Solder sealing in high-power laser devices

Patent metadata

Field	Value
Publication number	US-2018069377-A1
Application number	US-201715807824-A
Country	US
Kind code	A1
Filing date	Nov 9, 2017
Priority date	Jan 27, 2015
Publication date	Mar 8, 2018
Grant date	—

Abstract

In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.

First claim

What is claimed is:

1 .- 7 . (canceled)

8 . A method of sealing a laser apparatus, the method comprising:
disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material; depositing a sealing material over at least a portion of the thermal bonding layer and at least a portion of an external surface of the electrode mount; and disposing a beam emitter in direct contact with the thermal bonding layer, wherein at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer.

9 . The method of claim 8 , further comprising, before disposing the beam emitter in direct contact with the thermal bonding layer:
removing a portion of the sealing material to reveal an exposed portion of the thermal bonding layer, wherein the beam emitter is disposed in direct contact with the exposed portion of the thermal bonding layer.

10 . The method of claim 8 , further comprising:
covering a portion of the thermal bonding layer with a masking material before depositing the sealing material; and after depositing the sealing material, removing the masking material before disposing the beam emitter in direct contact with the thermal bonding layer.

11 . The method of claim 8 , wherein depositing the sealing material comprises at least one of electroplating or electroless deposition.

12 . The method of claim 8 , wherein the thermal bonding material comprises indium.

13 . The method of claim 8 , wherein the sealing material comprises at least one of copper, aluminum, nickel, or chromium.

14 . A method of sealing a laser apparatus, the method comprising:
disposing a thermal bonding layer over a surface of an electrode mount, the thermal bonding layer comprising a thermal bonding material; disposing a beam emitter in direct contact with the thermal bonding layer; and thereafter, depositing a sealing material over at least a portion of the thermal bonding layer and at least a portion of an external surface of the electrode mount, wherein at least a portion of the sealing material is positioned to prevent or retard movement of the thermal bonding material out of the thermal bonding layer.

15 . The method of claim 14 , further comprising:
depositing the sealing material over at least a portion of the beam emitter; and removing at least a portion of the sealing material to reveal a portion of the beam emitter.

16 . The method of claim 14 , further comprising:
covering a portion of the beam emitter with a masking material before depositing the sealing material; and removing the masking material after depositing the sealing material.

17 . The method of claim 14 , wherein depositing the sealing material comprises at least one of electroplating or electroless deposition.

18 . The method of claim 14 , wherein the thermal bonding material comprises indium.

19 . The method of claim 14 , wherein the sealing material comprises at least one of copper, aluminum, nickel, or chromium.

20 .- 24 . (canceled)

25 . The method of claim 1 , further comprising disposing a second electrode mount over the beam emitter opposite the electrode mount.

26 . The method of claim 25 , further comprising:
disposing a second thermal bonding layer between the second electrode mount and the beam emitter, the second thermal bonding layer comprising a second thermal bonding material; and positioning a second sealing material to prevent or retard movement of the second thermal bonding material out of the second thermal bonding layer.

27 . The method of claim 1 , wherein the beam emitter comprises a diode bar configured to emit a plurality of discrete beams.

28 . The method of claim 1 , wherein a melting point of the sealing material is higher than a melting point of the thermal bonding material.

29 . The method of claim 14 , further comprising disposing a second electrode mount over the beam emitter opposite the electrode mount.

30 . The method of claim 29 , further comprising:
disposing a second thermal bonding layer between the second electrode mount and the beam emitter, the second thermal bonding layer comprising a second thermal bonding material; and positioning a second sealing material to prevent or retard movement of the second thermal bonding material out of the second thermal bonding layer.

31 . The method of claim 14 , wherein the beam emitter comprises a diode bar configured to emit a plurality of discrete beams.

32 . The method of claim 14 , wherein a melting point of the sealing material is higher than a melting point of the thermal bonding material.

Assignees

• Tayebati Parviz
• Deutsch Michael

Inventors

• Tayebati Parviz
• Deutsch Michael

Classifications

• H01S5/4087 Primary

  emitting more than one wavelength · CPC title

• H01S5/02423

  Liquid cooling, e.g. a liquid cools a mount of the laser · CPC title

• H01S5/142

  which comprises an additional resonator · CPC title

• H01S5/4025

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title

• H01S3/08009

  using a diffraction grating · CPC title