Resin composition, resin sheet, prepreg, insulator, resin sheet cured product, and heat dissipator

Patent metadata

Field	Value
Publication number	US-2018148622-A1
Application number	US-201615576533-A
Country	US
Kind code	A1
Filing date	May 24, 2016
Priority date	May 25, 2015
Publication date	May 31, 2018
Grant date	—

Abstract

A resin composition contains: a thermosetting resin; a thermally conductive filler; and mica; in which, when the thermally conductive filler is divided into a filler group (A) having a particle diameter of from 10 μm to 100 μm, a filler group (B) having a particle diameter of from 1.0 μm to smaller than 10 μm, and a filler group (C) having a particle diameter of from 0.1 μm to smaller than 1.0 μm, a ratio of the filler group (C) with regard to the thermally conductive filler, based on volume, is larger than a ratio of the filler group (B) with regard to the thermally conductive filler, based on volume.

First claim

1 . A resin composition comprising:
a thermosetting resin; a thermally conductive filler; and mica, wherein, when the thermally conductive filler is divided into a filler group (A) having a particle diameter of from 10 μm to 100 μm, a filler group (B) having a particle diameter of from 1.0 μm to smaller than 10 μm, and a filler group (C) having a particle diameter of from 0.1 μm to smaller than 1.0 μm, a ratio of the filler group (C) with regard to the thermally conductive filler, based on volume, is larger than a ratio of the filler group (B) with regard to the thermally conductive filler, based on volume.

2 . The resin composition according to claim 1 , wherein, when a total volume of the thermally conductive filler is 100% by volume, a ratio of the filler group (A) is from 50% by volume to 90% by volume, a ratio of the filler group (B) is from 1% by volume to 30% by volume, and a ratio of the filler group (C) is from 5% by volume to 40% by volume.

3 . The resin composition according to claim 1 , wherein an average particle diameter of the mica is from 1 μm to 10 μm.

4 . The resin composition according to claim 1 , wherein a content ratio of the mica is from 0.1% by volume to 5% by volume with regard to a total solid content.

5 . The resin composition according to claim 1 , wherein a content ratio of the thermally conductive filler is from 60% by volume to 80% by volume with regard to a total solid content.

6 . The resin composition according to claim 1 , wherein the thermosetting resin comprises an epoxy monomer having a mesogenic structure or a polymer thereof.

7 . The resin composition according to claim 1 , wherein the thermally conductive filler comprises alumina.

8 . A resin sheet formed by molding the resin composition according to claim 1 into a sheet shape.

9 . A prepreg comprising:
a fiber substrate; and the resin composition according to claim 1 , impregnated in the fiber substrate.

10 . An insulator comprising a cured product of the resin composition according to claim 1 .

11 . A resin sheet cured product that is a heat-treated product of the resin sheet according to claim 8 .

12 . A heat dissipator comprising:
a first metal member; a second metal member; and a resin cured product layer that is a cured product of the resin composition according to claim 1 , disposed between the first metal member and the second metal member.

13 . The heat dissipator according to claim 12 , wherein an average thickness of the resin cured product layer is from 100 μm to 300 μm.

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Takezawa Yoshitaka
• Song Shihui
• Fukushima Keiji
• Tanase Tomokazu
• Katoh Tetsuji
• Sano Akihiro
• Kojima Hiroaki

Classifications

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title

• F28F21/089

  Coatings, claddings or bonding layers made from metals or metal alloys (F28F19/06 takes precedence) · CPC title

• C08L101/00

  Compositions of unspecified macromolecular compounds · CPC title

• B32B15/08

  of synthetic resin · CPC title

• C08K3/22

  of metals · CPC title