Method and apparatus for repairing composite material using solvation process

US2018194918A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018194918-A1
Application numberUS-201815865261-A
CountryUS
Kind codeA1
Filing dateJan 9, 2018
Priority dateJan 12, 2017
Publication dateJul 12, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Disclosed are a method and an apparatus for repairing composite materials using a solvation process, in which, in the repair of composite materials comprising a matrix resin and a filler fiber, a solution capable of depolymerizing the matrix resin is provided to a portion to be repaired of the composite material to depolymerize the matrix resin. By removing the matrix resin constituting the composite material by solvating it with a solvent while leaving the internal filler fibers, it is possible to secure continuity of the fiber skeleton of the composite material even after the repair, perform very easy repair, and minimize damage to the fiber skeleton.

First claim

Opening claim text (preview).

What is claimed is: 1 . An apparatus for repairing composite material comprising a matrix resin and a filler fiber using a solvation process, comprising: a depolymerization solution supply device for providing a depolymerization solution capable of depolymerizing the matrix resin to a portion to be repaired of the composite material. 2 . The apparatus for repairing composite material using a solvation process according to claim 1 , wherein the depolymerization solution comprises a compound represented by the chemical formula XOmYn wherein X is hydrogen or an alkali metal or an alkaline earth metal, Y is halogen, m satisfies 1≤m≤8, and n satisfies 1≤n≤6; and a reaction solvent, and in the reaction solvent, X can be dissociated from XOmYn and Y radical can be provided; or the depolymerization solution comprises a transition metal salt comprising a transition metal; and a reaction solvent, wherein in the reaction solvent, the transition metal salt can be dissociated and an oxidation reaction of a cured epoxy resin mediated by a transition metal can occur. 3 . The apparatus for repairing composite material using a solvation process according to claim 2 , wherein the reaction solvent is a H 2 O-based reaction solvent comprising H 2 O and having a dielectric constant of 65 or more, 70 or more, 75 or more, or 80 or more. 4 . The apparatus for repairing composite material using a solvation process according to claim 2 , wherein the reaction solvent is water alone. 5 . The apparatus for repairing composite material using a solvation process according to claim 2 , wherein the compound is one or more selected from the group consisting of HOF, HOCl, HOBr, HOI, NaOF, NaOCl, NaOBr, NaOI, LiOF, LiOCl, LiOBr, LiOI, KOF, KOCl, KOBr, KOI, HO 2 F, HO 2 Cl, HO 2 Br, HO 2 I, NaO 2 F, NaO 2 Cl, NaO 2 Br, NaO 2 I, LiO 2 F, LiO 2 Cl, LiO 2 Br, LiO 2 I, KO 2 F, KO 2 Cl, KO 2 Br, KO 2 I, Ca(OF) 2 , Ca(OCl) 2 , Ca(OBr) 2 , Ca(OI) 2 , HO 3 F, HO 3 Cl, HO 3 Br, HO 3 I, NaO 3 F, NaO 3 Cl, NaO 3 Br, NaO 3 I, LiO 3 F, LiO 3 Cl, LiO 3 Br, LiO 3 I, KO 3 F, KO 3 Cl, KO 3 Br, KO 3 I, HO 4 F, HO 4 Cl, HO 4 Br, HO 4 I, NaO 4 F, NaO 4 Cl, NaO 4 Br, NaO 4 I, LiO 4 F, LiO 4 Cl, LiO 4 Br, LiO 4 I, KO 4 F, KO 4 Cl, KO 4 Br, KO 4 I, NaOCl 6 , MgO 6 F 2 , MgO 6 Cl 2 , MgO 6 Br 2 , MgO 6 I 2 , CaO 6 F 2 , CaO 6 Cl 2 , CaO 6 Br 2 , CaO 6 I 2 , SrO 6 F 2 , SrO 6 Cl 2 , SrO 6 Br 2 , SrO 6 I 2 , BaO 6 F 2 , BaO 6 Cl 2 , BaO 6 Br 2 , BaO 6 I 2 , NaOCl 3 , NaOCl 4 , MgO 8 Cl 2 , CaO 8 Cl 2 , SrO 8 Cl 2 , and BaO 8 Cl 2 . 6 . The apparatus for repairing composite material using a solvation process according to claim 2 , wherein the transition metal salt is one or more selected from the group consisting of KMnO 4 , MnO 2 , K 2 MnO 4 , MnSO 4 , CrO 3 , Na 2 Cr 2 O 7 , K 2 Cr 2 O 7 , ZnCr 2 O 7 , H 2 CrO 4 , pyridinium chlorochromate, pyridinium dichromate, V 2 O 5 , RuCl 3 , RuO 2 , tetrapropylammonium perruthenate, MoO 3 , K 3 [Fe(CN) 6 ], FeCl 3 , Fe(NO 3 ) 3 nonahydrate, MeReO 3 , CuCl, Cu(ClO 4 ) 2 , Cu(HCO 2 ) 2 Ni(HCO 2 ) 2 , Cu(OAc) 2 , OsO 4 , and (NH 4 ) 2 Ce(NO 3 ) 6 . 7 . The apparatus for repairing composite material using a solvation process according to claim 1 , wherein the apparatus comprises a depolymerization solution storage device for storing a solution capable of depolymerizing the resin; and the depolymerization solution supply device for receiving a depolymerization solution from the depolymerization solution storage device and supplying it to the portion to be repaired of the composite material. 8 . The apparatus for repairing composite material using a solvation process according to claim 7 , wherein the apparatus further comprises a heater for heating a depolymerization solution. 9 . The apparatus for repairing composite material using a solvation process according to claim 8 , wherein the apparatus further comprises: as for the depolymerization solution storage device, a depolymerization solution storage tank; as for the depolymerization solution supply device, a depolymerization solution contact device for receiving a depolymerization solution from the depolymerization solution storage tank and providing it such that the solution contacts the portion to be repaired of fiber reinforced plastic; as for the heater, a heater tank for accommodating and heating the depolymerization solution whose temperature becomes lowered after the contact with the portion to be repaired; and a pump for circulating a depolymerization solution between the depolymerization solution storage tank and the heater tank. 10 . The apparatus for repairing composite material using a solvation process according to claim 8 , wherein the apparatus further comprises: as for the depolymerization solution storage device, a depolymerization solution storage tank; as for the depolymerization solution supply device, a depolymerization solution contact device for receiving a depolymerization solution from the depolymerization solution storage tank and providing it such that the solution contacts the portion to be repaired of fiber reinforced plastic; as for the heater a heater for heating the depolymerization solution storage tank; and a pump for circulating a depolymerization solution from the depolymerization solution storage tank to the depolymerization solution contact device. 11 . The apparatus for repairing composite material using a solvation process according to claim 8 , wherein the apparatus further comprises: as for the depolymerization solution storage device, a depolymerization solution storage tank; as for the depolymerization solution supply device, a depolymerization solution contact device for receiving a depolymerization solution from the depolymerization solution storage tank and providing it such that the solution contacts the portion to be repaired of fiber reinforced plastic; as for the heater, a heater for heating a depolymerization solution transfer pipe located between the depolymerization solution storage tank and the depolymerization solution contact device; and a pump for circulating a depolymerization solution from the depolymerization solution storage tank to the depolymerization solution contact device. 12 . The apparatus for repairing composite material using a solvation process according to claim 8 , wherein the apparatus further comprises: as for the depolymerization solution supply device, a depolymerization solution contact device for receiving a depolymerization solution from the depolymerization solution storage tank and providing it such that the solution contacts the portion to be repaired of fiber reinforced plastic; and wherein the deolymerization solution contact device further comprises a vacuum absorber. 13 . The apparatus for repairing composite material using a solvation process according to claim 8 , wherein the apparatus further comprises: as for the depolymerization solution supply device, a depolymerization solution contact device for receiving a depolymerization solution from the depolymerization solution storage tank and providing it such that the solution contacts the portion to be repaired of fiber reinforced plastic; wherein the depolymerization solution contact device further comprises a spray nozzle for spraying a depolymerization solution; and a recovery pipe for recovering the depolymerization solution after contact with the portion to be repaired. 14 . The apparatus for repairing composite material using a solvation process according to claim 8 , wherein the heater heats a depolymerization solution to 20-200° C. or 20-100° C. . 15 . The apparatus for repairing composite material using

Assignees

Inventors

Classifications

  • for removing the element having caused the damage · CPC title

  • for applying liquid or other fluent material only at particular parts of the work (B05C3/02 takes precedence) · CPC title

  • B29C73/02Primary

    using liquid or paste-like material (B29C73/16 takes precedence) · CPC title

  • heating or cooling through the walls or internal parts of the container, e.g. circulation of fluid inside the walls · CPC title

  • C08J11/16Primary

    by treatment with inorganic material (C08J11/14 takes precedence) · CPC title

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What does patent US2018194918A1 cover?
Disclosed are a method and an apparatus for repairing composite materials using a solvation process, in which, in the repair of composite materials comprising a matrix resin and a filler fiber, a solution capable of depolymerizing the matrix resin is provided to a portion to be repaired of the composite material to depolymerize the matrix resin. By removing the matrix resin constituting the com…
Who is the assignee on this patent?
Korea Inst Sci & Tech
What technology area does this patent fall under?
Primary CPC classification B29C73/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jul 12 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).