Lighting device and corresponding manufacturing method

Patent metadata

Field	Value
Publication number	US-2018209591-A1
Application number	US-201815877409-A
Country	US
Kind code	A1
Filing date	Jan 23, 2018
Priority date	Jan 24, 2017
Publication date	Jul 26, 2018
Grant date	—

Abstract

A lighting device comprising: an elongated laminar substrate having opposed front and back surfaces, one or more electrically-powered light radiation sources, e.g. LED sources, at the front surface of the substrate, a protective encapsulation sealingly encapsulating the substrate and the light radiation source(s), the encapsulation being light-permeable to facilitate propagation of light radiation from the device. The encapsulation includes thermally-conductive material at the back surface of the substrate.

First claim

1 . A lighting device, comprising:
an elongated laminar substrate having opposed front and back surfaces, at least one electrically-powered light radiation source at the front surface of the substrate, a protective encapsulation sealingly encapsulating the substrate and the at least one light radiation source, the encapsulation being light-permeable at the at least one light radiation source to facilitate propagation of light radiation from the device, the encapsulation including thermally-conductive material facing the back surface of the substrate.

2 . The lighting device of claim 1 , further comprising a flexible substrate encapsulated by a flexible encapsulation.

3 . The lighting device of claim 1 , wherein the thermally-conductive material comprises a matrix having thermally-conductive particles dispersed therein.

4 . The lighting device of claim 1 , further comprising a thermally-conductive layer between the back surface of the substrate and the encapsulation.

5 . The lighting device of claim 1 , wherein:
the encapsulation comprises a channel-shaped housing having a central wall and side walls laterally of the central wall, the housing including thermally-conductive material at the central wall, the substrate with the at least one light radiation source is located in the channel-shape of the housing with the back surface of the substrate towards the central wall of the housing, the encapsulation comprises a sealing mass extending over the front surface of the substrate and the at least one light radiation source from the one to the other of the side walls of the housing.

6 . The lighting device of claim 5 , wherein the side walls of the housing comprises mutually facing light-reflective surfaces.

7 . The lighting device of claim 1 , wherein the at least one light radiation source comprises an LED source.

8 . A method of manufacturing a lighting device, the method comprising:
providing an elongated laminar substrate having opposed front and back surfaces, providing at least one electrically-powered light radiation source at the front surface of the substrate, sealingly encapsulating the substrate and the at least one light radiation source with a protective encapsulation light-permeable at the at least one light radiation source to facilitate propagation of light radiation from the device, including thermally-conductive material in the encapsulation at a position facing the back surface of the substrate.

9 . The method of claim 8 , further comprising:
providing a channel-shaped mould comprising a bottom wall, lateral walls extending sidewise of the bottom wall and a pair of ribs protruding from the bottom wall inwardly of the channel shape of the mould, the ribs defining a central mould cavity therebetween and a pair of lateral mould cavities between the protruding ribs and the lateral walls of the mould, dispensing thermally-conductive material into the central mould cavity to provide a thermally-conductive filling therein, coupling the laminar substrate with the thermally-conductive filling in the central mould cavity, dispensing into the mould a sealing mass to sealingly cover the front surface of the substrate and the at least one light radiation source, the sealing mass penetrating into said lateral mould cavities to provide side extensions of the sealing mass sidewise of and spaced to the thermally-conductive material in the central mould cavity, disengaging from the mould the laminar substrate with the at least one light radiation source thereon coupled with said thermally-conductive material and said sealing mass, and dispensing into the spacings between the thermally-conductive material and said side extensions of the sealing mass one of:
a transparent or light diffusive material, or
a thermally-conductive material.

10 . The method of claim 8 , wherein the thermally-conductive material further comprises a matrix having thermally-conductive particles dispersed therein.

Assignees

• Osram Gmbh

Inventors

• Reiss Martin
• Didone' Roberto
• Pezzato Luigi
• Baldo Lorenzo

Classifications

• F21S4/22

  flexible or deformable, e.g. into a curved shape · CPC title

• F21V29/87

  Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor · CPC title

• F21V29/70

  characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

• F21Y2103/10

  comprising a linear array of point-like light-generating elements · CPC title

• F21V29/00

  Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems (lighting fixtures combined with outlets for air-treatment systems F24F13/078) · CPC title