Positioning device

Patent metadata

Field	Value
Publication number	US-2018138070-A1
Application number	US-201715806950-A
Country	US
Kind code	A1
Filing date	Nov 8, 2017
Priority date	Nov 11, 2016
Publication date	May 17, 2018
Grant date	—

Abstract

The invention relates to a positioning device for positioning a substrate, in particular a wafer, comprising: a process chamber; a base body; a carrier element which comprises a support for supporting the substrate, the carrier element being arranged above the base body and formed movable in terms of distance from the base body; and a holder for an additional substrate, in particular an additional wafer or a mask, the holder being arranged opposite the carrier element; wherein there is, between the base body and the carrier element, a sealed-off cavity to which a pressure, in particular a negative pressure, can be applied so as to prevent undesired movement of the carrier element as a result of the action of an external force.

First claim

1 . A positioning device for positioning a substrate, in particular a wafer, comprising:
a process chamber; a base body; a carrier element which comprises a support for supporting the substrate, the carrier element being arranged above the base body and formed movable in terms of distance from the base body; and a holder for an additional substrate, in particular an additional wafer or a mask, the holder being arranged opposite the carrier element; wherein there is, between the base body and the carrier element, a sealed-off cavity to which a pressure, in particular a negative pressure, can be applied so as to prevent undesired movement of the carrier element as a result of the action of an external force.

2 . The positioning device of claim 1 , wherein the sealed-off cavity comprises a pressure terminal, via which the pressure in the cavity can be controlled.

3 . The positioning device of claim 1 , wherein an adjustment element, in particular a lifting element, is arranged between the base body and the carrier element so as to adjust the distance of the carrier element from the base body.

4 . The positioning device of claim 1 , wherein the positioning device comprises a restoring element, in particular a spring, which acts between the base body and the carrier element.

5 . The positioning device of claim 1 , wherein a number of support elements, which set a minimum distance of the carrier element from the base body, are arranged between the base body and the carrier element.

6 . The positioning device of claim 1 , wherein the positioning device comprises a guide for guiding the movement of the carrier element.

7 . The positioning device of claim 1 , wherein the carrier element comprises a fixing device, by means of which the substrate positioned on the support can be fixed, in particular mechanically, pneumatically and/or electrostatically.

8 . The positioning device of claim 1 , wherein there is, between the carrier element and the holder, a process cavity, the size of which is set at least in part by the distance between the carrier element and the holder.

9 . The positioning device of claim 8 , wherein the process cavity is part of the process chamber or defines the process chamber.

10 . The positioning device of claim 8 , wherein the positioning device comprises sealing means, in particular an inflatable sealing lip, for sealing off the process cavity.

11 . The positioning device of claim 8 , wherein an overpressure or a negative pressure can be applied to the process cavity and/or it can be evacuated, or wherein the process cavity is provided with a gas terminal through which a gas can be introduced, in particular helium.

12 . The positioning device of claim 1 , wherein the positioning device comprises at least one spacer, in particular a wedge, which is insertable between the base body and the holder so as to adjust and/or fix a distance between the base body and the holder.

13 . A method for bringing a substrate, in particular a wafer, together with a further substrate, in particular a further wafer, wherein the method comprises the following method steps:
fixing the substrate with respect to the further substrate; evacuating a sealed-off cavity below the substrate so as to prevent undesired movement of the substrate due to the action of an external force; moving the substrate towards the further substrate in a controlled manner; and the further substrate being located in a process cavity, the size of which is set at least in part by the distance between the substrates, it being possible to apply an overpressure or negative pressure to the process cavity and/or to evacuate it, or it being possible to fill the process cavity with a gas, in particular helium.

14 . The method of claim 13 , wherein the method further comprises connecting, in particular bonding, the substrates.

15 . The method of claim 13 , wherein the controlled movement comprises applying a further pressure, in particular an overpressure, to the cavity.

Assignees

• Suss Microtec Lithography Gmbh

Inventors

• Hansen Sven
• Fink Georg
• Petry Henrik

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/07125

  Means for controlling the bonding environment, e.g. valves or vacuum pumps · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title