Printer with dual extruders for fabricating removable supports

US2018071825A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018071825-A1
Application numberUS-201715803294-A
CountryUS
Kind codeA1
Filing dateNov 3, 2017
Priority dateApr 14, 2016
Publication dateMar 15, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Support structures are used in certain additive fabrication processes to permit fabrication of a greater range of object geometries. For additive fabrication processes with materials that are subsequently sintered into a final part, a printer is configured to further fabricate an interface layer between the object and the support structure in order to inhibit bonding between adjacent surfaces of the support structure and the object during sintering.

First claim

Opening claim text (preview).

What is claimed is: 1 . A printer for three-dimensional fabrication, the printer comprising: a build plate; a first extruder coupled to a first source of a build material for fabricating an object, the build material including a powdered material for forming the object and a binder system including one or more binders that resist deformation of a net shape of the build material extruded from the first extruder during processing of the net shape into a final part; a second extruder coupled to a second source of an interface material for fabricating an interface layer, wherein the interface material resists bonding of the build material to adjacent surfaces during sintering, and wherein the interface material reduces to a powder and resists bonding of the build material to adjacent surfaces during sintering of the build material; a robotic system operable to move the first extruder and the second extruder relative to the build plate; and a processor configured by computer executable code to move the robotic system along a build path relative to the build plate while extruding from at least one of the first extruder and the second extruder to: fabricate a first object from the build material, apply an interface layer to a first surface of the first object, and fabricate a second surface of a second object from the build material at a location adjacent to the interface layer and opposing the first surface of the first object, wherein the second object is structurally independent from and mechanically related to the first object. 2 . The printer of claim 1 wherein the interface material includes a ceramic powder. 3 . The printer of claim 1 wherein the build material includes a metal powder. 4 . The printer of claim 1 wherein the build material includes an infiltrable powder. 5 . The printer of claim 1 wherein the binder system includes a first binder that resists deformation of the net shape during debinding of the object and a second binder that resists deformation of the net shape during a beginning of a thermal sintering cycle for the object. 6 . The printer of claim 1 wherein the binder system includes at least one polymer.

Assignees

Inventors

Classifications

  • Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

  • by thermal means (control of energy beam parameters for post heating B22F10/364) · CPC title

  • Temperature or temperature gradient, e.g. temperature of the melt pool · CPC title

  • by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP] · CPC title

  • by jetting of binder onto a bed of metal powder · CPC title

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What does patent US2018071825A1 cover?
Support structures are used in certain additive fabrication processes to permit fabrication of a greater range of object geometries. For additive fabrication processes with materials that are subsequently sintered into a final part, a printer is configured to further fabricate an interface layer between the object and the support structure in order to inhibit bonding between adjacent surfaces o…
Who is the assignee on this patent?
Desktop Metal Inc
What technology area does this patent fall under?
Primary CPC classification B22F7/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Mar 15 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).