Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body

US2018250738A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018250738-A1
Application numberUS-201815899865-A
CountryUS
Kind codeA1
Filing dateFeb 20, 2018
Priority dateMar 6, 2017
Publication dateSep 6, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A compound for metal powder injection molding includes secondary particles in which first metal particles are bound to one another, and a matrix region including a binder and second metal particles whose constituent material is different from that of the first metal particles. It is preferred that in the secondary particles, the first metal particles are bound to one another through the binder. It is also preferred that the average particle diameter of the second metal particles is smaller than that of the first metal particles.

First claim

Opening claim text (preview).

What is claimed is: 1 . A compound for metal powder injection molding, comprising: secondary particles in which first metal particles are bound to one another; and a matrix region including a binder and second metal particles whose constituent material is different from that of the first metal particles. 2 . The compound for metal powder injection molding according to claim 1 , wherein the constituent material of the first metal particles is any of an Fe-based alloy, an Ni-based alloy, and a Co-based alloy. 3 . The compound for metal powder injection molding according to claim 1 , wherein in the secondary particles, the first metal particles are bound to one another through the binder. 4 . The compound for metal powder injection molding according to claim 1 , wherein in the secondary particles, the first metal particles are adhered to one another. 5 . The compound for metal powder injection molding according to claim 1 , wherein the secondary particles are dispersed in the matrix region. 6 . The compound for metal powder injection molding according to claim 1 , wherein the average particle diameter of the second metal particles is smaller than that of the first metal particles. 7 . A metal powder molded body, comprising: secondary particles in which first metal particles are bound to one another; and a matrix region including a binder and second metal particles whose constituent material is different from that of the first metal particles. 8 . A method for producing a sintered body, comprising: injecting the compound for metal powder injection molding according to claim 1 into a molding die thereby obtaining a molded body; and firing the molded body thereby obtaining a sintered body. 9 . A method for producing a sintered body, comprising: injecting the compound for metal powder injection molding according to claim 2 into a molding die thereby obtaining a molded body; and firing the molded body thereby obtaining a sintered body. 10 . A method for producing a sintered body, comprising: injecting the compound for metal powder injection molding according to claim 3 into a molding die thereby obtaining a molded body; and firing the molded body thereby obtaining a sintered body. 11 . A method for producing a sintered body, comprising: injecting the compound for metal powder injection molding according to claim 4 into a molding die thereby obtaining a molded body; and firing the molded body thereby obtaining a sintered body. 12 . A method for producing a sintered body, comprising: injecting the compound for metal powder injection molding according to claim 5 into a molding die thereby obtaining a molded body; and firing the molded body thereby obtaining a sintered body. 13 . A method for producing a sintered body, comprising: injecting the compound for metal powder injection molding according to claim 6 into a molding die thereby obtaining a molded body; and firing the molded body thereby obtaining a sintered body. 14 . A sintered body, comprising: a first portion including a sintered material of first metal particles; and a second portion enclosing the first portion, and including a sintered material of second metal particles whose constituent material is different from that of the first metal particles. 15 . The sintered body according to claim 9 , wherein the average crystal grain diameter of the second portion is smaller than that of the first portion.

Assignees

Inventors

Classifications

  • Agglomerating · CPC title

  • containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent · CPC title

  • containing organic material comprising solvents, e.g. for slip casting · CPC title

  • Metallic powder coated with organic material · CPC title

  • Spray drying of solutions or suspensions · CPC title

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What does patent US2018250738A1 cover?
A compound for metal powder injection molding includes secondary particles in which first metal particles are bound to one another, and a matrix region including a binder and second metal particles whose constituent material is different from that of the first metal particles. It is preferred that in the secondary particles, the first metal particles are bound to one another through the binder.…
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B22F3/225. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Sep 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).