Flexible Circuit Electrode Array with Wire or Film Support

Patent metadata

Field	Value
Publication number	US-2018178002-A1
Application number	US-201715823459-A
Country	US
Kind code	A1
Filing date	Nov 27, 2017
Priority date	Feb 16, 2007
Publication date	Jun 28, 2018
Grant date	—

Abstract

The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad on the array.

First claim

1 . A flexible circuit electrode array comprising:
a polymer base layer; a metal trace layer deposited on the polymer base layer, the metal trace layer including a two dimensional array of electrodes configured to stimulate neural tissue defining an electrode field within an electrode array portion, a two dimensional array of bond pads configured to attach to an electronic circuit package defining a bond pad portion and traces defining a cable portion between the electrode array portion and the bond pad portion connecting the electrodes to the bond pads; a polymer top layer deposited on the polymer base layer and deposited on the metal trace layer; and at least one support embedded in the flexible circuit electrode array, outside the electrode field, not electrically connected to the electrodes or the bond pads, in addition to the metal trace layer, wherein the at least one embedded support is of a material suitable to be manually bent when implanted ensuring better shape control and pressure uniformity, and that a fold or twist once manually made upon implantation holds its shape better than without the at least one embedded support.

2 . The flexible circuit electrode array according to claim 1 , wherein the embedded support comprises at least one wire, film, foil, rod, tube, or strip embedded in the cable.

3 . The flexible circuit electrode array according to claim 1 , where the support is embedded lengthwise through the cable portion.

4 . The flexible circuit electrode array according to claim 1 , wherein the at least one embedded support is comprised of two or more thin rods, wires, tubes or strips.

5 . The flexible circuit electrode array according to claim 1 , wherein the at least one embedded support is comprised of film or foil.

6 . The flexible circuit electrode array according to claim 1 , wherein the at least one embedded support comprises at least one metal, metal alloy, metal layer structure, or mixtures thereof.

7 . The flexible circuit electrode array according to claim 1 , wherein the embedded support is comprised of titanium, platinum, palladium, iridium, gold, silver, niobium, titanium nitride, iridium oxide, other biocompatible metal, metal alloys, or metal layers.

8 . The flexible circuit electrode array according to claim 1 , wherein the at least one embedded support comprises at least one polymer, copolymer, block copolymer or mixtures thereof.

9 . The flexible circuit electrode array according to claim 8 , wherein the polymer base layer comprises polyimide, thermoplastic polyimide, parylene, liquid crystal polymers (LCP), epoxy resin, polyaryletherketones (PEEK), or a fluoropolymer.

10 . The flexible circuit electrode array according to claim 1 , wherein the at least one support embedded in the flexible circuit electrode array is embedded at least in the polymer base layer.

11 . The flexible circuit electrode array according to claim 1 , wherein the at least one support embedded in the flexible circuit electrode array is embedded at least in the polymer top layer.

12 . The flexible circuit electrode array according to claim 1 , wherein the at least one support embedded in the flexible circuit electrode array is embedded at least between the polymer base layer and the polymer top layer.

13 . The flexible circuit electrode array according to claim 1 , wherein the at least one embedded support has a thickness of 0.1 micrometer to 2 mm.

14 . The flexible circuit electrode array according to claim 1 , wherein the at least one embedded support has a thickness of 1 micrometer to 5 micrometers.

15 . The flexible circuit electrode array according to claim 1 , wherein the at least one embedded support comprises notches, spikes, or a coil to improve adhesion between the support and the polymer base layer or the polymer top layer.

Assignees

• Second Sight Medical Products Inc

Inventors

• Greenberg Robert J
• De Juan Eugene
• Humayun Mark S
• Mcclure Kelly
• Talbot Neil Hamilton
• Neysmith Jordan Matthew
• Mech Brian V
• Little James Singleton
• Khaldi Mohamed

Classifications

• A61N1/0543 Primary

  Retinal electrodes · CPC title

• A61N1/05

  for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) · CPC title

• A61N1/0541

  Cochlear electrodes · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title