Polycrystalline diamond compact with gradient interfacial layer

US2018087134A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018087134-A1
Application numberUS-201515562020-A
CountryUS
Kind codeA1
Filing dateApr 28, 2015
Priority dateApr 28, 2015
Publication dateMar 29, 2018
Grant date

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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The present disclosure relates to a polycrystalline diamond compact (PDC) including a gradient interfacial layer between a thermally stable diamond (TSP) table and a base, such as a substrate or an earth-boring drill bit body. The gradient interfacial layer has a gradient of coefficients of thermal expansion between that of the diamond and the base. The disclosure also relates to methods of forming a gradient interfacial layer and a PDC containing such a layer.

First claim

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What is claimed is: 1 . A method of forming a polycrystalline diamond compact (PDC), the method comprising: forming a gradient interfacial layer having a gradient of coefficients of thermal expansion (CTEs) ranging between the CTE of a thermally stable diamond (TSP) table and the CTE of a base by forming a plurality of sublayers, at least two of which have different CTEs, and attaching the plurality of sublayers to one another; attaching the gradient interfacial layer to the TSP table; and attaching the gradient interfacial layer to the base. 2 . The method of claim 1 , wherein the gradient of coefficients of thermal expansion forms a CTE profile, which may be linear, non-linear, or sigmoidal. 3 . The method of claim 2 , wherein the CTE profile is non-linear and is step-wise by sublayer. 4 . The method of claim 1 , wherein each sublayer of the gradient interfacial layer, at least at a time of initial formation, comprises diamond grains, a catalyst, and a sacrificial binder. 5 . The method of claim 4 , wherein the sublayer is subjected to a high temperature high pressure (HTHP) process after initial formation to form a sintered sublayer. 6 . The method of claim 5 , wherein the sintered sublayer comprises diamond grains and catalyst. 7 . The method of claim 5 , wherein the sintered sublayer is leached to remove at least a portion of the catalyst from at least a portion of the sublayer. 8 . The method of claim 4 , wherein at least one sublayer is formed using additive manufacturing method. 9 . The method of claim 8 , wherein the additive manufacturing method comprises three dimensional (3D) printing. 10 . The method of claim 1 , wherein attaching the gradient interfacial layer to the TSP table or attaching the gradient interfacial layer to the base includes performing a high temperature high pressure (HTHP) process. 11 . The method of claim 1 , wherein forming the gradient interfacial layer and attaching the gradient interfacial layer to the base occur in the same step. 12 . A polycrystalline diamond compact (PDC) comprising: a thermally stable diamond (TSP) table having a TSP coefficient of thermal expansion (CTE); a base having a base CTE; and a gradient interfacial layer bonded to the TSP and the base, the gradient interfacial layer having a CTE gradient between the TSP CTE and the base CTE. 13 . The PDC of claim 12 , wherein the base comprises a substrate and the PDC comprises a cutter for an earth-boring drill bit. 14 . The PDC of claim 12 , wherein the base comprises a cemented carbide. 15 . The PDC of claim 12 , wherein the gradient interfacial layer comprises a plurality of sublayers. 16 . The PDC of claim 12 , wherein the proportion of diamond grains in the gradient interfacial layer decreases as CTE increases. 17 . The PDC of claim 12 , wherein the CTE gradient forms a CTE profile, which may be linear, non-linear, or sigmoidal. 18 . An earth-boring drill bit comprising: a bit body; and a polycrystalline diamond compact (PDC) comprising: a thermally stable diamond (TSP) table having a TSP coefficient of thermal expansion (CTE); a base having a base CTE; and a gradient interfacial layer bonded to the TSP and the base, the gradient interfacial layer having a CTE gradient between the TSP CTE and the base CTE. 19 . The earth-boring drill bit of claim 18 , wherein the PDC comprises a PDC cutter coupled to the bit body. 20 . The earth-boring drill but of claim 18 , wherein the bit body comprises the base.

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Classifications

  • Chemical composition or specific material · CPC title

  • Gradients other than composition gradients, e.g. size gradients · CPC title

  • End product comprising different layers, coatings or parts of cermet · CPC title

  • simultaneously · CPC title

  • C22C26/00Primary

    Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

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What does patent US2018087134A1 cover?
The present disclosure relates to a polycrystalline diamond compact (PDC) including a gradient interfacial layer between a thermally stable diamond (TSP) table and a base, such as a substrate or an earth-boring drill bit body. The gradient interfacial layer has a gradient of coefficients of thermal expansion between that of the diamond and the base. The disclosure also relates to methods of for…
Who is the assignee on this patent?
Halliburton Energy Services Inc
What technology area does this patent fall under?
Primary CPC classification C22C26/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Mar 29 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).