Display devices and methods for forming display devices

Patent metadata

Field	Value
Publication number	US-2018190876-A1
Application number	US-201715659947-A
Country	US
Kind code	A1
Filing date	Jul 26, 2017
Priority date	Jan 3, 2017
Publication date	Jul 5, 2018
Grant date	—

Abstract

A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate, and an adhesion film disposed on the conductive pad. The adhesion film includes a plurality of conductive particles. The display device also includes a light-emitting component disposed on the adhesion film. The light-emitting component includes a connection feature. The display device also includes a protection layer partially surrounding the light-emitting component. The connection feature of the light-emitting component has a lower portion not surrounded by the protection layer. The adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0<t≤T−d.

First claim

1 . A display device, comprising:
a thin-film transistor substrate; a conductive pad disposed on the thin-film transistor substrate; an adhesion film disposed on the conductive pad, the adhesion film comprising a plurality of conductive particles; a light-emitting component disposed on the adhesion film, the light-emitting component comprising a connection feature; and a protection layer partially surrounding the light-emitting component, wherein the connection feature has a lower portion not surrounded by the protection layer, and wherein the adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0<t≤T−d.

2 . The display device as claimed in claim 1 , wherein the connection feature comprises a first bump and a second bump, a distance G is between the first bump and the second bump, and d≤G/2.

3 . The display device as claimed in claim 2 , wherein the protection layer fills a gap between the first bump and the second bump.

4 . The display device as claimed in claim 1 , wherein d≤T≤3d.

5 . The display device as claimed in claim 1 , wherein the lower portion of the connection feature comprises a first metal, the conductive pad comprises a second metal, the plurality of conductive particles comprises a third metal, and wherein the first metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof, the second metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof, and the third metal comprises Sn, Ag, In, Cu, Au, Ni, Pd, Cr, Al, Ti, or a combination thereof.

6 . The display device as claimed in claim 1 , wherein the lower portion of the connection feature comprises a first metal, the conductive pad comprises a second metal, the plurality of conductive particles comprises a third metal, and wherein the first metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, Ni, Pd, Cr, Al, Ti, or a combination thereof, the second metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, Ni, Pd, Cr, Al, Ti, or a combination thereof, and the third metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof.

7 . The display device as claimed in claim 1 , wherein the protection layer comprises an organic sub-layer and an inorganic sub-layer surrounding the organic sub-layer.

8 . The display device as claimed in claim 7 , wherein outermost sidewalls of the organic sub-layer is between outermost sidewalls of the light-emitting component.

9 . The display device as claimed in claim 8 , wherein outermost sidewalls of the inorganic sub-layer is between outermost sidewalls of the light-emitting component.

10 . The display device as claimed in claim 7 , wherein the protection layer further comprises another inorganic sub-layer, and the organic sub-layer is interposed between the inorganic sub-layer and the another inorganic sub-layer.

11 . A method for forming a display device, comprising:
providing a first temporary substrate with a first adhesion film thereon; providing a carrier with a plurality of light-emitting components thereon; attaching the plurality of light-emitting components onto the first temporary substrate through the first adhesion film; removing the carrier from the plurality of light-emitting components; providing a second temporary substrate with a second adhesion film thereon; attaching the plurality of light-emitting components onto the second temporary substrate through the second adhesion film; removing the first adhesion film and the first temporary substrate from the plurality of light-emitting components; bonding the plurality of light-emitting components onto a thin-film transistor substrate; removing the second temporary substrate from the second adhesion film; and removing the second adhesion film from the plurality of light-emitting components.

12 . The method as claimed in claim 11 , wherein the step of removing the second adhesion film from the plurality of light-emitting components comprises selectively debonding a portion of the second adhesion film.

13 . The method as claimed in claim 11 , wherein the step of removing the first adhesion film and the first temporary substrate from the plurality of light-emitting components comprises exposing the first adhesion film to a light of a first wavelength, and the step of removing the second adhesion film from the plurality of light-emitting components comprises exposing the second adhesion film to another light of a second wavelength that is different from the first wavelength.

14 . The method as claimed in claim 11 , wherein one of the first adhesion film and the second adhesion film is a UV-light debondable film, and the other one of the first adhesion film and the second adhesion film is a heat debondable film.

15 . The method as claimed in claim 11 , wherein at least one of the plurality of light-emitting components on the carrier is partially surrounded by a protection layer, and the protection layer comprises an organic sub-layer and an inorganic sub-layer.

16 . The method as claimed in claim 11 , further comprising:
forming a filler layer on the thin-film transistor substrate before the step of bonding the plurality of light-emitting components onto the thin-film transistor substrate.

17 . The method as claimed in claim 11 , wherein the second adhesion film is a patterned adhesion film.

18 . The method as claimed in claim 17 , wherein the second adhesion film comprises a plurality of adhesive pads, and a pitch of the plurality of adhesive pads is an integer multiple of a pitch of the plurality of light-emitting components on the first temporary substrate.

19 . A method for forming a display device, comprising:
providing a first temporary substrate with a first plurality of light-emitting components thereon; providing a first transfer substrate with a first plurality of adhesive pads thereon, wherein a pitch of the first plurality of adhesive pads is an integer multiple of a pitch of the first plurality of light-emitting components on the first temporary substrate; attaching a first group of the first plurality of light-emitting components onto a first group of the first plurality of adhesive pads on the first transfer substrate; removing the first temporary substrate, while leaving the first group of the first plurality of light-emitting components on the first transfer substrate; attaching a second group of the first plurality of light-emitting components onto a second group of the first plurality of adhesive pads on the first transfer substrate; removing the first temporary substrate, while leaving the second group of the first plurality of light-emitting components on the first transfer substrate; and
bonding the first group and the second group of the first plurality of light-emitting components onto a thin-film transistor substrate.

20 . The method as claimed in claim 19 , further comprising:
forming a filler layer on the thin-film transistor substrate before the step of bonding the first group and the second group of the first plurality of light-emitting components onto the thin-film transistor substrate.

21 . The method as claimed in claim 19 , further comprising:
providing a second transfer substrate with a second plurality of light-emitting components thereon, wherein the second plurality of light-emitting components are attached onto the second transfer substrate through a second plurality of adhesive pads; and
bonding the

Assignees

• Innolux Corp

Inventors

• Liu Tung-Kai
• Hsieh Tsau-Hua
• Wang Hui-Chieh
• Kuo Shu-Ming
• Chao Ming-I
• Hu Shun-Yuan

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L25/0753

  Electricity · mapped topic

• H01L2933/0066

  Electricity · mapped topic

• H01L2933/0025

  Electricity · mapped topic