Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells
US-2024380401-A1 · Nov 14, 2024 · US
US2018158496A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018158496-A1 |
| Application number | US-201615578377-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 31, 2016 |
| Priority date | Jun 3, 2015 |
| Publication date | Jun 7, 2018 |
| Grant date | — |
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A magnetoresistive element includes: a free layer that includes a magnetostrictive layer containing a magnetostrictive material; a pin layer that includes a first ferromagnetic layer; a thin film that is located between the pin layer and the free layer; a piezoelectric substance that is located so as to surround at least a part of the magnetostrictive layer from a direction intersecting with a stacking direction of the free layer and the pin layer and applies a pressure to the magnetostrictive layer; and an electrode that is capable of applying a voltage different from a voltage applied to the free layer and a voltage applied to the pin layer and applies a voltage to the piezoelectric substance so that the piezoelectric substance applies a pressure to the magnetostrictive layer.
Opening claim text (preview).
1 . A magnetoresistive element comprising: a free layer that includes a magnetostrictive layer containing a magnetostrictive material; a pin layer that includes a first ferromagnetic layer; a thin film that is located between the pin layer and the free layer; a piezoelectric substance that is located so as to surround at least a part of the magnetostrictive layer from a direction intersecting with a stacking direction of the free layer and the pin layer and applies a pressure to the magnetostrictive layer; and an electrode that is capable of applying a voltage different from a voltage applied to the free layer and a voltage applied to the pin layer and applies a voltage to the piezoelectric substance so that the piezoelectric substance applies a pressure to the magnetostrictive layer. 2 . The magnetoresistive element according to claim 1 , wherein the electrode is located so as to surround at least a part of the piezoelectric substance, and the piezoelectric substance is dielectrically polarized in a direction from the magnetostrictive layer to the electrode or a direction from the electrode to the magnetostrictive layer. 3 . The magnetoresistive element according to claim 1 , wherein the electrode includes a first electrode and a second electrode located at both sides in the stacking direction with respect to the piezoelectric substance, and the piezoelectric substance is (dielectrically polarized in the stacking direction. 4 . The magnetoresistive element according to claim 2 , wherein when a polarity of a voltage applied to the pin layer with respect to the free layer reverses, a polarity of a voltage applied to the electrode with respect to the free layer does not change. 5 . The magnetoresistive element according to claim 3 , wherein when a polarity of a voltage applied to the pin layer with respect to the free layer reverses, a polarity of a voltage applied to the second electrode with respect to the first electrode does not change. 6 . The magnetoresistive element according to claim 1 , wherein the free layer includes a second ferromagnetic layer magnetically coupled to the magnetostrictive layer. 7 . The magnetoresistive element according to claim 1 , wherein the magnetostrictive layer changes a direction of a magnetization easy axis thereof by application of pressure and reverses a magnetization direction of the free layer. 8 . The magnetoresistive element according to claim 7 , wherein the magnetization direction of the free layer is reversed by spin-transfer-torque current-induced magnetization switching when the direction of the magnetization easy axis of the magnetostrictive layer changes. 9 . The magnetoresistive element according to claim 1 , wherein the thin film includes a tunnel barrier insulating layer or a non-magnetic metal layer. 10 . The magnetoresistive element according to claim 1 , wherein the thin film includes a piezoresistor and the piezoelectric substance applies a pressure to the piezoresistor. 11 . A memory circuit comprising: the magnetoresistive element according to claim 9 ; a bit line to which one of the free layer and the pin layer is coupled; a switch coupled to another of the free layer and the pin layer; a source line coupled to the another of the free layer and the pin layer through the switch; a word line to which a control terminal controlling the switch is coupled; and a control line to which the electrode is coupled. 12 . A memory circuit by comprising: the magnetoresistive element according to claim 10 ; a bit line to which one of the free layer and the pin layer is coupled; a source line coupled to another of the free layer and the pin layer: and a word line coupled to the electrode. 13 . A memory circuit comprising: a magnetoresistive element including: a free layer that includes a magnetostrictive layer containing a magnetostrictive material; a pin layer that includes a first ferromagnetic layer; a thin film that is located between the pin layer and the free layer; a piezoelectric substance that is located so as to surround at least a part of the magnetostrictive layer from a direction intersecting with a stacking direction of the free layer and the pin layer, and applies a pressure to the magnetostrictive layer; and an electrode that is capable of applying a voltage different from a voltage applied to the free layer and a voltage applied to the pin layer, and applies a voltage to the piezoelectric substance so that the piezoelectric substance applies a pressure to the magnetostrictive layer; and a transistor including: a source and a drain, one of the source and the drain being coupled to one of the free layer and the pin layer; a channel that is located between the source and the drain and through which a carrier conducts from the source to the drain; and a gate that surrounds at least a part of the channel from the intersecting direction, wherein the source, the channel, and the drain are stacked in the stacking direction. 14 . The memory circuit according to claim 13 , wherein the channel is a piezoresistor, and the gate includes a piezoelectric substance that applies a pressure to the channel from a direction intersecting with a direction in which the carrier conducts.
Timing circuits or methods · CPC title
Cell access · CPC title
Writing or programming circuits or methods · CPC title
using thin-film elements · CPC title
details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell · CPC title
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