Components of an electronic device and methods for their assembly
US-2024431057-A1 · Dec 26, 2024 · US
US2018157162A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018157162-A1 |
| Application number | US-201615371904-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 7, 2016 |
| Priority date | Dec 7, 2016 |
| Publication date | Jun 7, 2018 |
| Grant date | — |
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The present invention is directed to compositions for photolithographic masks comprising a substrate and a coating having at least one electrical conducting layer comprising a metal nitride of the formula MNy, wherein M is a metal and y is greater than zero and less than 1, and methods of making the same.
Opening claim text (preview).
What is claimed is: 1 . A composition for a photolithographic mask comprising: a. a substrate; and b. a coating deposited on a surface of the substrate, the coating comprising at least one electrical conducting layer comprising: i. a thickness from about 5 nm to about 30 nm; and ii. at least one metal nitride of the formula MN y , wherein M is a metal comprising Cr, Ti, Al, Si or combinations thereof, N is nitrogen, and y is greater than zero and less than 1. 2 . The composition of claim 1 , wherein the at least one electrical conducting layer has an optical transmittance from about 5% to about 35% in the wavelength range of 300 nm to 1600 nm. 3 . The composition of claim 1 , wherein the at least one electrical conducting layer has a sheet resistance from about 70 Ω/□ to about 200 Ω/□. 4 . The composition of claim 1 , wherein the at least one electrical conducting layer comprises a metal oxynitride having the general formula MO x N y , wherein M, N and y are defined as above, O is oxygen, and x is greater than zero and less than 1. 5 . The composition of claim 1 , wherein the at least one electrical conducting layer has a thickness that varies about ±5% across the at least one electrical conducting layer. 6 . The composition of claim 1 , wherein the at least one electrical conducting layer comprises a surface roughness of ≤0.6 nm route mean square across an area of up to 100 μm 2 . 7 . The composition of claim 1 , wherein the substrate comprises fused silica, ZERODUR®, ULE® or CLEARCERAM®. 8 . A method of making a composition for a photolithographic mask comprising the steps of: a. providing a substrate; and b. depositing a coating on the substrate, the coating comprising: i. at least one electrical conducting layer having a thickness from about 5 nm to about 30 nm, and at least one metal nitride of the formula MN y , wherein M is a metal comprising Cr, Ti, Al, Si or combinations thereof, N is nitrogen, and y is greater than zero and less than 1. 9 . The method of claim 8 , wherein the coating is deposited on the substrate by physical vapor deposition. 10 . The method of claim 9 , wherein the physical vapor deposition method comprises a reactive deposition. 11 . The method of claim 9 , wherein the physical vapor deposition method occurs in a chamber having a pressure of from about 9.9×10 −7 Torr to about 1×10 −7 Torr. 12 . The method of claim 8 , further comprising the step of adjusting the temperature of the substrate from about 100° C. to about 150° C. 13 . The method of claim 8 , wherein the coating is deposited onto the substrate comprising a thermal evaporation process. 14 . The method of claim 8 , wherein the coating is deposited onto the substrate comprising a chemical vapor deposition. 15 . The method of claim 8 , further comprising providing a flow of argon gas and a flow of nitrogen gas to the composition; and adjusting the flow of argon gas and the flow nitrogen to vary the amount of nitrogen present in the metal nitride. 16 . The method of claim 15 , wherein the total flow of argon and nitrogen gas is about 20 sccm. 17 . The method of claim 15 , wherein the flow of argon gas is from about 11 sccm to about 19 sccm and the flow of nitrogen gas is about 1 sccm to about 9 sccm. 18 . The method of claim 15 , further comprising providing a flow of oxygen gas to the composition; and forming a metal oxynitrides having the formula MO x N y , wherein M, N and y are defined as above, O is oxygen, and x is greater than zero and less than 1.
Nitrides (C23C14/0617 takes precedence) · CPC title
Oxynitrides · CPC title
Nitrides {(C23C16/303 takes precedence)} · CPC title
Oxynitrides · CPC title
Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof · CPC title
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