Barrier films, vacuum insulation panels and moisture barrier bags employing same

US2018169697A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018169697-A1
Application numberUS-201615735293-A
CountryUS
Kind codeA1
Filing dateJun 9, 2016
Priority dateJun 16, 2015
Publication dateJun 21, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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There is provided a barrier film having a substrate, a low thermal conductivity organic layer and an inorganic stack. The inorganic stack will include a low thermal conductivity non-metallic inorganic material layer and a high thermal conductivity metallic material layer.

First claim

Opening claim text (preview).

1 . A barrier film comprising: (a) a substrate having two opposing major surfaces; (b) a first layer in direct contact with one of the opposing major surfaces of the substrate, wherein the first layer is an inorganic stack or a low thermal conductivity organic layer or; and (c) a second layer in direct contact with the first layer, wherein the second layer is an inorganic stack or a low thermal conductivity organic layer, and wherein the second layer is not the same as that selected in the first layer; wherein the inorganic stack comprises a low thermal conductivity non-metallic inorganic material layer and a high electrical conductivity metallic material layer having a high thermal resistance in the plane of the high electrical conductivity metallic material layer; wherein the barrier film is semitransparent. 2 . The barrier film of claim 1 , wherein the high electrical conductivity metallic material layer comprises a high electrical conductivity metallic material. 3 . The barrier film of claim 2 , wherein the high electrical conductivity metallic material has an electrical conductivity of more than 1.5×10 7 Siemens/m 4 . The barrier film of claim 3 , the high electrical conductivity metallic material are selected from at least one of aluminum, silver, gold, copper, beryllium, tungsten, magnesium, rhodium, iridium, molybdenum, zinc, bronze, or combinations of the same. 5 . The barrier film of claim 1 , wherein the low thermal conductivity non-metallic inorganic material layer comprises a low thermal conductivity non-metallic inorganic material and the low thermal conductivity non-metallic inorganic material is selected from at least one of aluminum oxide, silicon oxide, aluminum-silicon-oxide, aluminum-silicon-nitride, and aluminum-silicon-oxy-nitride CuO, TiO 2 , ITO, Si 3 N 4 , TiN, ZnO, aluminum zinc oxide, ZrO 2 , yttria-stabilized zirconia and Ca 2 SiO 4 . 6 . The barrier film of claim 1 , further comprising an additional low thermal conductivity organic layer. 7 . The barrier film of claim 1 , further comprising a flame retardant layer in direct contact with an opposing major surface of the substrate opposite the first layer. 8 . The barrier film of claim 1 , wherein the barrier film has a Rs of less than 50 Ohms/sq. 9 . The barrier film of claim 1 , wherein the barrier film has a static decay time of less than 2 seconds. 10 . The barrier film of claim 1 , wherein the barrier film has an electrostatic shielding of less than 10 nanoJoules. 11 . The barrier film of claim 1 , wherein the barrier film has a water vapor transmission rate of less than 0.031 g/m 2 /day. 12 . An article comprising a vacuum insulation panel envelope comprising: (a) a substrate having two opposing major surfaces; (b) a first layer in direct contact with one of the opposing major surfaces of the substrate, wherein the first layer is an inorganic stack or a low thermal conductivity organic layer or; and (c) a second layer in direct contact with the first layer, wherein the second layer is an inorganic stack or a low thermal conductivity organic layer, and wherein the second layer is not the same as that selected in the first layer; wherein the inorganic stack comprises a low thermal conductivity non-metallic inorganic material layer and a high electrical conductivity metallic material layer having a high thermal resistance in the plane of the high electrical conductivity metallic material layer. 13 - 18 . (canceled) 19 . The article of claim 11 , wherein the substrate comprises a flame retardant material. 20 . The article of claim 11 , further comprising a flame retardant layer in direct contact with an opposing major surface of the substrate opposite the first layer. 21 . The article of claim 11 , wherein the vacuum insulation panel envelope further comprises a core layer. 22 . The article of claim 11 , wherein the vacuum insulation panel envelope has a moisture vapor transmission rate of less than 0.2 g/m 2 /day. 23 . The article of claim 11 , wherein the vacuum insulation panel envelope has an electrostatic shielding of less than 10 nanoJoules. 24 . An article comprising a moisture barrier bag comprising: (a) a substrate having two opposing major surfaces; (b) a first layer in direct contact with one of the opposing major surfaces of the substrate, wherein the first layer is an inorganic stack or a low thermal conductivity organic layer or; and (c) a second layer in direct contact with the first layer, wherein the second layer is an inorganic stack or a low thermal conductivity organic layer, and wherein the second layer is not the same as that selected in the first layer; wherein the inorganic stack comprises a low thermal conductivity non-metallic inorganic material layer and a high electrical conductivity metallic material layer having a high thermal resistance in the plane of the high electrical conductivity metallic material layer; wherein the barrier film is semitransparent. 25 . The article of claim 24 , wherein the moisture barrier bag has a static decay time of less than 2 seconds

Assignees

Inventors

Classifications

  • Heat sealable · CPC title

  • comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

  • comprising acrylic (co)polymers · CPC title

  • comprising polyesters · CPC title

  • on synthetic resin layer or on natural or synthetic rubber layer · CPC title

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Frequently asked questions

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What does patent US2018169697A1 cover?
There is provided a barrier film having a substrate, a low thermal conductivity organic layer and an inorganic stack. The inorganic stack will include a low thermal conductivity non-metallic inorganic material layer and a high thermal conductivity metallic material layer.
Who is the assignee on this patent?
3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification B05D1/60. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jun 21 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).