Multilayer ceramic capacitor

Patent metadata

Field	Value
Publication number	US-2018114644-A1
Application number	US-201715788838-A
Country	US
Kind code	A1
Filing date	Oct 20, 2017
Priority date	Oct 26, 2016
Publication date	Apr 26, 2018
Grant date	—

Abstract

A multilayer ceramic capacitor includes a multilayer body and first and second outer electrodes that include first and second base electrode layers, respectively, first and second electroconductive resin layers, respectively, and first and second plating layers, respectively. The first and second base electrode layers are only located on the end surfaces of the multilayer body. The first and second electroconductive resin layers reach portions of the surfaces of the primary surfaces and portions of the surfaces of the lateral surfaces of the multilayer body. The first and second plating layers cover at least a portion of the base electrode layers and at least a portion of the electroconductive resin layers.

First claim

What is claimed is:

1 . A multilayer ceramic capacitor comprising:
a multilayer body including:
a stack of a plurality of dielectric layers;
first and second primary surfaces opposite to each other in a direction of stacking;
first and second lateral surfaces opposite to each other in a width direction that is perpendicular or substantially perpendicular to the direction of stacking; and
first and second end surfaces opposite to each other in a length direction that is perpendicular or substantially perpendicular to the direction of stacking and width direction;
first inner electrodes and second inner electrodes stacked alternately with the plurality of dielectric layers therebetween, each of the first inner electrodes including an exposed portion on the first end surface and each of the second inner electrodes including an exposed portion on the second end surface; a first outer electrode electrically coupled to the first inner electrodes and located on a first end surface side, and a second outer electrode electrically coupled to the second inner electrodes and located on a second end surface side; wherein the first outer electrode includes a first base electrode layer including electroconductive metal and glass components, a first electroconductive resin layer including thermosetting resin and metal components, and a first plating layer; the second outer electrode includes a second base electrode layer including electroconductive metal and glass components, a second electroconductive resin layer including thermosetting resin and metal components, and a second plating layer; the first base electrode layer is only located on a surface of the first end surface, and the second base electrode layer is only located on a surface of the second end surface; the first electroconductive resin layer extends, to be connected to the first base electrode layer, from an end portion of the first base electrode layer to portions of surfaces of the first and second primary surfaces and portions of surfaces of the first and second lateral surfaces; the second electroconductive resin layer extends, to be connected to the second base electrode layer, from an end portion of the first base electrode layer to portions of surfaces of the first and second primary surfaces and portions of surfaces of the first and second lateral surfaces; the first plating layer is located on a surface of the first base electrode layer and a surface of the first electroconductive resin layer; and the second plating layer is located on a surface of the second base electrode layer and a surface of the second electroconductive resin layer.

2 . The multilayer ceramic capacitor according to claim 1 , wherein:
the first base electrode layer covers at least the exposed portions of the first inner electrodes, and the second base electrode layer covers at least the exposed portions of the second inner electrodes; and the first electroconductive resin layer extends, to be connected to the first base electrode layer, from an end portion of the exposed portions of the first inner electrodes, exposed on the first end surface, to portions of the surfaces of the first and second primary surfaces and portions of the surfaces of the first and second lateral surfaces; and the second electroconductive resin layer extends, to be connected to the second base electrode layer, from an end portion of the exposed portions of the second inner electrodes, exposed on the second end surface, to portions of the surfaces of the first and second primary surfaces and portions of the surfaces of the first and second lateral surfaces.

3 . The multilayer ceramic capacitor according to claim 1 ,
wherein the multilayer body has a rectangular-parallelepiped shape or a substantially rectangular-parallelepiped shape.

4 . The multilayer ceramic capacitor according to claim 1 ,
wherein each of the plurality of dielectric layers includes a dielectric ceramic material.

5 . The multilayer ceramic capacitor according to claim 1 ,
wherein a thickness of each of the plurality of dielectric layers after firing is between about 0.4 μm and about 20 μm.

6 . The multilayer ceramic capacitor according to claim 1 ,
wherein a number of the plurality of dielectric layers is between about 20 and about 2000 layers.

7 . The multilayer ceramic capacitor according to claim 1 ,
wherein each of the first inner electrodes and the second inner electrodes includes dielectric particles and a metal or a metal alloy.

8 . The multilayer ceramic capacitor according to claim 1 ,
wherein a thickness of each of the first inner electrodes and the second inner electrodes is between about 0.2 μm and about 2.0 μm.

9 . The multilayer ceramic capacitor according to claim 1 ,
wherein a total number of the first inner electrodes and the second inner electrodes is between about 2 and about 1600 or less.

10 . The multilayer ceramic capacitor according to claim 1 ,
wherein a percentage of an area of each of the plurality of dielectric layers that covered by one of the first inner electrodes or the second inner electrodes is between about 50% and about 100%.

11 . The multilayer ceramic capacitor according to claim 1 ,
wherein an electrostatic capacitance is defined between each of the first inner electrodes and each of the second inner electrodes.

12 . The multilayer ceramic capacitor according to claim 1 ,
wherein corner and edge portions of the multilayer body are rounded.

13 . The multilayer ceramic capacitor according to claim 11 ,
wherein the first electroconductive resin layer and the second electroconductive resin layer overlap with the surfaces of any portions of the first base electrode layer and second base electrode layer that reach the corners and edge portions.

14 . The multilayer ceramic capacitor according to claim 1 ,
wherein the thermosetting resin is an epoxy resin.

15 . The multilayer ceramic capacitor according to claim 1 ,
wherein each of the first electroconductive resin layer and the second electroconductive resin layer includes a curing agent.

16 . The multilayer ceramic capacitor according to claim 1 ,
wherein a volume of the metal components included in each of the first electroconductive resin layer and the second electroconductive resin layer is between about 35 vol % and about 75 vol % of a total volume of each of the first electroconductive resin layer and the second electroconductive resin layer.

17 . The multilayer ceramic capacitor according to claim 1 ,
wherein the metal components of each of the first electroconductive resin layer and the second electroconductive resin layer have a metal with a spherical or substantially spherical shape or a metal with a flat shape.

18 . The multilayer ceramic capacitor according to claim 1 , wherein the metal components of each of the first electroconductive resin layer and the second electroconductive resin layer include two different metal components.

19 . The multilayer ceramic capacitor according to claim 17 ,
wherein the two different metal components include a first metal component of Sn or an alloy including Sn and a second metal component of Cu, Ag, Pd, Pt, Au, an alloy including Cu, an alloy including Ag, an alloy including Pd, an alloy including Pt, or an alloy including Au.

20 . The multilayer ceramic capacitor according to claim 1 ,
wherein each of the first plating layer and the second plating layer includes a multilayer structure including a Ni layer and a Sn layer

Assignees

• Murata Manufacturing Co

Inventors

• Sugita Hiroaki

Classifications

• H01G4/0085

  Fried electrodes · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title