Display apparatus and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2018197899-A1
Application number	US-201815911243-A
Country	US
Kind code	A1
Filing date	Mar 5, 2018
Priority date	Aug 31, 2015
Publication date	Jul 12, 2018
Grant date	—

Abstract

A method of manufacturing a display apparatus includes separating a light-emitting diode (“LED”) chip from a base substrate; disposing the separated light-emitting diode chip in a solution; disposing a substrate including a first electrode thereon, in the solution; with the separated light-emitting diode chip and the substrate including the first electrode thereon in the solution, applying a negative voltage to the substrate to attract the separated light-emitting diode chip to the first electrode on the substrate; mounting the light-emitting diode chip attracted to the first electrode, on the first electrode; and removing the substrate with the light-emitting diode chip mounted on the first electrode from the solution and drying the removed substrate, to form the display apparatus.

First claim

What is claimed is:

1 . A display apparatus comprising:
a substrate comprising a first recess and a second recess; a first light-emitting diode chip which emits a first color and is mounted on the first recess; a second light-emitting diode chip which emits a second color and is mounted on the second recess, the second color being different from the first color; and an encapsulation member which encapsulates the first light-emitting diode chip and the second light-emitting diode chip.

2 . The apparatus of claim 1 , wherein the first recess and the second recess have the same shape.

3 . The apparatus of claim 1 , wherein the first recess and the second recess have different shapes from each other.

4 . The apparatus of claim 1 , wherein the first light-emitting diode chip and the second light-emitting diode chip each include:
a first electrode and a second electrode, and the first electrode and the second electrode are arranged in a direction toward the substrate.

5 . The apparatus of claim 4 , wherein first electrode pad is disposed closer to the substrate than the second electrode pad.

6 . The apparatus of claim 4 , wherein the first recess and the second recess each include a first electrode and the second electrode spaced apart from the first electrode,
the first electrode contacts the first electrode pad, and the second electrode contacts the second electrode pad.

7 . The apparatus of claim 6 , further comprising a thin film transistor between the substrate, and each of the first and second recesses,
wherein one of the first electrode and the second electrode is electrically connected to the thin film transistor.

8 . The apparatus of claim 7 , further comprising a bank between the first electrode and the thin film transistor, the bank covering an edge of the first electrode.

9 . The apparatus of claim 1 , wherein the encapsulation member individually encapsulates each of the first light-emitting diode chip and the second light-emitting diode chip.

10 . The apparatus of claim 1 , wherein the encapsulation member commonly encapsulates both of the first light-emitting diode chip and the second light-emitting diode chip.

11 . A display apparatus comprising:
a substrate comprising a first recess, a second recess and a third recess; a first light-emitting diode chip mounted on the first recess; a second light-emitting diode chip mounted on the second recess; a third light-emitting diode chip mounted on the third recess; and an encapsulation member which encapsulates the first light-emitting diode chip, the second light-emitting diode chip and the third light-emitting diode chip, wherein the first light-emitting diode chip emits a first color, the second light-emitting diode chip emits a second color different from the first color, and the third light-emitting diode chip emits a third color different from the first color and the second color, and the display apparatus emits a white color as a mixture of the first, second and third colors.

Assignees

• Samsung Display Co Ltd

Inventors

• Bae Jongsung
• Kim Mugyeom

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/00

  Package configurations · CPC title

• H01L25/50

  Electricity · mapped topic

• H01L33/62

  Electricity · mapped topic

• H01L2933/0066

  Electricity · mapped topic