the second metal powder, respectively. 3 . The method according to claim 1 , wherein a Si concentration in the first metal powder is lower than a Si concentration in the second metal powder. 4 . The method according to claim 1 , wherein a Mo concentration in the first metal powder is lower than a Mo concentration in the second metal powder. 5 . The method according to claim 1 , wherein an Al concentration in the first metal powder is lower than an Al concentration in the second metal powder. 6 . The method according to claim 1 , wherein Si and Mo concentrations in the first metal powder are lower than Si and Mo concentrations in the second metal powder, respectively. 7 . The method according to claim 1 , wherein Si and Ni concentrations in the first metal powder are lower than Si and Ni concentrations in the second metal powder, respectively. 8 . The method according to claim 1 , wherein Si, Ni, and Mo concentrations in the first metal powder are lower than Si, Ni, and Mo concentrations in the second metal powder, respectively. 9 . The method according to claim 1 , wherein an Al solid solubility limit of the first metal powder is higher than an Al solid solubility limit of the second metal powder. 10 . The method according to claim 1 , wherein a laser output to the first metal powder is set to be lower than a laser output to the second metal powder. 11 . The method according to claim 1 , wherein the second metal powder is supplied on the beginning part of the clad layer to form an end part of the clad layer. 12 . A device for producing a clad layer comprising: a powder supply unit configured to supply metal powder that is copper-based metal powder to a surface of a substrate made of aluminum or an aluminum alloy, the metal powder including a first metal powder and a second metal powder; a laser emission unit configured to emit a laser beam to the metal powder supplied from the powder supply unit, the laser emission unit emitting the laser beam to the metal powder such that the metal powder is melted; a first supply unit configured to supply the first metal powder to the powder supply unit, a concentration of at least one of Si, Ni, Mo, and Al in the first metal powder is lower than a concentration of the at least one of Si, Ni, Mo, and Al in the second metal powder; a second supply unit configured to supply the second metal powder to the powder supply unit; a switching unit configured to switch between supplying the first metal powder and supplying the second metal powder to the powder supply unit; and a control unit configured to control the switching unit such that, when a beginning part of the clad layer is formed, the first metal powder is supplied from the first supply unit to the powder supply unit, and after the beginning part is formed, and the second metal powder is supplied from the second supply unit to the powder supply unit, wherein a supply position of the metal powder and an emission position of the laser beam are moved in a predetermined direction along the surface of the substrate, and the clad layer is formed on the surface of the substrate in the predetermined direction. 13 . The device according to claim 12 , wherein the control unit configured to control a laser output of the laser beam such that a laser output to the first metal powder when the beginning part of the clad layer is formed is lower than a laser output to the second metal powder after the beginning part is formed.

Assignees

Inventors

Classifications

  • containing copper · CPC title

  • B23K26/342Primary

    Build-up welding · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Laser welding for purposes other than joining · CPC title

  • C23C24/103Primary

    Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides · CPC title

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What does patent US2018272471A1 cover?
A first metal powder is supplied to a substrate to form a beginning part of a clad layer. After the beginning part is formed, the second metal powder is supplied to the substrate. A concentration of at least one of Si, Ni, Mo, and Al in the first metal powder is lower than a concentration thereof in the second metal powder.
Who is the assignee on this patent?
Toyota Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23K26/342. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Sep 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).