Photosensitive resin composition

Patent metadata

Field	Value
Publication number	US-2018174701-A1
Application number	US-201615736871-A
Country	US
Kind code	A1
Filing date	Jul 13, 2016
Priority date	Jul 14, 2015
Publication date	Jun 21, 2018
Grant date	—

Abstract

To provide a photosensitive resin composition capable of preventing ion migration while having satisfactory developability and having no cissing. The photosensitive resin composition comprises a reactive polymer having an ethylenically unsaturated double bond group and a carboxyl group; a free radical-based stabilizer; and a photoacid generator. The acid value of the reactive polymer is 40 to 100 mgKOH/g. The chlorine content of the reactive polymer is equal to or less than 150 ppm. The free radical-based stabilizer is selected from a hindered amine or hindered amine derivative. A cured product is obtained by using the photosensitive resin composition.

First claim

1 . A photosensitive resin composition comprises a reactive polymer having an ethylenically unsaturated double bond and a carboxyl group; a free radical-based stabilizer; and a photoacid generator. The acid value of the reactive polymer is 40 to 100 mgKOH/g. The chlorine content of the reactive polymer is equal to or less than 150 ppm. The free radical-based stabilizer is selected from a hindered amine or hindered amine derivative.

2 . The photosensitive resin composition according to claim 1 , wherein the reactive polymer is obtained by addition reaction of an epoxy compound having an ethylenically unsaturated double bond with a polymer A which is polymerized from a monomer containing at least one acrylic acid and methacrylic acid. In addition reaction, a tertiary amine is used as a catalyst.

3 . The photosensitive resin composition according to claim 2 , wherein the tertiary amine is selected from triethylamine, tri-isopropyl amine, and dimethyl amino pyridine.

4 . The photosensitive resin composition according to claim 1 , wherein the chlorine content in the photosensitive resin composition is 100 ppm or less per solid content of the resin composition.

5 . The photosensitive resin composition according to any of claims 1 to 4 further comprises a crosslinking agent.

6 . A cured product obtained from photosensitive resin composition according to any of claims 1 to 5 .

7 . An overcoat is formed on the wiring, which is made of a material selected from copper, silver, or an alloy containing these. The overcoat is formed from the photosensitive resin composition according to any of claims 1 to 5 . Said wiring is connected to at least one indium tin oxide (ITO) electrode, which is used for a touch panel.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Kushida Shugaku
• Haga Mitsuru
• Kainuma Kunio

Classifications

• C08K5/3435

  Piperidines · CPC title

• G03F7/038

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

• H01B3/40 Primary

  epoxy resins · CPC title

• C08F290/12

  Polymers provided for in subclasses C08C or C08F · CPC title

• C08K5/17

  Amines; Quaternary ammonium compounds · CPC title