Flexible thermoelectric structure and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2018159014-A1
Application number	US-201615394190-A
Country	US
Kind code	A1
Filing date	Dec 29, 2016
Priority date	Dec 6, 2016
Publication date	Jun 7, 2018
Grant date	—

Abstract

A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.

First claim

What is claimed is:

1 . A flexible thermoelectric structure, comprising:
a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface; and a polymer film covering the first surface of the porous thermoelectric pattern, wherein the polymer film has a first surface and a second surface opposite to the first surface; wherein the polymer film fills pores of the porous thermoelectric pattern, and the second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.

2 . The flexible thermoelectric structure as claimed in claim 1 , wherein the polymer film is composed of polyimide or polyvinylidene fluoride.

3 . The flexible thermoelectric structure as claimed in claim 1 , wherein the porous thermoelectric pattern is composed of Bi 2 Te 3 -based material, PbTe-based material, GeTe-based material, Zn 4 Sb 3 -based material, or CoSb 3 -based material.

4 . The flexible thermoelectric structure as claimed in claim 1 , wherein the porous thermoelectric pattern includes a plurality of sheet-shaped thermoelectric material stacked horizontally and connected to form a continuous phase.

5 . The flexible thermoelectric structure as claimed in claim 1 , wherein the second surface of the porous thermoelectric pattern is not covered by the polymer film.

6 . A method of manufacturing a flexible thermoelectric structure, comprising:
forming a pattern of a thermoelectric ink on a substrate; thermal treating the thermoelectric ink to form a porous thermoelectric pattern on the substrate; coating a gel polymer on the porous thermoelectric pattern and the substrate, and curing the gel polymer to form a polymer film, wherein the porous thermoelectric pattern and the polymer film construct a flexible thermoelectric structure; and separating the substrate and the flexible thermoelectric structure, wherein the a porous thermoelectric pattern has a first surface and a second surface opposite to the first surface; and wherein the polymer film has a first surface and a second surface opposite to the first surface; wherein the polymer film covers the first surface of the porous thermoelectric pattern and fills pores of the porous thermoelectric pattern, and the second surface of the polymer film is coplanar with a second surface of the porous thermoelectric pattern.

7 . The method as claimed in claim 6 , wherein the polymer film is composed of polyimide or polyvinylidene fluoride, and the porous thermoelectric pattern is composed of Bi 2 Te 3 -based material, PbTe-based material, GeTe-based material, Zn 4 Sb 3 -based material, or CoSb 3 -based material.

8 . The method as claimed in claim 6 , wherein the porous thermoelectric pattern includes a plurality of sheet-shaped thermoelectric material stacked horizontally and connected to form a continuous phase.

9 . The method as claimed in claim 6 , wherein the second surface of the porous thermoelectric pattern is not covered by the polymer film.

10 . The method as claimed in claim 6 , wherein the gel polymer and a thermoelectric material of the porous thermoelectric pattern have a wetting angle of 15° to 45° therebetween.

Assignees

• Ind Tech Res Inst

Inventors

• Chiang Ying-Jung
• Jean Ren-Der
• Lin Hong-Ching
• Chu Hsu-Shen

Classifications

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K2203/1377

  Protective layers · CPC title

• H05B3/36 Primary

  heating conductor embedded in insulating material · CPC title

• H01L35/34

  Electricity · mapped topic

• H01L35/32 Primary

  Electricity · mapped topic