Support Apparatus and Support Method

Patent metadata

Field	Value
Publication number	US-2018096876-A1
Application number	US-201715558378-A
Country	US
Kind code	A1
Filing date	Mar 2, 2017
Priority date	May 27, 2016
Publication date	Apr 5, 2018
Grant date	—

Abstract

A support apparatus and a support method are provided, the support apparatus includes: a support substrate for bearing a supported component, the support substrate having a first main surface facing the supported component and a second main surface positioned on a side opposite to the first main surface; and a pressure distribution plate, arranged on the first main surface of the support substrate and positioned between the support substrate and the supported component, wherein the pressure distribution plate is configured to bring the supported component to be separated from the support substrate.

First claim

1 . A support apparatus, comprising:
a support substrate, for bearing a supported component, the support substrate having a first main surface facing the supported component and a second main surface positioned on a side opposite to the first main surface; and a pressure distribution plate, arranged on the first main surface of the support substrate and positioned between the support substrate and the supported component, wherein the pressure distribution plate is configured to bring the supported component to be separated from the support substrate.

2 . The support apparatus according to claim 1 , wherein
the support substrate is provided with a first through hole running through the first main surface and the second main surface in a thickness direction of the support substrate; the support apparatus further comprises a separation device, the separation device including a first protrusion; and the first protrusion is configured to pass through the first through hole and jack up the pressure distribution plate.

3 . The support apparatus according to claim 2 , wherein a positioning element and/or a binding element, which corresponds to the first through hole in position, is arranged on a surface of the pressure distribution plate facing the support substrate.

4 . The support apparatus according to claim 3 , wherein the positioning element is a blind hole extending from a side of the pressure distribution plate facing the support substrate to a side of the pressure distribution plate away from the support substrate.

5 . The support apparatus according to claim 3 , wherein
another binding element is arranged on the first protrusion; and in the process that the first protrusion jacks up the pressure distribution plate, the binding element of the pressure distribution plate and the another binding element of the first protrusion binds with each other, so that the first protrusion and the pressure distribution plate are fixed to each other.

6 . The support apparatus according to claim 5 , wherein the binding element of the pressure distribution plate and the another binding element of the first protrusion bind with each other by a magnetic adsorption force.

7 . The support apparatus according to claim 1 , wherein
a support element is arranged on the first main surface of the support substrate, and the support element supports the supported component.

8 . The support apparatus according to claim 7 , wherein the support element is provided with an adhering portion, and the adhering portion adheres the supported component to the support substrate.

9 . The support apparatus according to claim 7 , wherein a height of the support element in a direction from the support substrate to the supported component is greater than a thickness of the pressure distribution plate.

10 . The support apparatus according to claim 1 , wherein
a first fixing element is arranged on the first main surface of the support substrate; a second fixing element, which corresponds to the first fixing element in position, is arranged on a surface of the pressure distribution plate, which faces the support substrate; and the first fixing element and the second fixing element bind with each other to fix the pressure distribution plate to the support substrate.

11 . The support apparatus according to claim 10 , wherein the first fixing element and the second fixing element bind with each other by a magnetic adsorption force.

12 . The support apparatus according to claim 1 , wherein
the support substrate is provided with a second through hole running through the first main surface and the second main surface; the pressure distribution plate is provided with a through hole corresponding to the second through hole in position; the support apparatus further comprises a transfer device, the transfer device including a second protrusion; and the second protrusion is configured to pass through the second through hole of the support substrate and the through hole of the pressure distribution plate.

13 . The support apparatus according to claim 12 , wherein the second protrusion includes an adsorption element arranged at an end portion of the second protrusion.

14 . A support method, comprising:
providing a support substrate for bearing a supported component, the support substrate having a first main surface facing the supported component and a second main surface positioned on a side opposite to the first main surface; providing a pressure distribution plate arranged on the first main surface of the support substrate and positioned between the support substrate and the supported component; and moving the pressure distribution plate towards a direction away from the support substrate so as to bring the supported component to be separated from the support substrate.

15 . The support method according to claim 14 , wherein
the support substrate is provided with a first through hole running through the first main surface and the second main surface in a thickness direction of the support substrate; and the moving the pressure distribution plate towards the direction away from the support substrate so as to bring the supported component to be separated from the support substrate includes: providing a separation device, the separation device including a first protrusion; and moving the first protrusion to pass through the first through hole and jack up the pressure distribution plate, so that the pressure distribution plate brings the supported component to be separated from the support substrate.

16 . The support method according to claim 15 , wherein a positioning element and/or a binding element, which corresponds to the first through hole in position, is arranged on a surface of the pressure distribution plate facing the support substrate; and the first protrusion, after passing through the first through hole, binds with the pressure distribution plate by the positioning element and/or the binding element, so that in the process that the first protrusion jacks up the pressure distribution plate, the first protrusion and the pressure distribution plate are fixed to each other.

17 . The support method according to claim 14 , wherein
the support substrate is provided with a second through hole running through the first main surface and the second main surface; the pressure distribution plate is provided with a through hole corresponding to the second through hole in position; and the support method further comprising: providing a transfer device, the transfer device including a second protrusion; and placing the supported component on the second protrusion after the second protrusion passes through the second through hole of the support substrate and the through hole of the pressure distribution plate, and then moving the second protrusion so as to move the supported component placed on the second protrusion onto the support substrate.

18 . The support apparatus according to claim 1 , wherein for one supported component, one or more pressure distribution plates are arranged.

19 . The support apparatus according to claim 4 , wherein the blind hole does not pass through the pressure distribution plate.

20 . The support apparatus according to claim 9 , wherein during the support substrate bears the supported component, the supported component does not contact with the pressure distribution plate.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Su Chih-Wei

Classifications

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/18 Primary

  characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports · CPC title

• H10P72/17 Primary

  specially adapted for supporting large square shaped substrates · CPC title