Thermoelectric temperature controlled cooler for biomedical applications

Patent metadata

Field	Value
Publication number	US-2018098903-A1
Application number	US-201715715395-A
Country	US
Kind code	A1
Filing date	Sep 26, 2017
Priority date	Mar 28, 2015
Publication date	Apr 12, 2018
Grant date	—

Abstract

A heat exchanger module (HEM) and system uses a flexible substrate with one or more open channels, to which a substrate cover is bonded, thereby forming closed channels in the flexible substrate. Thermoelectric coolers (TECs) are attached to optional thermally diffusing copper squares atop the substrate cover. An interface cover is attached to the TEC tops, with a compliant thermally conductive material opposite the TECs and ultimately in contact with a patient. A liquid is passed through the closed channels, which act as thermal references for the TECs. Current is supplied by a controller to the TECs to induce TEC cooling or heating relative to the liquid. One or more temperature sensors detect the temperature of the interface cover, which are used as inputs to the control of the TEC supply current. The HEM may be used for heating, cooling, or cycling between heating and cooling for various medical uses.

First claim

What is claimed is:

1 . A heat exchange system comprising:
(a) a heat exchanger module, the heat exchanger module comprising:
(i) a flexible substrate, the flexible substrate comprising one or more open channels;
(ii) a substrate cover bonded over the flexible substrate;
(iii) whereby the substrate cover when bonded over the open channels thereby forms closed channels to allow for circulation of a liquid;
(iv) a plurality of thermoelectric coolers bonded to the substrate cover on a reference side of the thermoelectric coolers; and
(v) an interface cover bonded to the thermoelectric coolers on an patient side opposite from the reference side;
(b) one or more temperature sensors disposed within the heat exchanger module, wherein the temperature sensors sense a temperature of the interface cover; and (c) a controller configured to use the temperature sensors to control the interface cover temperature by varying a supply current to the thermoelectric coolers; (d) wherein the temperature of the interface cover is controlled by the controller.

2 . The system of claim 1 , wherein the heat exchanger module is selected from a group of geometries consisting of: substantially flat, curved in one direction, and curved in more than one direction.

3 . The system of claim 1 , wherein the heat exchanger module system is battery powered.

4 . The system of claim 1 , wherein the liquid comprises water.

5 . The system of claim 1 , wherein the temperature sensors are selected from a group of sensors consisting of: a thermistor, a thermocouple, and a solid state device that outputs a voltage or current proportional to temperature.

6 . The system of claim 1 , wherein the controller uses a control algorithm selected from one or more algorithms consisting of: proportional, integral, and derivative.

7 . The system of claim 1 , wherein the controller is digital, with zero or more analog components.

8 . The system of claim 1 , wherein the supply current is supplied by a current supply selected from a group of current supplies consisting of: a class D amplifier, an H-bridge amplifier, and a pulse width modulated source.

9 . The system of claim 1 , wherein the heat exchanger module either heats or cools the interface cover.

10 . A heat exchanger system comprising:
(a) a heat exchanger module, the heat exchanger module comprising:
(i) a plurality of thermoelectric coolers;
(ii) a flexible substrate supporting the thermoelectric coolers, the substrate having a plurality of channels configured for circulating a liquid in thermal proximity to the thermoelectric coolers; and
(iii) one or more temperature sensors disposed in proximity to the flexible substrate; and
(b) a controller configured to use the temperature sensors to monitor a temperature of an object adjacent to the heat exchanger module, and configured to control circulation of the liquid; (c) wherein the temperature of an object in contact with the heat exchanger module can be changed by heat transfer between the thermoelectric coolers and the liquid, and wherein the amount of temperature change can be controlled by the controller.

11 . The system of claim 10 , wherein the heat exchanger module is flat.

12 . The system of claim 10 , wherein the heat exchanger module is curved.

13 . A heat exchanger module comprising:
(a) a flexible substrate, the flexible substrate comprising one or more open channels; (b) a substrate cover bonded over the flexible substrate; (c) whereby the substrate cover when bonded over the open channels thereby forms closed channels to allow for circulation of a liquid; (d) a plurality of thermoelectric coolers bonded to the substrate cover on a reference side of the thermoelectric coolers; (e) an interface cover bonded to the thermoelectric coolers on an patient side opposite from the reference side; and (f) one or more temperature sensors disposed within the heat exchanger module.

14 . The heat exchanger module of claim 13 , wherein the temperature sensors sense a temperature of the interface cover.

15 . The heat exchanger module of claim 13 , wherein the heat exchanger module is substantially flat.

16 . The heat exchanger module of claim 13 , wherein the heat exchanger module is curved in one or more directions.

17 . The heat exchanger module of claim 13 , wherein the liquid comprises water.

18 . The heat exchanger module of claim 13 , wherein the temperature sensors are selected from a group of sensors consisting of: a thermistor, a thermocouple, and a solid state device that outputs a voltage or current proportional to temperature.

19 . The heat exchanger module of claim 13 , wherein the heat exchanger module either heats or cools the interface cover.

20 . The heat exchanger module of claim 19 , wherein a rate of heating or cooling the interface cover is controlled.

21 . A method of using a heat exchanger module, comprising:
(a) applying a heat exchanger module to a patient, the heat exchanger module comprising:
(i) a flexible substrate, the flexible substrate comprising one or more open channels;
(ii) a substrate cover bonded over the flexible substrate;
(iii) whereby the substrate cover when bonded over the open channels thereby forms closed channels to allow for circulation of a liquid;
(iv) a plurality of thermoelectric coolers bonded to the substrate cover on a reference side of the thermoelectric coolers;
(v) an interface cover bonded to the thermoelectric coolers on an patient side opposite from the reference side; and
(vi) one or more temperature sensors disposed within the heat exchanger module; and
(b) applying a thermal treatment to the patient by using the heat exchanger module.

22 . The method of using the heat exchanger module of claim 21 , wherein the thermal treatment uses a controlled rate of heating.

23 . The method of using the heat exchanger module of claim 21 , wherein the thermal treatment uses a controlled rate of cooling.

24 . The method of using the heat exchanger module of claim 21 , wherein the thermal treatment uses a time period of substantially constant heat exchanger module interface cover temperature.

25 . A neonatal heat treatment device comprising:
(a) one or more flat heat exchanger modules; and (b) one or more curved heat exchanger modules; (c) each said heat exchanger module comprising:
(i) a flexible substrate, the flexible substrate comprising one or more open channels;
(ii) a substrate cover bonded over the flexible substrate;
(iii) whereby the substrate cover when bonded over the open channels thereby forms closed channels to allow for circulation of a liquid;
(iv) a plurality of thermoelectric coolers bonded to the substrate cover on a reference side of the thermoelectric coolers;
(v) an interface cover bonded to the thermoelectric coolers on an patient side opposite from the reference side; and
(vi) one or more temperature sensors disposed within the heat exchanger module.

26 . A method of assembling a heat exchanger module, comprising:
(a) providing a flexible substrate, comprising one or more open channels; (b) providing a substrate cover; (c) providing an interface cover; (d) bonding a plurality of thermoelectric coolers to the substrate cover on a reference side of the thermoelectric coolers; (e) attaching one or more temperature sensors to the interface cover; and (f) bonding th

Assignees

• Univ California

Inventors

• Vergara Julio L
• Padula Andrew
• Restrepo Lucas

Classifications

• H01L35/30

  Electricity · mapped topic

• A61F2007/0075

  using a Peltier element, e.g. near the spot to be heated or cooled · CPC title

• A61G11/00 Primary

  Baby-incubators; Couveuses · CPC title

• F25B2321/023

  Mounting details thereof · CPC title

• F25B21/02 Primary

  using Peltier effect; using Nernst-Ettinghausen effect · CPC title