Liquid cooling

Patent metadata

Field	Value
Publication number	US-2018094875-A1
Application number	US-201715819463-A
Country	US
Kind code	A1
Filing date	Nov 21, 2017
Priority date	Jan 31, 2013
Publication date	Apr 5, 2018
Grant date	—

Abstract

An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

First claim

What is claimed is:

1 . A device to provide liquid cooling, the device comprising:
a thermal member including a thermally conductive surface connected to the thermal member; at least one support member including:
an inlet channel to provide a fluid to the thermally conductive surface; and
an outlet channel to transport the fluid from the thermally conductive surface;
a cooling channel facilitated by the thermal member and the at least one support member, the cooling channel having a fluid tight seal.

2 . The device of claim 1 , wherein the thermally conductive surface is located in the cooling channel.

3 . The device of claim 1 , wherein heat is transferred from an electronic device to the thermally conductive surface located in the cooling channel.

4 . The device of claim 3 , wherein the heat transferred from the electronic device to the thermally conductive surface is transferred from the thermally conductive surface to the fluid of the device.

5 . The device of claim 1 , wherein the device includes a mating member such that the heat from the electronic device is transferred from the electronic device to the thermal member of the device via the mating member of the device.

6 . The device of claim 1 , wherein the thermally conductive surface is a solid protrusion.

7 . The device of claim 1 , wherein the inlet channel receives the fluid and transports the fluid to the cooling channel.

8 . The device of claim 1 , wherein the outlet channel receives the fluid from the cooling channel and transports the fluid out of the cooling channel.

9 . A cooling system, comprising:
a thermal member including a thermally conductive surface connected to the thermal member; at least one support member including:
an inlet channel to provide a fluid to the thermally conductive surface; and
an outlet channel to transport the fluid from the thermally conductive surface; and
a cooling channel facilitated by the thermal member and the at least one support member, the cooling channel having a fluid tight seal; wherein heat is transferred from an electronic device to the thermally conductive surface located in the cooling channel and to the fluid of the cooling system in response to the fluid flowing around the thermally conductive surface to cool the electronic device.

10 . The cooling system of claim 9 , wherein the heat is transferred from a heat block of the electronic device to the fluid via a mating member of the cooling system, to the thermally conductive surface, and to the fluid.

11 . The cooling system of claim 10 , wherein the mating member is adjacent to the heat block of the electronic device such that the mating member receives the heat from the heat block of the electronic device.

12 . The cooling system of claim 9 , wherein the fluid contacts the thermally conductive surface to remove heat from the thermally conductive surface.

13 . The cooling system of claim 9 , wherein the cooling system includes an inlet connector connected to the inlet channel to receive the fluid.

14 . The cooling system of claim 9 , wherein the cooling system includes an outlet connector connected to the outlet channel to receive the fluid from the thermally conductive surface.

15 . A method, comprising:
receiving, via a thermal member of a cooling device, heat from a heat block of an electronic device located adjacent to the thermal member; transferring, via the thermal member and a thermally conductive surface located in a cooling channel, heat from the electronic device through the thermal member and to the thermally conductive surface; transporting, via an inlet channel of a support member, a fluid to the cooling channel; removing, via the fluid contacting the thermally conductive surface in the cooling channel, heat from the thermally conductive surface; and transporting, via an outlet channel of the support member, the fluid from the cooling channel.

16 . The method of claim 15 , wherein the method includes receiving the heat from the heat block via a heat pipe.

17 . The method of claim 16 , wherein the method includes generating, by a component of the electronic device, the heat received by the heat block via the heat pipe, wherein the heat pipe thermally connects the component of the electronic device with the heat block.

18 . The method of claim 15 , wherein the method includes transporting the fluid from the outlet channel of the cooling device to a heat exchanger to remove heat from the fluid.

19 . The method of claim 18 , wherein the method includes transporting the fluid from the heat exchanger to the inlet channel for reuse in the cooling device.

20 . The method of claim 15 , wherein transferring the heat from the electronic device to the thermal member of the cooling device includes transferring the heat between the electronic device and the thermal member via a dry disconnect between the electronic device and the cooling device, wherein the dry disconnect allows the fluid to cool the electronic device without the fluid entering the electronic device.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Franz John P
• Cader Tahir
• Sabotta Michael
• Moore David A

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20781

  within cabinets for removing heat from server blades · CPC title

• F28F1/40 Primary

  the means being only inside the tubular element · CPC title

• H01L23/473

  Electricity · mapped topic