Electrode for quasi-solid li-ion battery
US-2024021872-A1 · Jan 18, 2024 · US
US2018159133A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018159133-A1 |
| Application number | US-201615571740-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 3, 2016 |
| Priority date | May 4, 2015 |
| Publication date | Jun 7, 2018 |
| Grant date | — |
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An method for manufacturing a electronic device is provided having a current collector capable of a high specific charge collecting area and power, but is also achieved using a simple and fast technique and resulting in a robust design that may be flexed and can be manufactured in large scale processing. To this end the electronic device comprising an electronic circuit equipped with a current collector formed by a metal substrate having a face forming a high-aspect ratio structure of pillars having an interdistance larger than 600 nm. By forming the high-aspect structure in a metal substrate, new structures can be formed that are conformal to curvature of a macroform or that can be coiled or wound and have a robust design.
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1 . A method of manufacturing a current collector with a high-aspect ratio structure of pillars formed on a metal substrate, wherein the method comprises: forming elongate and aligned carbon nanotube structures on a face of a seed layer covering the metal substrate; with a micro-pattern mask arranged to forming the carbon nanotube pillars having a minimum interdistance larger than 600 nm; sensitizing the carbon nano tube pillars with a seed metal; electroless plating the sensitized carbon nano tubes to electrically bridge the seed layer by a plated electroconductive material deposited by said electroless plating step, said plated electroconductive material electrically connecting said metal substrate to said carbon nano tubes and covering the carbon nanotube pillars with a further conductive layer deposited by an electroplating step. 2 . A method according to claim 1 , wherein the rendering step is carried out by a pH >3. 3 . A method according to claim 1 , wherein the further conductive layer is porous. 4 . A method according to claim 1 , wherein the pillars are covered with subsequent layers to form a coating that is conformal to the pillars. 5 . A method according to claim 4 , wherein the coating is a battery multilayer or a photovoltaic multilayer. 6 . A method according to claim 5 wherein the multilayer comprises a solid state electrolyte layer. 7 . A method according to claim 5 , further comprising covering the multilayer structure with a planarizing filler that planarizes the high-aspect ratio structure. 8 . A method according to claim 1 , wherein the metal substrate is stacked on an organic foil. 9 . A method according to claim 1 , wherein the current collector is manufactured in a roll-to-roll process. 10 . An electronic device comprising a current collector having a high-aspect ratio structure of pillars formed in a metal substrate, monolithically formed of elongate and aligned carbon nanotube pillar structures on a face of the metal substrate; and having a minimum interdistance larger than 600 nm; said carbon nanotube pillars being formed on a seed layer; said nanotube pillars being sensitized with a seed metal; and said seed layer being electrically bridged by a plated electroconductive material, said plated electroconductive material electrically connecting said metal substrate to said carbon nano tubes; wherein the carbon nanotube pillars are covered by a further conductive layer deposited on said carbon nanotube pillars. 11 . An electronic device according to claim 10 wherein the high-aspect ratio structure comprises pillars having a radius of curvature larger than 50 nanometer. 12 . An electronic device according to claim 11 , wherein the pillars are higher than 10 micrometer. 13 . An electronic device according to claim 10 , wherein the pillars are formed in high aspect ratio clusters that are separated by a grid of planar zones. 14 . An electronic device according to claim 10 , wherein the substrate is a metal foil having both faces forming a high-aspect ratio structure. 15 . An electronic device according to claim 10 , wherein the high aspect ratio structure is covered with a coating that is conformal to the pillars of the high aspect ratio structure; wherein a gap is provided between homogenously coated high aspect ratio structures. 16 . An electronic device according to claim 15 , wherein the coating is a battery multilayer or a photovoltaic multilayer or both. 17 . An electronic device according to claim 16 wherein the battery multilayer comprises a solid state electrolyte layer. 18 . An electronic device according to claim 16 , wherein the battery multilayer comprises a first electrode layer coated on the high-aspect ratio structure and having a thickness that matches the effective volumetric storage capacity of a second electrode layer at a battery charging C-rate larger than 10 C. 19 . An electronic device according to claim 15 , having a plurality of current collectors, that are alternatingly stacked. 20 . An electronic device according to claim 15 , wherein the gap is filled with a planarizing filler that planarizes and mechanically stabilizes the high-aspect structure. 21 . An electronic device according to claim 20 , wherein the filler is a metal forming an electrode part. 22 . An electronic device according to claim 20 , wherein the filler is a conductive glue that functions to stack the current collector and while stabilizing the high aspect structure. 23 . An electronic device according to claim 10 , wherein the metal substrate is stacked on an organic foil.
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