Electromagnetic shielding material

US2018263145A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018263145-A1
Application numberUS-201815917420-A
CountryUS
Kind codeA1
Filing dateMar 9, 2018
Priority dateMar 13, 2017
Publication dateSep 13, 2018
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided is an electromagnetic wave shielding material including a multilayer structure in which at least one metal foil and at least two resin layers are closely laminated, wherein both surfaces of each metal foil are closely laminated to the resin layers; wherein each metal foil satisfies the following relationship with each of the two resin layers adjacent to the metal foil: 0.02≤V M /V M ≤1.2, in which: V M is a volume fraction of the metal foil relative to a total volume of the metal foil and the resin layer; V M′ is (σ R −σ R′ )/(σ M +σ R −σ R′ ); σ M is a true stress (MPa) of the metal foil at breakage when a tensile stress is applied to the metal foil; σ R is a true stress (MPa) of the resin layer at breakage when a tensile stress is applied to the resin layer; and σ R′ is a true stress (MPa) of the resin layer when a logarithmic strain same as a logarithmic strain at breakage of the metal foil is applied to the resin layer.

First claim

Opening claim text (preview).

1 . An electromagnetic wave shielding material comprising a multilayer structure in which at least one metal foil and at least two resin layers are closely laminated, wherein both surfaces of each metal foil are closely laminated to the resin layers; wherein each metal foil satisfies the following relationship with each of the two resin layers adjacent to the metal foil: 0.02 ≤V M /V M′ ≤1.2, in which V M is a volume fraction of the metal foil relative to a total volume of the metal foil and the resin layer; V M′ is (σ R −σ R′ )/(σ M +σ R −σ R′ ); σ M is a true stress (MPa) of the metal foil at breakage when a tensile stress is applied to the metal foil; σ R is a true stress (MPa) of the resin layer at breakage when a tensile stress is applied to the resin layer; and σ R′ is a true stress (MPa) of the resin layer when a logarithmic strain same as a logarithmic strain at breakage of the metal foil is applied to the resin layer. 2 . The electromagnetic wave shielding material according to claim 1 , wherein each metal foil satisfies the following relationship with each of the two resin layers adjacent to the metal foil: 0.2 ≤V M /V M′ ≤0.6. 3 . The electromagnetic wave shielding material according to claim 1 , wherein each metal foil forming the electromagnetic wave shielding material has a thickness of 4 μm to 100 μm. 4 . The electromagnetic wave shielding material according to claim 1 , wherein each resin layer forming the electromagnetic wave shielding material has a thickness of 4 μm to 250 μm. 5 . The electromagnetic wave shielding material according to claim 1 , wherein the metal foil and the resin layers forming the electromagnetic wave shielding material are closely laminated by thermocompression bonding without interposing an adhesive layer. 6 . The electromagnetic wave shielding material according to claim 1 , wherein a total thickness of the at least one metal foil is 100 μm or less, and a total thickness of the resin layers is 500 μm or less. 7 . A method for producing an electromagnetic wave shielding molded article comprising molding the electromagnetic wave shielding material according to claim 1 . 8 . The method for producing the electromagnetic wave shielding molded article according to claim 7 , wherein the molding is carried out by pressure forming.

Assignees

Inventors

Classifications

  • H05K9/0084Primary

    comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition · CPC title

  • of nickel or cobalt · CPC title

  • Deposition of black chromium {, e.g. hexavalent chromium, CrVI} · CPC title

  • H05K9/0088Primary

    comprising a plurality of shielding layers; combining different shielding material structure · CPC title

  • Sheets, plates, blanks or films · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2018263145A1 cover?
Provided is an electromagnetic wave shielding material including a multilayer structure in which at least one metal foil and at least two resin layers are closely laminated, wherein both surfaces of each metal foil are closely laminated to the resin layers; wherein each metal foil satisfies the following relationship with each of the two resin layers adjacent to the metal foil: 0.02≤V M /V M ≤1…
Who is the assignee on this patent?
Jx Nippon Mining & Metals Corp
What technology area does this patent fall under?
Primary CPC classification H05K9/0084. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Sep 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).