Multi-Element Bending Transducers and Related Methods and Devices

Patent metadata

Field	Value
Publication number	US-2018242066-A1
Application number	US-201815887065-A
Country	US
Kind code	A1
Filing date	Feb 2, 2018
Priority date	Feb 21, 2017
Publication date	Aug 23, 2018
Grant date	—

Abstract

Bending mode transducers are provided including a substrate made of a high density material, the substrate having a first surface and a second surface, opposite the first surface. A piezoelectric layer is provided on the first surface of the substrate and at least one patterned electrode is provided on the piezoelectric layer. A mounting block is on the at least one patterned electrode at least one electrical contact point is provided on the first surface of the substrate remote from the at least one patterned electrode. Related devices and methods are also provided.

First claim

That which is claimed is:

1 . A bending mode transducer comprising:
a substrate having a first surface and a second surface, opposite the first surface; a piezoelectric layer on the first surface of the substrate; at least one patterned electrode on the piezoelectric layer; a mounting block on the at least one patterned electrode; and at least two electrical contact points on the at least one patterned electrode.

2 . The transducer of claim 1 , further comprising alignment features on the substrate and/or the mounting block to facilitate alignment during a fabrication process.

3 . The transducer of claim 2 , wherein the alignment features comprise a plurality of holes and slots in the substrate and/or the mounting block.

4 . The transducer of claim 1 , wherein the substrate comprises stainless steel and has a thickness of from about 10 μm to about 500 μm.

5 . The transducer of claim 1 , wherein the mounting block comprises one of a ceramic material and an electrically insulating material.

6 . The transducer of claim 1 , further comprising an acoustic matching layer on the second surface of the substrate.

7 . The transducer of claim 1 , wherein the piezoelectric layer comprises PZT material and wherein the piezoelectric layer has a thickness of from about 20 μm to about 1000 μm.

8 . The transducer of claim 1 , wherein the at least one patterned electrode comprises a plurality of patterned electrodes.

9 . The transducer of claim 1 , wherein the transducer is an ultrasonic transducer configured for one of a gas meter, a water meter and a heat meter.

10 . A device, comprising:
at least one transducer, the at least one transducer comprising: a substrate having a first surface and a second surface, opposite the first surface; a piezoelectric layer on the first surface of the substrate; at least one patterned electrode on the piezoelectric layer; a mounting block on the at least one patterned electrode; and at least two electrical contact points on the at least one patterned electrode.

11 . A method of fabricating transducers, comprising:
providing a substrate including a high density material, the substrate having a first surface and a second surface, opposite the first surface; bonding a piezoelectric layer and electrodes to the first surface of the substrate; patterning the electrodes to provide at least one patterned electrode on the piezoelectric layer; and bonding a mounting block to the piezoelectric layer and the at least one patterned electrode.

12 . The method of claim 11 , wherein patterning the electrodes comprises patterning the electrodes using a laser ablation process.

13 . The method of claim 12 , wherein the electrodes comprise one of gold, nickel and silver.

14 . The method of claim 11 , wherein bonding the piezoelectric layer and the electrodes further comprises:
applying an adhesive to a surface of the substrate and/or the piezoelectric layer; compressing the substrate and the piezoelectric layer including the at least one patterned electrode together; and curing the adhesive such that the substrate and the piezoelectric layer are bonded.

15 . The method of claim 14 , wherein curing comprises curing the adhesive under heat and pressure.

16 . The method of claim 14 , wherein curing is followed by aligning the substrate with the mounting block using alignment features on the substrate and/or mounting block to facilitate alignment during a bonding process.

17 . The method of claim 16 , wherein the alignment features comprise a plurality of holes and slots in the substrate and/or the piezoelectric layer.

18 . The method of claim 17 , further comprising separating the transducers by partitioning the substrate.

19 . The method of claim 18 , wherein separating further comprises:
cutting the substrate on connecting tabs; and breaking the mounting block along laser-cut scribe lines.

20 . The method of claim 11 , wherein the mounting block comprises one of a ceramic material and an electrically insulating material.

Assignees

• Sensus Spectrum Llc

Inventors

• Buckland Justin Rorke

Classifications

• G10K11/004

  Mounting transducers, e.g. provided with mechanical moving or orienting device (mountings specially adapted to a particular sound-producing device, see the preceding groups G10K1/00 - G10K9/00, e.g. G10K1/26, G10K1/28, G10K9/22; arrangements of sonic watch equipment on submarines B63G8/39; buoys B63B22/00) · CPC title

• B06B1/0688

  with foil-type piezoelectric elements, e.g. PVDF · CPC title

• B06B1/0603

  using a piezoelectric bender, e.g. bimorph · CPC title

• B06B1/06

  operating with piezoelectric effect or with electrostriction (piezoelectric or electrostrictive devices per se H10N30/00) · CPC title

• H04R17/00

  Piezoelectric transducers; Electrostrictive transducers (piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners {H10N30/00}) · CPC title