Systems and Methods for Producing Carbon Solids
US-2024417566-A1 · Dec 19, 2024 · US
Conductor and method of manufacturing the same
US2018047478A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018047478-A1 |
| Application number | US-201715792452-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 24, 2017 |
| Priority date | Nov 8, 2012 |
| Publication date | Feb 15, 2018 |
| Grant date | — |
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Abstract
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A conductor includes (i) a substrate, (ii) a transparent conductive film formed on the substrate and including a silver nanowire, (iii) a metal film formed over the transparent conductive film such that at least a portion thereof overlaps the transparent conductive film, and (iv) a buffer film provided between the transparent conductive film and the metal film, the buffer film having adhesion to each of the transparent conductive film and the metal film, and not impeding conductivity between the transparent conductive film and the metal film. Preferably, the buffer film is formed of an organic material having respective functional groups capable of bonding to the transparent conductive film and the metal film.
First claim
Opening claim text (preview).
What is claimed is: 1 . A conductor comprising: a substrate; a transparent conductive film formed on the substrate, the transparent conductive film including a silver nanowire; and a metal film formed over the transparent conductive film such that at least a portion thereof overlaps the transparent conductive film; and a buffer film provided between the transparent conductive film and the metal film, the buffer film having adhesion to each of the transparent conductive film and the metal film, and not impeding conductivity between the transparent conductive film and the metal film. 2 . The conductor according to claim 1 , wherein the buffer film is formed of an organic material having respective functional groups capable of bonding to the transparent conductive film and the metal film. 3 . The conductor according to claim 2 , wherein the organic material is a triazine compound having an alkoxy group and a thiol group, or having an alkoxy group and an azide group. 4 . The conductor according to claim 3 , wherein the triazine compound has a structure shown in Chem. 1 or Chem. 2. 5 . The conductor according to claim 2 , wherein the organic material is treated by a heat treatment. 6 . The conductor according to claim 1 , wherein the metal film is formed of Cu. 7 . A method of manufacturing a conductor, comprising: providing a substrate having a transparent conductive film including a silver nanowire formed thereon; forming a buffer film on at least a portion of the transparent conductive film; and forming a metal film on the buffer film formed on the transparent conductive film, wherein the buffer film having adhesion to each of the transparent conductive film and the metal film, and not impeding conductivity between the transparent conductive film and the metal film. 8 . The method of manufacturing a conductor according to claim 7 , further comprising: performing reverse sputtering on an upper surface of the transparent conductive film, the buffer film being formed on the upper surface. 9 . The method of manufacturing a conductor according to claim 7 , wherein the buffer film is formed of an organic material having respective functional groups capable of bonding to each of the transparent conductive film and the metal film. 10 . The method of manufacturing a conductor according to claim 9 , wherein the organic material is a triazine compound having an alkoxy group and a thiol group, or having an alkoxy group and an azide group. 11 . The method of manufacturing a conductor according to claim 10 , wherein the triazine compound has a structure shown in Chem. 3 or Chem. 4. 12 . The method of manufacturing a conductor according to claim 9 , further comprising: performing a heat treatment on the buffer film.
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- What does patent US2018047478A1 cover?
- A conductor includes (i) a substrate, (ii) a transparent conductive film formed on the substrate and including a silver nanowire, (iii) a metal film formed over the transparent conductive film such that at least a portion thereof overlaps the transparent conductive film, and (iv) a buffer film provided between the transparent conductive film and the metal film, the buffer film having adhesion t…
- Who is the assignee on this patent?
- Alps Electric Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B82Y30/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Feb 15 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).