Semiconductor device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2018166384-A1
Application number	US-201815891192-A
Country	US
Kind code	A1
Filing date	Feb 7, 2018
Priority date	Nov 16, 2015
Publication date	Jun 14, 2018
Grant date	—

Abstract

A semiconductor device includes a substrate including a cell area, a first contact area, and a second contact area; a lower stacked structure extending over the second contact area from the cell area; an upper stacked structure extending over the first contact area from the cell area, the upper stacked structure leaving the second contact area open; N (N is a natural number of 2 or more) first group of stepped grooves penetrating at least one portion of the upper stacked structure in the first contact area; and M (M is a natural number equal to or smaller than N) second group of stepped grooves penetrating at least one portion of the lower stacked structure in the second contact area.

First claim

What is claimed is:

1 . A method of manufacturing a semiconductor device, the method comprising:
forming a first stacked group over a substrate, wherein the substrate includes a cell area, a first contact area extending along a first direction from the cell area, and a second contact area extending along the first direction from the first contact area; forming a second stacked group on the first stacked group; forming stepped trenches by etching the second stacked group, wherein the stepped trenches are arranged in a line along the first direction and each includes first stepped sidewalls symmetrically opposite to each other in the first direction, the first stepped sidewalls having a first depth; etching the second stacked group to have a depression structure in which at least one of the stepped trenches is depressed in stages to a second depth deeper than the first depth and a third depth deeper than the second depth on the first and second contact areas; and etching the first and second stacked groups such that the stepped trenches including the depression structure are moved to the inside of the first stacked group in the second contact area, and the second stacked group is removed in the second contact area.

2 . The method of claim 1 , wherein the forming of the stepped trenches includes:
forming a trench-type mask pattern over the second stacked group, wherein the trench-type mask pattern includes openings formed in a line along a second direction intersecting the first direction; and forming the first stepped sidewalls by repeating a process of etching the second stacked group by using the trench-type mask pattern as an etching barrier and a process of widening the widths of the openings.

3 . The method of claim 1 , comprising:
forming a first trench-type mask pattern over the second stacked group, wherein the first trench-type mask pattern includes first openings formed in a line along the second direction intersecting the first direction; forming an upper step structure constituting an upper portion of each of the first stepped sidewalls by repeating a process of etching the second stacked group by using the first trench-type mask pattern as an etching barrier and a process of widening the widths of the first openings; shielding the upper step structure with a second trench-type mask pattern, wherein the second trench-type mask pattern includes second openings formed in a line along the second direction; and forming a lower step structure constituting a lower portion of each of the first stepped sidewalls by repeating a process of etching the second stacked group by using the second trench-type mask pattern as an etching barrier and a process of widening the widths of the second openings.

4 . The method of claim 3 , wherein a select step structure including the same number of steps as the upper step structure is simultaneously formed with the upper step structure on the first contact area adjacent to the cell area,
wherein the select step structure is blocked by the second trench-type mask pattern.

5 . The method of claim 1 , wherein the etching of the second stacked group to have the depression structure includes:
forming a hole-type mask pattern over the second stacked group, wherein the hole-type mask pattern includes opening holes each opening a pair of first stepped sidewalls opposite to each other in the first direction; forming second stepped sidewalls by etching the second stacked group by using the hole-type mask pattern as an etching barrier such that the first stepped sidewalls are moved down to the second depth; and performing, once or more, a depressing process including a process of widening the areas of the opening holes and a process of etching the second stacked group by using the hole-type mask pattern as an etching barrier such that the second stepped sidewalls are moved down to the third depth, and the first stepped sidewalls having the first depth, which remain around the second stepped sidewalls, are moved down to the second depth.

6 . The method of claim 5 , wherein the opening holes are arranged in zigzag along the first direction.

7 . The method of claim 5 , wherein the opening holes adjacent to each other in the second direction intersecting the first direction are connected to each other through the process of widening the areas of the opening holes.

8 . The method of claim 5 , wherein the depressing process includes etching the second stacked group to a depth equal to as a difference between the second and third depths once.

9 . The method of claim 5 , wherein the depressing process includes etching the second stacked group to a depth less than a difference between the second and third depths twice or more.

10 . The method of claim 1 , wherein each of the forming of the first stacked group and the forming of the second stacked group includes alternately stacking first material layers and second material layers.

11 . The method of claim 10 , wherein each of the first stepped sidewalls is configured with x steps each including a pair of a first material layer and a second material layer.

12 . The method of claim 11 , wherein the forming of the depression structure is performed by etching the second stacked group in units of one to x+1 pairs of first material layers and second material layers.

Assignees

• Sk Hynix Inc

Inventors

• Lee Nam Jae

Classifications

• H10W20/42

  Vias, e.g. via plugs · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H10W20/435 Primary

  Cross-sectional shapes or dispositions of interconnections · CPC title

• H01L27/11565

  Electricity · mapped topic

• H01L27/11582

  Electricity · mapped topic