Shielding for semiconductor optoelectronic devices and packages

Patent metadata

Field	Value
Publication number	US-2018235075-A1
Application number	US-201715434919-A
Country	US
Kind code	A1
Filing date	Feb 16, 2017
Priority date	Feb 16, 2017
Publication date	Aug 16, 2018
Grant date	—

Abstract

Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.

First claim

1 . A method comprising:
providing at least a portion of a semiconductor package including a first electronic component and a second electronic component attached to a board having a first grounding pad between the first electronic component and the second electronic component; applying compartmental shielding material to at least a portion of the grounding pad; applying heat to the compartmental shielding material at a first temperature for a first duration; applying a conformal coating shielding material on at least a portion of the first electronic component and the second electronic component, the conformal coating shield being in contact with at least one of a second grounding pad on the board or the compartmental shielding material; and applying heat to the conformal coating shielding material at a second temperature for a second duration.

2 . The method of claim 1 , wherein the first electronic component or the second electronic component comprise a central processing unit (CPU), a logic circuit, a memory circuit, a Long-Term Evolution (LTE) circuitry, a Bluetooth circuitry, a Wi-Fi circuitry, a photodetector, a photodiode, a laser diode, a microelectromechanical systems (MEMS) device, or a sensor.

3 . The method of claim 1 , wherein applying the compartmental shielding material comprises applying the compartmental shielding material using a spraying technique, a plating technique, a printing technique, or a dispensing technique.

4 . The method of claim 1 , wherein applying the conformal coating shielding material comprises applying the conformal coating shielding material using a spraying technique, a plating technique, a printing technique, or a dispensing technique.

5 . The method of claim 1 , wherein applying the compartmental shielding material comprises applying the compartmental shielding material using a plating technique, wherein the plating technique comprises an electrolytic plating technique or an electroless plating technique.

6 . The method of claim 1 , wherein applying the conformal coating shielding material comprises applying the conformal coating material using a plating technique, wherein the plating technique comprises an electrolytic plating technique or an electroless plating technique.

7 . The method of claim 1 , wherein applying the compartmental shielding material comprises applying the compartmental shielding material using a spraying technique, wherein the spraying technique comprises an atomization technique, an electrospray technique, or an ultrasonic technique.

8 . The method of claim 1 , wherein applying the conformal coating shielding material comprises applying the conformal coating shielding material using a spraying technique, wherein the spraying technique comprises an atomization technique, an electrospray technique, or an ultrasonic technique.

9 . The method of claim 1 , wherein applying the compartmental shielding material comprises applying the compartmental shielding material using a printing technique, wherein the printing technique comprises a vacuum printing technique.

10 . The method of claim 1 , wherein applying the conformal coating shielding material comprises applying the conformal coating shielding material using a printing technique, wherein the printing technique comprises a vacuum printing technique.

11 . The method of claim 1 , wherein applying the compartmental shielding material comprises applying the compartmental shielding material using a dispensing technique, wherein the dispensing technique comprises an Auger dispensing technique or a jet dispensing technique.

12 . The method of claim 1 , wherein applying the conformal coating shielding material comprises applying the conformal coating shielding material using a dispensing technique, wherein the dispensing technique comprises an Auger dispensing technique or a jet dispensing technique.

13 . The method of claim 1 , wherein the compartmental shielding material comprises sintering nanoparticles, non-sintering pastes, non-sintering inks, intermetallic compound forming, conductive particles.

14 . The method of claim 13 , wherein the sintering nanoparticles comprise silver or copper.

15 . The method of claim 13 , wherein the non-sintering pastes or the non-sintering inks comprise epoxy acrylic adhesive system or a polymer systems.

16 . The method of claim 13 , wherein the conductive particles include fibers, flakes, nanoparticles, or graphite.

17 . A semiconductor package, comprising:
a substrate including a first electronic component of a first electronic device and a second electronic component of a second electronic device, and a first grounding pad between the first electronic component and the second electronic component; a compartmental shielding material disposed on at least a portion of the first grounding pads, the compartmental shielding material applied between the first electronic device and the second electronic device; a conformal coating shielding material disposed on at least a portion of the first electronic component and the second electronic component, the conformal coating shield being in contact with the grounding pad or the compartmental shielding material.

18 . The semiconductor package of claim 17 , wherein the compartmental shielding material or the conformal coating shielding material comprises sintering nanoparticles, non-sintering pastes, non-sintering inks, intermetallic compound forming, conductive particles.

19 . The semiconductor package of claim 18 , wherein the sintering nanoparticles comprise silver or copper.

20 . The semiconductor package of claim 18 , wherein the non-sintering pastes or the non-sintering inks comprise a metal.

21 . The semiconductor package of claim 18 , wherein the non-sintering pastes or the non-sintering inks comprise epoxy acrylic adhesive system or other polymer systems.

22 . The semiconductor package of claim 18 , wherein the conductive particles include fibers, flakes, nanoparticles, or graphite.

23 . A device, comprising:
a substrate including a first electronic component and a second electronic component, and a first grounding pad between the first electronic component and the second electronic component; a compartmental shielding material disposed on at least a portion of the first grounding pads, the compartmental shielding material applied between the first electronic component and the second electronic component; a conformal coating shielding material disposed on at least a portion of the first electronic component and the second electronic component, the conformal coating shield being in contact with the grounding pad or the compartmental shielding material.

24 . The device of claim 23 , wherein the compartmental shielding material or the conformal coating shielding material comprises sintering nanoparticles, non-sintering pastes, non-sintering inks, intermetallic compound forming, conductive particles.

25 . The method of claim 23 , wherein the first electronic component or the second electronic component comprise a central processing unit (CPU), a logic circuit, a memory circuit, a Long-Term Evolution (LTE) circuitry, a Bluetooth circuitry, a Wi-Fi circuitry, a photodetector, a photodiode, a laser diode, a microelectromechanical systems (MEMS) device, or a sensor.

Assignees

• Intel Corp

Inventors

• Gaines Taylor
• Prakash Anna M
• Belman Ziv
• Schiffmann Baruch
• Hirshberg Arnon
• Wittenberg Ron
• Malamud Vladimir

Classifications

• H10W42/273

  the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W42/20 Primary

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title