Aluminium composite material for use in thermal flux-free joining methods and method for producing same

US2018221994A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018221994-A1
Application numberUS-201815945839-A
CountryUS
Kind codeA1
Filing dateApr 5, 2018
Priority dateOct 5, 2015
Publication dateAug 9, 2018
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Provided herein are embodiments of an aluminium composite material for use in thermal flux-free joining methods. The composite material includes at least one core layer having an aluminium core alloy and at least one outer solder layer of an aluminium solder alloy. The aluminium solder alloy has the following composition in wt %: 6.5%≤Si≤13%, Fe≤1%, 90 ppm≤Mg≤300 ppm, Bi≤500 ppm, Mn≤0.15%, Cu≤0.3%, Zn≤3%, and Ti≤0.3% with the remainder Al and unavoidable impurities individually at most 0.05%, in total at most 0.15%. The aluminium solder layer has an alkaline pickled or acid pickled surface. Embodiments also relate to a method for producing an aluminium composite material, a method for the thermal joining of components, and a thermally joined construction.

First claim

Opening claim text (preview).

1 . An aluminium composite material for use in thermal flux-free joining methods, comprising at least one core layer consisting of an aluminium core alloy and at least one outer solder layer provided on one or both sides of the core layer consisting of an aluminium solder alloy, characterised in that the aluminium solder alloy has the following composition in wt %: 6.5%≤Si≤13%, Fe≤1%, 90 ppm≤Mg≤300 ppm, Bi≤500 ppm, Mn≤0.15%, Cu≤0.3%, Zn≤3%, Ti≤0.30%, Remainder Al and unavoidable impurities individually at most 0.05%, in total at most 0.15% and the aluminium solder layer has an alkaline pickled or acid pickled surface. 2 . The aluminium composite material according to claim 1 , wherein the aluminium solder alloy has an Mg content in wt % of 90 ppm≤Mg≤200 ppm 3 . The aluminium composite material according to claim 1 , wherein the aluminium solder alloy has a Bi content in wt % of Bi≤280 ppm 4 . The aluminium composite material according to claim 1 , wherein the aluminium solder alloy meets the specifications of type AA4045 or type AA4343. 5 . The aluminium composite material according to claim 1 , wherein the aluminium solder alloy has an Mg content of at most 1.0 wt %, preferably 0.2%-0.6%, 0.05%-0.30% or less than 0.05 wt %. 6 . The aluminium composite material according to claim 1 , wherein the aluminium core alloy is an alloy of type AA3xxx, preferably of the types AA3003, AA3005, AA3017 or the type AA6xxx, preferably AA6063 or AA6060. 7 . The aluminium composite material according to claim 1 , wherein the average thickness of the aluminium composite material is from 0.05-6 mm, preferably from 0.2-3 mm. 8 . A method for producing an aluminium composite material, in particular an aluminium composite material according to claim 1 , comprising the steps of: providing at least one core layer consisting of an aluminium core alloy; and applying at least one outer solder layer consisting of an aluminium solder alloy on one or both sides of the core layer; wherein the aluminium solder alloy has the following composition in wt %: 6.5%≤Si≤13%, Fe≤1%, 90 ppm≤Mg≤300 ppm, Bi≤500 ppm, Mn≤0.15%, Cu≤0.3%, Zn≤3%, Ti≤0.30%, Remainder Al and unavoidable impurities individually at most 0.05%, in total at most 0.15%; and wherein the aluminium composite material is pickled with an aqueous, alkaline or acid pickling solution. 9 . The method according to claim 8 , wherein an acid, aqueous pickling solution is used containing: at least one mineral acid and at least one complexing agent or at least one acid of the group of short-chain carboxylic acids and at least one complexing agent; or at least one complexing acid. 10 . The method according to claim 9 , wherein the concentrations of the mineral acids in the pickling solution have the following limits: H 2 SO 4 : 0.1%-20 wt %, H 3 PO 4 : 0.1%-20 wt %, HCl: 0.1%-10 wt %, HF: 20 ppm-3.0 wt %, and optionally at least one surfactant is contained in the pickling solution. 11 . The method according to claim 8 , wherein an alkaline pickling solution is used containing 0.01-5 wt % NaOH, which optionally has at least 0.5-3 wt % of an aqueous mixture of 5-40 wt % sodium tripolyphosphate, 3-10 wt % sodium gluconate, 3-8 wt % non-ionic and anionic surfactants, optionally 0.5-70 wt % sodium carbonate. 12 . A method for thermally joining components, comprising the step of thermally joining at least one component comprising an aluminium composite material according to claim 1 to at least one additional component in a flux-free manner. 13 . The method according to claim 12 , wherein the flux-free thermal joining is carried out in a vacuum, in particular with a maximum pressure of 10 −5 mbar. 14 . The method according to claim 12 , wherein the flux-free thermal joining is carried out in a protective gas atmosphere. 15 . A thermally joined construction comprising at least one component comprising an aluminium composite material according to claim 1 ; and at least one additional component which in particular comprises aluminium or an aluminium alloy.

Assignees

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Classifications

  • Brazing of heat exchangers · CPC title

  • Alloys based on aluminium · CPC title

  • with silicon as the next major constituent · CPC title

  • Sheets or foils (B23K35/0244 takes precedence) · CPC title

  • all layers being formed of aluminium or aluminium alloys · CPC title

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What does patent US2018221994A1 cover?
Provided herein are embodiments of an aluminium composite material for use in thermal flux-free joining methods. The composite material includes at least one core layer having an aluminium core alloy and at least one outer solder layer of an aluminium solder alloy. The aluminium solder alloy has the following composition in wt %: 6.5%≤Si≤13%, Fe≤1%, 90 ppm≤Mg≤300 ppm, Bi≤500 ppm, Mn≤0.15%, Cu≤0…
Who is the assignee on this patent?
Eckhard Kathrin, Guessgen Olaf, Richter Thorsten, and 3 more
What technology area does this patent fall under?
Primary CPC classification B23K35/288. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Aug 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).