Engineered Stone and Manufacturing Method Thereof

Patent metadata

Field	Value
Publication number	US-2018179110-A1
Application number	US-201715807673-A
Country	US
Kind code	A1
Filing date	Nov 9, 2017
Priority date	Dec 23, 2016
Publication date	Jun 28, 2018
Grant date	—

Abstract

An engineered stone includes a light transmitting mother material (I) and a phosphorescent chip (II). The light transmitting mother material (I) includes about 7 wt % to about 12 wt % of an unsaturated polyester resin (A) and about 88 wt % to about 93 wt % of a silica-containing compound (B) based on a total amount of the unsaturated polyester resin (A) and the silica-containing compound (B) of the light transmitting mother material (I), and further includes about 0.01 part by weight to about 1 part by weight of an organic/inorganic pigment (C) based on about 100 parts by weight of the unsaturated polyester resin (A). The phosphorescent chip (II) includes about 8 wt % to about 15 wt % of an unsaturated polyester resin (A′), about 85 wt % to about 92 wt % of a silica-containing compound (B′) based on a total amount of the unsaturated polyester resin (A′) and the silica-containing compound (B′) of the phosphorescent chip (II), and further includes about 2 parts by weight to about 10 parts by weight of a phosphorescent pigment (D) based on about 100 parts by weight of the unsaturated polyester resin (A′). The silica-containing compound (B′) includes about 20 wt % to about 30 wt % of a silica powder (b1′) based on a total amount of the phosphorescent chip (II).

First claim

What is claimed is:

1 . An engineered stone, comprising
a light transmitting mother material (I) and a phosphorescent chip (II), wherein the light transmitting mother material (I) includes about 7 wt % to about 12 wt % of an unsaturated polyester resin (A) and about 88 wt % to about 93 wt % of a silica-containing compound (B) based on a total amount of the unsaturated polyester resin (A) and the silica-containing compound (B) of the light transmitting mother material (I), the light transmitting mother material (I) further includes about 0.01 part by weight to about 1 part by weight of an organic/inorganic pigment (C) based on about 100 parts by weight of the unsaturated polyester resin (A), the phosphorescent chip (II) includes about 8 wt % to about 15 wt % of an unsaturated polyester resin (A′) and about 85 wt % to about 92 wt % of a silica-containing compound (B′) based on a total amount of the unsaturated polyester resin (A′) and the silica-containing compound (B′) of the phosphorescent chip (II), the phosphorescent chip (II) further includes about 2 parts by weight to about 10 parts by weight of a phosphorescent pigment (D) based on about 100 parts by weight of the unsaturated polyester resin (A′), and the silica-containing compound (B′) includes about 20 wt % to about 30 wt % of a silica powder (b1′) based on a total amount of the phosphorescent chip (II).

2 . The engineered stone of claim 1 , wherein the silica-containing compound (B) includes a silica powder (b1), a silica sand (b2), and a quartz chip (b3).

3 . The engineered stone of claim 2 , wherein an average particle diameter of the silica powder (b1) is greater than about 0 μm and less than or equal to about 45 μm, an average particle diameter of the silica sand (b2) is greater than or equal to about 0.1 mm and less than about 1.2 mm, and an average particle diameter of the quartz chip (b3) is greater than or equal to about 1.2 mm and less than or equal to about 6.0 mm.

4 . The engineered stone of claim 2 , wherein the light transmitting mother material (I) includes:
the silica powder (b1) in an amount of about 20 wt % to about 30 wt % based on a total amount of the light transmitting mother material (I), the silica sand (b2) in an amount of about 35 wt % to about 45 wt % based on a total amount of the light transmitting mother material (I), and the quartz chip (b3) in an amount of about 10 wt % to about 30 wt % based on a total amount of the light transmitting mother material (I).

5 . The engineered stone of claim 1 , wherein the silica-containing compound (B′) further includes silica sand (b2′).

6 . The engineered stone of claim 5 , wherein an average particle diameter of the silica powder (b1′) is greater than about 0 μm and less than or equal to about 45 μm and an average particle diameter of the silica sand (b2′) is greater than or equal to about 0.1 mm and less than about 1.2 mm.

7 . The engineered stone of claim 5 , wherein the phosphorescent chip (II) includes the silica sand (b2′) in an amount of about 60 wt % to about 70 wt % based on a total amount of the phosphorescent chip (II).

8 . The engineered stone of claim 1 , wherein the light transmitting mother material (I) and the phosphorescent chip (II) each further independently include a curing agent, a curing accelerator, and/or a cross-linking agent.

9 . The engineered stone of claim 8 , wherein the cross-linking agent is a silane-based cross-linking agent.

10 . The engineered stone of claim 1 , wherein the engineered stone has a diffuse transmittance of greater than or equal to about 6.0% and maintains luminance of greater than or equal to 7.0 mcd/m 2 after one hour.

11 . The engineered stone of claim 1 , wherein the phosphorescent chip (II) is an amorphous phosphorescent chip.

12 . A method for manufacturing an engineered stone, comprising
preparing a phosphorescent resin composition (ii) including about 8 wt % to about 15 wt % of an unsaturated polyester resin (A′), about 85 wt % to about 92 wt % of a silica-containing compound (B′), and a phosphorescent pigment (D), wherein the phosphorescent pigment (D) is included in an amount of about 2 parts by weight to about 10 parts by weight based on about 100 parts by weight of the unsaturated polyester resin (A′), and the silica-containing compound (B′) includes about 20 wt % to about 30 wt % of a silica powder (b1′) based on a total amount of the phosphorescent resin composition (ii); dispersing the phosphorescent resin composition (ii) using a dispersing equipment; vacuum-vibration-compression molding the phosphorescent resin composition (ii) dispersed to have a predetermined shape and molding it into a sheet having a phosphorescence effect; crushing the sheet having the phosphorescence effect to prepare a phosphorescent chip (II); preparing a light transmitting resin composition (i) including about 7 wt % to about 12 wt % of an unsaturated polyester resin (A) and about 88 wt % to about 93 wt % of a silica-containing compound (B), and further including about 0.01 part by weight to about 1 part by weight of an organic/inorganic pigment (C) based on about 100 parts by weight of the unsaturated polyester resin (A′); mixing the light transmitting resin composition (i) with the phosphorescent chip (II) to prepare an engineered stone mixture; dispersing the engineered stone mixture using a dispersing equipment to have a predetermined shape; and vacuum-vibration-compression molding a uniformly distributed engineered stone mixture to manufacture an engineered stone.

13 . The method of claim 12 , wherein the silica-containing compound (B) includes a silica powder (b1) having an average particle diameter of greater than about 0 μm and less than or equal to about 45 μm, a silica sand (b2) having an average particle diameter of greater than or equal to about 0.1 mm and less than about 1.2 mm, and a quartz chip (b3) having an average particle diameter of greater than or equal to about 1.2 mm and less than or equal to about 6.0 mm, and
the silica powder (b1) is included in an amount of about 20 wt % to about 30 wt % based on a total amount of the light transmitting resin composition (i), the silica sand (b2) is included in an amount of about 35 wt % to about 45 wt % based on a total amount of the light transmitting resin composition (i), and the quartz chip (b3) included in an amount of about 10 wt % to about 30 wt % based on a total amount of the light transmitting resin composition (i).

14 . The method of claim 12 , wherein the silica-containing compound (B′) includes a silica powder (b1′) having an average particle diameter of greater than about 0 μm and less than or equal to about 45 μm and a silica sand (b2′) having an average particle diameter of greater than or equal to about 0.1 mm and less than about 1.2 mm, and
the silica sand (b2′) is included in an amount of about 60 wt % to about 70 wt % based on a total amount of the phosphorescent resin composition (ii).

Assignees

• Lotte Advanced Mat Co Ltd

Inventors

• Lee Heecheol
• Hwang Cheol-Yeon
• Kim Kyunghwan
• Bae Seul-Gi
• Son Changho
• An Sung Jin

Classifications

• B29C43/56

  Compression moulding under special conditions, e.g. vacuum · CPC title

• C09K11/025

  non-luminescent particle coatings or suspension media · CPC title

• B29C67/244

  by vibrating the composition before or during moulding · CPC title

• C04B2103/54

  Pigments; Dyes · CPC title

• C04B14/005

  Inorganic fillers with a shape other than granular or fibrous (carbon nanotubes C04B14/026) · CPC title