Dew resistant module for test socket and electronic component testing device having the same

Patent metadata

Field	Value
Publication number	US-2018113151-A1
Application number	US-201715790185-A
Country	US
Kind code	A1
Filing date	Oct 23, 2017
Priority date	Oct 25, 2016
Publication date	Apr 26, 2018
Grant date	—

Abstract

A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.

First claim

1 . A dew resistant module for an electronic component testing device comprising a test socket and a thermal head provided on the test socket, the test socket having a chip slot for receiving an electronic component, the thermal head regulates the temperature of the electronic component disposed within the test socket, the module comprising:
an enclosure body circumscribing the test socket; a test socket base plate provided on top of the test socket and enclosure body, the test socket base plate having at least a dry air inlet and a through hole in alignment with the chip slot of the test socket; and a cover covering at least a portion of the test socket, the enclosure body and the test socket base plate; the cover having an opening through which the thermal head passes to abut the electronic component on the test socket; wherein the thermal head, the cover, the test socket base plate, and the chip slot of the test socket form an internal chamber, and the dry air inlet of the test socket base plate is in communication with the internal chamber at one end and with a. dry air supply source at the other end.

2 . The dew resistant module according to claim 1 , wherein the enclosure body and the cover are formed of a material having cushioning and thermal insulation properties.

3 . The dew resistant module according to claim 1 , wherein the enclosure body and the cover are formed of at least a material selected from the group consisting of rubber, phenol-formaldehyde resin, polystyrene resin, polyurethane resin and polyethylene resin.

4 . The dew resistant module according to claim 1 , wherein the electronic component testing device further comprises a circuit board on which the test socket is disposed, the internal chamber is confined by the thermal head, the cover, the test socket base plate, the chip slot of the test socket, and the circuit board.

5 . The dew resistant module according to claim 1 , wherein the test socket base plate is provided with at least one dry air outlet having one open end in communication with the through hole, and one other open end provided on the outer peripheral wall of the test socket base plate.

6 . The dew resistant module according to claim 1 , wherein the dry air supply source transfers the cooled, low-temperature dry air or the heated, high-temperature dry air to the at least one dry air inlet of the test socket base plate.

7 . An electronic component testing device having a dew resistant module, comprising:
a thermal head for regulating the temperature of an electronic component; a test socket having a chip slot for receiving the electronic component; an enclosure body circumscribing the test socket; a test socket base plate provided on top of the test socket and enclosure body; the test socket base plate having a through hole in alignment with the chip slot of the test socket; and a cover covering at least a portion of the test socket, the enclosure body and the test socket base plate; the cover having an opening through which the thermal head passes to abut the electronic component on the test socket.

8 . The electronic component testing device according to claim 7 , wherein the test socket base plate having at least a dry air inlet, the thermal head, the cover, the test socket base plate, and the chip slot of the test socket form an internal chamber, and the dry air inlet of the test socket base plate is in communication with the internal chamber at one end and with a dry air supply source at the other end.

9 . The electronic component testing device according to claim 8 , wherein the test socket base plate is provided with at least one dry air outlet having one open end in communication with the through hole, and one other open end provided on the outer peripheral wall of the test socket base plate.

10 . The electronic component testing device according to claim 7 , wherein the thermal head comprises a contact portion and a heat exchange portion, when the thermal head is actuated to regulate the temperature of the electronic component in the test socket, the contact portion passes through the through hole of the test socket base plate and the opening of the cover to contact the electronic component, the heat exchange portion includes a fluid chamber for receiving a heat exchange fluid to make a circulation flow therein, and to make heat exchange with the contact portion.

Assignees

• Chroma Ate Inc

Inventors

• Wu Xin-Yi
• Lo Chien-Hung
• Chou Jui-Chih
• Yang Hao-Che
• Kuo Nan-Yi

Classifications

• G01R31/2831

  Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates (G01R31/318511 takes precedence; testing during manufacture H10P74/00) · CPC title

• G01R31/2881

  related to environmental aspects other than temperature, e.g. humidity or vibrations · CPC title

• G01R1/0408 Primary

  Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets (G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808) · CPC title

• G01R1/0458 Primary

  related to environmental aspects, e.g. temperature · CPC title

• G01R31/2877

  related to cooling · CPC title