Substrate container with enhanced containment

US2018204751A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018204751-A1
Application numberUS-201615743519-A
CountryUS
Kind codeA1
Filing dateJul 13, 2016
Priority dateJul 13, 2015
Publication dateJul 19, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Substrate containers and/or portions thereof for use in the semiconductor manufacturing industry can be formed by injection molding metal slurries. More particularly, such substrate containers and/or portions thereof can be formed by injection molding metal slurries containing magnesium or magnesium alloys. Substrate containers, wherein at least a portion of the substrate container is injection molded from a metal slurry containing magnesium or magnesium alloy can exhibit improved permeation control of moisture and oxygen over, and as compared to, comparable substrate carriers formed of polymer based materials. Exemplary substrate containers can include wafer containers, reticle pods, disk shippers and/or work-in-process boxes.

First claim

Opening claim text (preview).

1 - 9 . (canceled) 10 . A substrate container comprising a containment portion of the substrate container being formed of a magnesium thixomolded material, the containment portion having a coating on the surface of the magnesium thixomolded material, the containment portion further having substrate supports. 11 - 15 . (canceled) 16 . The substrate container of claim 10 , the substrate supports being substantially formed of the magnesium thixomolded material. 17 . The substrate container of, wherein at least a portion of the substrate container being formed of an injection molded polymer composition. 18 . The substrate carrier of claim 10 , the substrate container further comprising a component bonded to a coated surface of the magnesium thixomolded material. 19 . The substrate container of claim 10 , wherein the coating is a conversion coating. 20 . The substrate container of claim 10 , the coating thickness being 10 −4 to 10 −5 of an inch. 21 . The substrate container of claim 19 , wherein the conversion coating is selected from the group consisting of Alodine 5200 (Non Chromate), Alodine 5900 (Trivalent Chromate), Metalast TCP-HF; NH35 (Hexavalent Chromate), Tagnite, Anomag, and Keronite. 22 . (canceled) 23 . (canceled) 24 . The substrate container of claim 10 , wherein the containment portion comprises a plurality of corner portions and a plurality of wall portions and wherein the wall portions have a portion displaced from the plurality of corner portions and said portion displaced has a wall thickness of 60% or less of the wall thickness at one of the corner portions. 25 . The substrate container of claim 24 , wherein at least one wall portion having a thinned portion that is at least 30 percent less than the thickness of a region of at least one of the corner portions. 26 . The substrate container of claim 10 , further comprising a door, the door begin formed of a magnesium thixomolded material.

Assignees

Inventors

Classifications

  • characterised by the construction of the closed carrier · CPC title

  • characterised by substrate supports · CPC title

  • characterised by coupling elements, kinematic members, handles or elements to be externally gripped · CPC title

  • characterised by materials, roughness, coatings or the like · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US2018204751A1 cover?
Substrate containers and/or portions thereof for use in the semiconductor manufacturing industry can be formed by injection molding metal slurries. More particularly, such substrate containers and/or portions thereof can be formed by injection molding metal slurries containing magnesium or magnesium alloys. Substrate containers, wherein at least a portion of the substrate container is injection…
Who is the assignee on this patent?
Entegris Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/1911. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jul 19 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).