Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same

Patent metadata

Field	Value
Publication number	US-2018197818-A1
Application number	US-201815917551-A
Country	US
Kind code	A1
Filing date	Mar 9, 2018
Priority date	Dec 15, 2014
Publication date	Jul 12, 2018
Grant date	—

Abstract

A wiring board includes an electronic component laterally surrounded by a stiffener, and a third routing circuitry disposed beyond the space laterally surrounded by the stiffener and extends over the stiffener. The electronic component includes a first routing circuitry, an encapsulant, an array of vertical connecting elements and a second routing circuitry integrated together. The mechanical robustness of the stiffener can prevent the wiring board from warping. The embedded semiconductor device is electrically coupled to the first routing circuitry and surrounded by the vertical connecting elements in electrical connection with the first and second routing circuitries. The first routing circuitry provides primary fan-out routing for another semiconductor device to be assembled on the wiring board, whereas the third routing circuitry not only provides further fan-out wiring structure, but also mechanically binds the electronic component with the stiffener.

First claim

What is claimed is:

1 . A wiring board, comprising:
an electronic component that includes a first semiconductor device, an encapsulant, an array of vertical connecting elements, a first routing circuitry and a second routing circuitry, wherein (i) the first semiconductor device and the vertical connecting elements are electrically coupled to the first routing circuitry, (ii) the encapsulant laterally covers the first semiconductor device and the vertical connecting elements and has a first surface facing in the first routing circuitry and a second surface opposite to the first surface, and (iii) the second routing circuitry is disposed on the second surface of the encapsulant and electrically connected to the first routing circuitry through the vertical connecting elements; a stiffener that laterally surrounds the electronic component and has an interior sidewall surface adjacent to peripheral edges of the electronic component; and a third routing circuitry that is disposed over the second routing circuitry and laterally extends over the stiffener, wherein the third routing circuitry is electrically coupled to the second routing circuitry.

2 . The wiring board of claim 1 , wherein the third routing circuitry includes at least one conductive trace laterally extending beyond peripheral edges of the second routing circuitry.

3 . The wiring board of claim 1 , further comprising additional vertical connecting elements in the stiffener, wherein the additional vertical connecting elements are electrically coupled to the third routing circuitry.

4 . The wiring board of claim 1 , wherein the first routing circuitry has an exposed surface facing away from the first surface of the encapsulant.

5 . The wiring board of claim 4 , wherein a portion of the interior sidewall surface of the stiffener and the exposed surface of the first routing circuitry form a cavity.

6 . A face-to-face semiconductor assembly, comprising:
the wiring board of claim 1 ; and a second semiconductor device face-to-face electrically coupled to the first semiconductor device through the first routing circuitry between the first semiconductor device and the second semiconductor device.

7 . The face-to-face semiconductor assembly of claim 6 , wherein a portion of the interior sidewall surface of the stiffener and a surface of the first routing circuitry form a cavity, and the second semiconductor device is disposed in the cavity.

8 . The face-to-face semiconductor assembly of claim 6 , wherein the wiring board further comprises additional vertical connecting elements in the stiffener, and the additional vertical connecting elements are electrically coupled to the third routing circuitry.

9 . The face-to-face semiconductor assembly of claim 6 , further comprising a heat spreader that is attached to an inactive surface of the second semiconductor device and laterally extends over the stiffener.

10 . A method of making a wiring board, comprising:
providing an electronic component over a sacrificial carrier, the electronic component including a semiconductor device, an encapsulant, an array of vertical connecting elements, a first routing circuitry and a second routing circuitry, wherein (i) the first routing circuitry is detachably adhered over the sacrificial carrier and adjacent to a first surface of the encapsulant, (ii) the semiconductor device and the vertical connecting elements are embedded in the encapsulant and electrically coupled to the first routing circuitry, and (iii) the second routing circuitry is disposed on a second surface of the encapsulant opposite to the first surface and electrically connected to the first routing circuitry through the vertical connecting elements; providing a stiffener that laterally surrounds the electronic component and the sacrificial carrier; forming a third routing circuitry that is disposed over the second routing circuitry and laterally extends over the stiffener, wherein the third routing circuitry is electrically coupled to the second routing circuitry; and removing the sacrificial carrier from the first routing circuitry.

11 . The method of claim 10 , wherein the step of providing the electronic component over the sacrificial carrier includes:
providing the first routing circuitry detachably adhered over the sacrificial carrier; electrically coupling the semiconductor device to the first routing circuitry; forming the vertical connecting elements; providing the encapsulant on the first routing circuitry; and forming the second routing circuitry on the encapsulant.

12 . The method of claim 10 , wherein the step of forming the third routing circuitry includes electrically coupling the third routing circuitry to additional vertical connecting elements in the stiffener.

Assignees

• Bridge Semiconductor Corp

Inventors

• Lin Charles W C
• Wang Chia-Chung

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title