Separators for handling, transporting, or storing semiconductor wafers
US-2024429080-A1 · Dec 26, 2024 · US
US2018204751A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018204751-A1 |
| Application number | US-201615743519-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 13, 2016 |
| Priority date | Jul 13, 2015 |
| Publication date | Jul 19, 2018 |
| Grant date | — |
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Substrate containers and/or portions thereof for use in the semiconductor manufacturing industry can be formed by injection molding metal slurries. More particularly, such substrate containers and/or portions thereof can be formed by injection molding metal slurries containing magnesium or magnesium alloys. Substrate containers, wherein at least a portion of the substrate container is injection molded from a metal slurry containing magnesium or magnesium alloy can exhibit improved permeation control of moisture and oxygen over, and as compared to, comparable substrate carriers formed of polymer based materials. Exemplary substrate containers can include wafer containers, reticle pods, disk shippers and/or work-in-process boxes.
Opening claim text (preview).
1 - 9 . (canceled) 10 . A substrate container comprising a containment portion of the substrate container being formed of a magnesium thixomolded material, the containment portion having a coating on the surface of the magnesium thixomolded material, the containment portion further having substrate supports. 11 - 15 . (canceled) 16 . The substrate container of claim 10 , the substrate supports being substantially formed of the magnesium thixomolded material. 17 . The substrate container of, wherein at least a portion of the substrate container being formed of an injection molded polymer composition. 18 . The substrate carrier of claim 10 , the substrate container further comprising a component bonded to a coated surface of the magnesium thixomolded material. 19 . The substrate container of claim 10 , wherein the coating is a conversion coating. 20 . The substrate container of claim 10 , the coating thickness being 10 −4 to 10 −5 of an inch. 21 . The substrate container of claim 19 , wherein the conversion coating is selected from the group consisting of Alodine 5200 (Non Chromate), Alodine 5900 (Trivalent Chromate), Metalast TCP-HF; NH35 (Hexavalent Chromate), Tagnite, Anomag, and Keronite. 22 . (canceled) 23 . (canceled) 24 . The substrate container of claim 10 , wherein the containment portion comprises a plurality of corner portions and a plurality of wall portions and wherein the wall portions have a portion displaced from the plurality of corner portions and said portion displaced has a wall thickness of 60% or less of the wall thickness at one of the corner portions. 25 . The substrate container of claim 24 , wherein at least one wall portion having a thinned portion that is at least 30 percent less than the thickness of a region of at least one of the corner portions. 26 . The substrate container of claim 10 , further comprising a door, the door begin formed of a magnesium thixomolded material.
characterised by the construction of the closed carrier · CPC title
characterised by substrate supports · CPC title
characterised by coupling elements, kinematic members, handles or elements to be externally gripped · CPC title
characterised by materials, roughness, coatings or the like · CPC title
Electricity · mapped topic
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