Resin composition, resin laminate and resin laminated metallic foil

Patent metadata

Field	Value
Publication number	US-2018170007-A1
Application number	US-201615579671-A
Country	US
Kind code	A1
Filing date	Jun 8, 2016
Priority date	Jun 29, 2015
Publication date	Jun 21, 2018
Grant date	—

Abstract

The present invention is a resin composition comprising a specific modified hydrogenated block copolymer [E] prepared by introducing an alkoxysilyl group and a crosslinking aid; a resin laminate prepared by laminating a layer including the resin composition on at least one side of a polyimide-based resin film; and a resin laminated metallic foil prepared by laminating a metallic foil on at least one side of the polyimide-based resin film through the layer including the resin composition. The present invention provides: a resin composition excellent in adhesiveness to a polyimide-based resin film and a metallic foil with low surface roughness and excellent in electrical insulation; a resin laminate prepared by laminating the resin composition and a polyimide-based resin film; and a resin laminated metallic foil in which the polyimide-based resin film and a metallic foil with a low surface roughness are laminated by using the resin composition as an adhesive.

First claim

1 . A resin composition comprising:
a modified hydrogenated block copolymer [E] prepared by introducing an alkoxysilyl group into a hydrogenated block copolymer [D], and a crosslinking aid; wherein the hydrogenated block copolymer [D] is obtained by hydrogenating 90% or more of carbon-carbon unsaturated bonds on a main chain and side chains and carbon-carbon unsaturated bonds on aromatic rings in a block copolymer [C] which includes at least two polymer blocks [A] mainly containing a structural unit derived from an aromatic vinyl compound and at least one polymer block [B] mainly containing a structural unit derived from an acyclic conjugated diene compound, wherein a ratio of wA to wB (wA:wB) is 30:70 to 60:40 when a weight fraction of all the polymer blocks [A] accounting for all the block copolymers is defined as wA and a weight fraction of all the polymer blocks [B] accounting for all the block copolymers is defined as wB.

2 . The resin composition according to claim 1 , wherein a content of the crosslinking aid is 0.1 to 15 parts by weight based on 100 parts by weight of the modified hydrogenated block copolymer [E].

3 . A resin laminate prepared by laminating a layer including the resin composition according to claim 1 on at least one side of a polyimide-based resin film.

4 . A resin laminated metallic foil prepared by laminating a metallic foil on at least one side of a polyimide-based resin film through the layer including the resin composition according to claim 1 .

5 . The resin laminated metallic foil according to claim 4 , wherein a surface roughness of the metallic foil is 3.0 μm or lower at the maximum height roughness Rz.

Assignees

• Zeon Corp

Inventors

• Chiba Daido
• Ishiguro Atsushi
• Kohara Teiji

Classifications

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2307/546

  Flexural strength; Flexion stiffness · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B2307/50

  having particular mechanical properties · CPC title

• B32B2307/718

  Weight, e.g. weight per square meter · CPC title