Configuring optical layers in imprint lithography processes

Patent metadata

Field	Value
Publication number	US-2018157170-A1
Application number	US-201715704129-A
Country	US
Kind code	A1
Filing date	Sep 14, 2017
Priority date	Dec 2, 2016
Publication date	Jun 7, 2018
Grant date	—

Abstract

An imprint lithography method of configuring an optical layer includes imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template, while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.

First claim

What is claimed is:

1 . An imprint lithography method of configuring an optical layer, the imprint lithography method comprising:
imprinting first features of a first order of magnitude in size on a side of a substrate with a patterning template; while imprinting second features of a second order of magnitude in size on the side of the substrate with the patterning template, the second features being sized and arranged to define a gap between the substrate and an adjacent surface.

2 . The imprint lithography method of claim 1 , wherein imprinting the first features comprises forming one or both of diffraction gratings and anti-reflective features on the side of the substrate.

3 . The imprint lithography method of claim 2 , wherein imprinting the second features comprises forming spacers on the side of the substrate.

4 . The imprint lithography method of claim 3 , further comprising imprinting one or both of the spacers and the anti-reflective features along a peripheral edge of the side of the substrate.

5 . The imprint lithography method of claim 3 , further comprising imprinting one or both of the spacers and the anti-reflective features within an interior region of the side of the substrate.

6 . The imprint lithography method of claim 1 , wherein the side of the substrate is a first side of the substrate, the imprint lithography method further comprising imprinting third features of the first order of magnitude in size on a second side of the substrate.

7 . The imprint lithography method of claim 6 , wherein imprinting the third features comprises forming diffraction gratings or anti-reflective features on the second side of the substrate.

8 . The imprint lithography method of claim 1 , wherein the second order of magnitude in size is greater than the first order of magnitude in size.

9 . The imprint lithography method of claim 1 , wherein the first order of magnitude in size is of a nano-scale and the second order of magnitude in size is of a micro-scale.

10 . The imprint lithography method of claim 1 , further comprising imprinting the second features on opposite sides of the first features.

11 . The imprint lithography method of claim 1 , further comprising creating the patterning template from a predecessor mold.

12 . The imprint lithography method of claim 11 , further comprising forming deep features of the second order of magnitude in size in the predecessor mold.

13 . The imprint lithography method of claim 11 , further comprising forming shallow features of the first order of magnitude in size in the predecessor mold.

14 . The imprint lithography method of claim 1 , wherein the substrate is a first substrate, and the adjacent surface is defined by a second substrate.

15 . The imprint lithography method of claim 14 , further comprising aligning the first and second substrates with each other.

16 . The imprint lithography method of claim 14 , further comprising dispensing an adhesive substance atop the second features imprinted on the side of the first substrate.

17 . The imprint lithography method of claim 16 , further comprising attaching the first and second substrates to each other at the adhesive substance atop the second features imprinted on the side of the first substrate to form the gap between the first substrate and the adjacent surface defined by the second substrate.

18 . The imprint lithography method of claim 1 , wherein the gap provides a low index region.

19 . The imprint lithography method of claim 18 , wherein the low index region comprises air with an index of refraction of 1.

20 . An optical layer, comprising:
a substrate; and a pattern imprinted on a side of the substrate with a patterning template, the pattern comprising first features of a first order of magnitude in size and second features of a second order of magnitude in size, wherein the second features are sized and arranged to define a gap between the substrate and an adjacent surface.

Assignees

• Molecular Imprints Inc

Inventors

• Singh Vikramjit
• Miller Michael Nevin
• Xu Frank Y

Classifications

• B29C33/424

  Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372) · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B29C59/16

  by wave energy or particle radiation {, e.g. infrared heating (B29C59/007 takes precedence)} · CPC title

• G03F9/7053

  Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves · CPC title

• B29C59/022

  characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title